Abstract: A method for fabricating a semiconductor device includes the steps of forming a barrier conductor layer on a substrate, exposing the barrier conductor layer to a first reducing gas atmosphere at an elevated substrate temperature, forming a metal film on the barrier conductor layer by a CVD process, and exposing the metal film to a second reducing gas atmosphere at an elevated substrate temperature.

Abstract: A method of reducing gated diode leakage in trench capacitor type field plate isolated dynamic random access memory devices is disclosed. Trenches are etched into a face of a body of semiconductor material. Storage nodes surrounding the trenches are created. A polysilicon layer is formed on the trench walls. A storage dielectric layer is formed on the trench walls, adjacent to the layer of polysilicon on the trench walls, so that the layer of polysilicon on the trench walls lies between the storage dielectric layer and the storage node. The layer of polysilicon on the trench walls reduces leakage current from the storage node. A trench type field plate isolated random access memory cell structure is also disclosed.

Abstract: A method is disclosed for preventing formation of undesirable polysilicon word line gate filaments in integrated circuit devices such as VLSI dynamic random access memories employing field plate isolation. Before the word lines are processed, an oxide layer is formed in the field plate openings beneath sidewalls of nitride along the edges of the field plate openings. The oxide layer partially fills an undercut area beneath a dip out of the sidewall of nitride. The dip out of the sidewall of nitride is removed. The removal of the dip out and the partial filling of the undercut area reduces the possibility of polysilicon word line filaments from forming around the edge of the field plate openings in the undercut area when the word lines are later added. A field plate isolated memory device is also disclosed wherein along the edges of the field plate openings, the partially filling oxide layer and the sidewall nitride layer are approximately coincident.

Abstract: By placing boundary cells within areas of discontinuity of a memory array, such as in word line strap areas, stress on edge cells of the memory array is reduced; the reduction of stress improves leakage characteristics and pause-refresh capabilities of edge cells. The boundary cells may further be laid out in the areas of discontinuity with the same pattern as the memory array. Some of the boundary cells may be electrically biased to act as minority carrier sinks. By collecting minority carriers that otherwise may be attracted to edge cells of the memory array, the leakage characteristics of the edge cells and their pause-refresh capabilities are further enhanced. The boundary cells are particularly useful in improving leakage characteristics of dynamic random access memory devices of the trench capacitor type.

Abstract: A method of reducing gated diode leakage in trench capacitor type field plate isolated dynamic random access memory devices is disclosed. Trenches are etched into a face of a body of semiconductor material. Storage nodes surrounding the trenches are created. A polysilicon layer is formed on the trench walls. A storage dielectric layer is formed on the trench walls, adjacent to the layer of polysilicon on the trench walls, so that the layer of polysilicon on the trench walls lies between the storage dielectric layer and the storage node. The layer of polysilicon on the trench walls reduces leakage current from the storage node. A trench type field plate isolated random access memory cell structure is also disclosed.

Abstract: A method of reducing gated diode leakage in trench capacitor type field plate isolated dynamic random access memory devices is disclosed. The storage node of the capacitor is formed by placing a storage node material, such as implanted arsenic, into the trench walls of the device at a first tilt and a second tilt. The angle of the second tilt is preferably larger, higher, than the angle of the first tilt. This higher angle provides the storage node with a larger concentration of doping around the upper portion the trench walls. This larger concentration of doping reduces the charge leaking from the upper portion of the storage node into the substrate of semiconductor material. A trench type storage capacitor for a dynamic random access memory device is also disclosed.

Abstract: The described embodiments of the present invention provide DRAM cells, structures and manufacturing methods. A DRAM cell with a trench capacitor having a first plate formed as a diffusion on the outside surface of a trench formed in the substrate and a second plate having a conductive region formed inside the trench is fabricated. The transfer transistor is formed using a field plate isolation structure which includes a self-aligned moat area for the transfer transistor. The moat area slightly overlaps the capacitor area and allows for increased misalignment tolerance thus foregoing the requirement for misalignment tolerances built into the layout of the DRAM cell. The field plate itself is etched so that it has sloped sidewalls to avoid the formation of conductive filaments from subsequent conductive layers formed on the integrated circuit.

Abstract: The described embodiments of the present invention provide DRAM cells, structures and manufaturing methods. In a first embodiment, a DRAM cell with a trench capacitor having a first plate formed as a diffusion on the outside surface of a trench formed in the substrate and a second plate having a conductive region formed inside the trench is fabricated. The transfer transistor is formed using a field plate isolation structure which includes a self-aligned moat area for the transfer transistor. The moat area slightly overlaps the capacitor area and allows for increased misalignment tolerance thus foregoing the requirement for misalignment tolerances built into the layout of the DRAM cell. The field plate itself is etched so that it has sloped sidewalls to avoid the formation of conductive filaments from subsequent conductive layers formed on the integrated circuit.