Abstract: The present invention relates to a mixed saccharide composition containing psicose, glucose and fructose with improved sweetness quality and crystallization, and a method for preventing crystallization of a mixed saccharide composition containing a psicose.

Abstract: The present invention relates to a granular form of mixed saccharide composition comprising a mixed saccharide containing psicose as a main ingredient and a method for preparing the same, and more particularly to a granule of a mixed saccharide containing psicose with improved sweetness quality and physical properties and a method for preparing the same.

Abstract: A chip electronic component may include an internal coil structure for preventing the occurrence of short-circuits between coil patterns and may have a high aspect ratio (AR) by increasing a thickness of the coil with respect to a width of the coil. The chip electronic component may include a magnetic body including an insulating substrate; an internal coil part formed on at least one surface of the insulating substrate; external electrodes formed on at least one end surface of the magnetic body and connected to the internal coil part. Insoluble films may be formed on side portions of coil patterns forming the internal coil part, and the internal coil part may have an aspect ratio of 1.5 or greater.

Abstract: There are provided a multilayer ceramic capacitor, a printed circuit board including the same, a method of manufacturing the multilayer ceramic capacitor, and a method of manufacturing the printed circuit board. The method of manufacturing a multilayer ceramic capacitor includes: preparing a capacitor body on which external electrode material layers are formed, dry polishing the capacitor body such that surfaces of the external electrode material layers are smooth and compact, and forming plating layers on the surfaces of the external electrode material layers in order to form external electrodes. Therefore, the surface smoothness, compactness, and uniformity of an external electrode plating layer can be improved.