Abstract: This invention relates generally to structure and method for corrosion- and stress-resistant interconnecting metallurgy, and more specifically to new structures and methods for corrosion- and stress-resistant interconnecting multilayer metallurgical pad comprising sequentially deposited layers of chromium, nickel and noble or relatively noble metal as the interconnecting metallurgy, or multilayer metallurgical pad comprising sequentially deposited layers of chromium, soluble noble metal, nickel and noble or relatively noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.

Abstract: A method of brazing two surfaces together with a Au/Sn brazing solder. The method includes the additional step of providing a film of Cu, for example on one of the surfaces, in addition to the Au/Sn brazing solder.

Abstract: A pin designed to be attached to a solid state module for making connection between the module and other parts of a metallurgical system. The end of the pin that is to be brazed to the module has a sloping (e.g., conical or wedge) shaped head so that gas bubbles can readily escape during brazing, thus reducing voids in the braze.

Abstract: A method for determining the paths of current flow in an irregularly shaped conductor. A metal is plated onto a substrate in the desired geometric pattern. The metal is then brought to within about 4 percent of its melting point and a current is put through it. After an amount of time that depends upon the temperature and current utilized, there will have been a mass migration in the metal resulting in a corrugated surface having ridges and valleys that are parallel to the current flow. The ridges and valleys may be observed optically or by scanning electron microscope.