Patents by Inventor Giulio DiGiacomo
Giulio DiGiacomo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6678949Abstract: A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.Type: GrantFiled: June 21, 2001Date of Patent: January 20, 2004Assignee: International Business Machines CorporationInventors: Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann, Kimberley A. Kelly, Bouwe W. Leenstra, Voya R. Markovich, Eric D. Perfecto, Sampath Purushothaman, Joseph M. Sullivan
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Patent number: 6656770Abstract: Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. The electronic module cover is a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling.Type: GrantFiled: June 5, 2001Date of Patent: December 2, 2003Assignee: International Business Machines CorporationInventors: Eugene R. Atwood, Joseph A. Benenati, Giulio DiGiacomo, Horatio Quinones
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Patent number: 6373133Abstract: A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.Type: GrantFiled: July 13, 1999Date of Patent: April 16, 2002Assignee: International Business Machines CorporationInventors: Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif, Subhash L. Shinde, David J. Womac, David B. Goland, Lester W. Herron
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Patent number: 6329721Abstract: A solder column structure particularly useful for joining electronic components by C-4 interconnection is provided comprising a solder column attached at one end to one of the substrates being joined and having a layer of indium at the other end. During reflow, to join the other substrate, the indium melts with part of the solder column forming a Pb—Sn—In ternary alloy joint having enhanced fatigue resistance. A method for using the solder column to make electronic component assemblies and electronic component assemblies made using the method and solder column are also provided.Type: GrantFiled: May 15, 2000Date of Patent: December 11, 2001Assignee: International Business Machines CorporationInventor: Giulio DiGiacomo
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Publication number: 20010037565Abstract: A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.Type: ApplicationFiled: June 21, 2001Publication date: November 8, 2001Inventors: Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann, Kimberley A. Kelly, Bouwe W. Leenstra, Voya R. Markovich, Eric D. Perfecto, Sampath Purushothaman, Joseph M. Sullivan
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Publication number: 20010026957Abstract: Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips.Type: ApplicationFiled: June 5, 2001Publication date: October 4, 2001Applicant: International Business Machines CorporationInventors: Eugene R. Atwood, Joseph A. Benenati, Giulio DiGiacomo, Horatio Quinones
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Patent number: 6281573Abstract: Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. A path for high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air is provided by an electronic module cover, configured as a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling.Type: GrantFiled: March 31, 1998Date of Patent: August 28, 2001Assignee: International Business Machines CorporationInventors: Eugene R. Atwood, Joseph A. Benenati, Giulio DiGiacomo, Horatio Quinones
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Patent number: 6281452Abstract: A structure for mounting electronic devices which uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.Type: GrantFiled: December 3, 1998Date of Patent: August 28, 2001Assignee: International Business Machines CorporationInventors: Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann, Kimberley A. Kelly, Bouwe W. Leenstra, Voya R. Markovich, Eric D. Perfecto, Sampath Purushothaman, Joseph M. Sullivan
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Patent number: 6196443Abstract: A solder column structure particularly useful for joining electronic components by C-4 interconnection is provided comprising a solder column attached at one end to one of the substrates being joined and having a layer of indium at the other end. During reflow, to join the other substrate, the indium melts with part of the solder column forming a Pb—Sn—In ternary alloy joint having enhanced fatigue resistance. A method for using the solder column to make electronic component assemblies and electronic component assemblies made using the method and solder column are also provided.Type: GrantFiled: July 16, 1998Date of Patent: March 6, 2001Assignee: International Business Machines CorporationInventor: Giulio DiGiacomo
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Patent number: 6085831Abstract: An apparatus for and method of cooling an electronic module comprising a heat sink enclosure placed directly over a chip or substrate in a flip chip package. The heat sink enclosure has a plurality of cooling fins extending from within the cavity of the enclosure. A liquid sealed inside the enclosure is trapped within a thermal transfer means, preferably a metal wick, which sits directly on a chip or substrate. As the chip or substrate heats up, heat is transferred to the thermal transfer means which in turn heats the liquid to its heat of vaporization. The vapors of the liquid rise and condense on the cooling fins and the heat is absorbed by the enclosure and conducted to an outside surface of the enclosure and dissipated. Cooling fins on an exterior surface of the enclosure further reduces the thermal resistance to enhance cooling.Type: GrantFiled: March 3, 1999Date of Patent: July 11, 2000Assignee: International Business Machines CorporationInventors: Giulio DiGiacomo, Sushumna Iruvanti, David J. Womac
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Patent number: 6025649Abstract: A solder column structure particularly useful for joining electronic components by C-4 interconnection is provided comprising a solder column attached at one end to one of the substrates being joined and having a layer of indium at the other end. During reflow, to join the other substrate, the indium melts with part of the solder column forming a Pb--Sn--In ternary alloy joint having enhanced fatigue resistance. A method for using the solder column to make electronic component assemblies and electronic component assemblies made using the method and solder column are also provided.Type: GrantFiled: July 22, 1997Date of Patent: February 15, 2000Assignee: International Business Machines CorporationInventor: Giulio DiGiacomo
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Patent number: 5981310Abstract: A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.Type: GrantFiled: January 22, 1998Date of Patent: November 9, 1999Assignee: International Business Machines CorporationInventors: Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif, Subhash L. Shinde, David J. Womac, David B. Goland, Lester W. Herron
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Patent number: 5950907Abstract: An enhanced fatigue life solder comprising, by weight, about 1-3% tin, about 1-3% silver and the balance essentially lead is provided. The solder is particularly useful for joining electronic components and in particular for making C-4 interconnections. A method for using the solder to make electronic components and electric components made using the method are also provided.Type: GrantFiled: March 26, 1997Date of Patent: September 14, 1999Assignee: International Business Machines CorporationInventor: Giulio DiGiacomo
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Patent number: 5831336Abstract: An enhanced fatigue life solder comprising, by weight, about 1-3% tin, about 1-3% silver and the balance essentially lead is provided. The solder is particularly useful for joining electronic components and in particular for making C-4 interconnections. A method for using the solder to make electronic components and electric components made using the method are also provided.Type: GrantFiled: July 25, 1996Date of Patent: November 3, 1998Assignee: International Business Machines CorporationInventor: Giulio DiGiacomo
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Patent number: 5539186Abstract: A multi-layer module that has incorporated therein an additional sheet with a heat generating film resistor formed thereon. A temperature responsive controller regulates the film resistor current in order to regulate the temperature at the surface of the module. The invention is applicable to both single chip and multiple chip modules, and for multi-chip modules a plurality of discrete film resistors on a single may be used.Type: GrantFiled: December 9, 1992Date of Patent: July 23, 1996Assignee: International Business Machines CorporationInventors: Anthony J. Abrami, Maurizio Arienzo, Giulio DiGiacomo, Gene J. Gaudenzi, Paul V. McLaughlin
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Patent number: 5442239Abstract: This invention relates generally to structure and method for corrosion- and stress-resistant interconnecting metallurgy, and more specifically to new structures and methods for corrosion- and stress-resistant interconnecting multilayer metallurgical pad comprising sequentially deposited layers of chromium, nickel and noble or relatively noble metal as the interconnecting metallurgy, or multilayer metallurgical pad comprising sequentially deposited layers of chromium, soluble noble metal, nickel and noble or relatively noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.Type: GrantFiled: October 1, 1992Date of Patent: August 15, 1995Assignee: International Business Machines CorporationInventors: Giulio DiGiacomo, Armando S. Cammarano, Nunzio DiPaolo
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Patent number: 5420073Abstract: This invention relates generally to structure and method for preventing metal diffusion between a noble metal layer and an adjoining non-noble metal layer, and more specifically to new structures and methods for providing a superbarrier structure between copper and an adjoining noble metal layer. This is achieved by sequentially deposited a layer of non-noble metal, a layer of titanium, a layer of molybdenum, and a layer of noble or relatively less noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.Type: GrantFiled: February 7, 1994Date of Patent: May 30, 1995Assignee: International Business Machines CorporationInventors: Giulio DiGiacomo, Jung-Ihl Kim, Chandrasekhar Narayan, Sampath Purushothaman
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Patent number: 5367195Abstract: This invention relates generally to structure and method for preventing metal diffusion between a noble metal layer and an adjoining non-noble metal layer, and more specifically to new structures and methods for providing a superbarrier structure between copper and an adjoining noble metal layer. This is achieved by sequentially deposited a layer of non-noble metal, a layer of titanium, a layer of molybdenum, and a layer of noble or relatively less noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.Type: GrantFiled: January 8, 1993Date of Patent: November 22, 1994Assignee: International Business Machines CorporationInventors: Giulio DiGiacomo, Jung-Ihl Kim, Chandrasekhar Narayan, Sampath Purushothaman
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Patent number: 5266522Abstract: This invention relates generally to structure and method for corrosion- and stress-resistant interconnecting metallurgy, and more specifically to new structures and methods for corrosion- and stress-resistant interconnecting multilayer metallurgical pad comprising sequentially deposited layers of chromium, nickel and noble or relatively noble metal as the interconnecting metallurgy, or multilayer metallurgical pad comprising sequentially deposited layers of chromium, soluble noble metal, nickel and noble or relatively noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.Type: GrantFiled: June 5, 1992Date of Patent: November 30, 1993Assignee: International Business Machines CorporationInventors: Giulio DiGiacomo, Armando S. Cammarano, Nunzio DiPaolo
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Patent number: 5192622Abstract: A ternary-alloy/glass composite suitable for use in vias in glass-ceramic electronic structures includes gold, palladium, and either platinum or silver in the alloy where the gold is less than 50% by weight of the alloy. The alloy is combined with glass frit where the glass is present as 5-50% by volume in the composition. The ternary-alloy glass composite is sintered in the glass-ceramic structure and provides a hermetic seal. Chips and pins can be bonded directly to the ternary-alloy/glass composite using a eutectic braze without causing cracks in the glass-ceramic. The ternary-alloy/glass composite has good adhesion with glass-ceramics and is useful in vias in electronic structures.Type: GrantFiled: August 9, 1991Date of Patent: March 9, 1993Assignee: International Business Machines CorporationInventors: Armando S. Cammarano, Giulio DiGiacomo, Nunzio DiPaolo