Patents by Inventor Go Takeda

Go Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230399264
    Abstract: One aspect of the present disclosure provides a boron nitride powder containing agglomerated particles formed by agglomeration of primary particles of hexagonal boron nitride, in which a degree of purity is 98.5% by mass or more, and a number of particles containing carbon is 10 or less per 10 g of the boron nitride powder.
    Type: Application
    Filed: September 27, 2021
    Publication date: December 14, 2023
    Applicant: Denka Company Limited
    Inventors: Go TAKEDA, Hiroyuki SHIOTSUKI, Takaaki TANAKA
  • Publication number: 20230357008
    Abstract: One aspect of the present disclosure provides a boron nitride powder containing agglomerated particles formed by agglomeration of primary particles of hexagonal boron nitride, in which a degree of purity is 98.5% by mass or more, and a concentration of elutable impurities is 700 ppm or less.
    Type: Application
    Filed: September 27, 2021
    Publication date: November 9, 2023
    Applicant: Denka Company Limited
    Inventors: Go TAKEDA, Hiroyuki SHIOTSUKI, Takaaki TANAKA
  • Publication number: 20230357007
    Abstract: One aspect of the present disclosure provides a boron nitride powder containing agglomerated particles formed by agglomeration of primary particles of hexagonal boron nitride, in which a degree of purity is 98.5% by mass or more, and a number of particles having a magnetizing ability is 10 or less per 10 g of the boron nitride powder.
    Type: Application
    Filed: September 27, 2021
    Publication date: November 9, 2023
    Applicant: Denka Company Limited
    Inventors: Go TAKEDA, Hiroyuki SHIOTSUKI, Takaaki TANAKA
  • Patent number: 11732173
    Abstract: A surface-treated aggregated boron nitride powder is prepared by using the boron nitride powder as the raw material, adding an oxidizer to the boron nitride aggregated grains, wet-pulverizing or wet-crushing the grains for surface modification treatment of the particles and allowing reaction of the particles with a metal coupling agent. The surface-treated boron nitride aggregated grains are formed by aggregation of hexagonal h-BN primary particles; (B) have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (C) have a crushing strength of 5 MPa or more; and (D) have an average particle diameter of 20 ?m or more and 100 ?m or less.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: August 22, 2023
    Assignee: DENKA COMPANY LIMITED
    Inventors: Go Takeda, Yoshitaka Taniguchi
  • Publication number: 20220402759
    Abstract: One aspect of the present disclosure provides a hexagonal boron nitride powder having a purity of 98 mass % or more and a specific surface area of less than 2.0 m2/g.
    Type: Application
    Filed: November 12, 2020
    Publication date: December 22, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Go TAKEDA, Masao TSUICHIHARA, Takaaki TANAKA
  • Publication number: 20220388845
    Abstract: One aspect of the present invention provides a boron nitride powder that contains aggregated particles formed through aggregation of primary particles of boron nitride. The cumulative pore volume of the boron nitride powder within a fine pore radius of 0.02-1.2 ?m as measured by a mercury porosimeter is 0.65 mL/g or less.
    Type: Application
    Filed: October 21, 2020
    Publication date: December 8, 2022
    Applicant: Denka Company Limited
    Inventors: Go TAKEDA, Haruka TAKEOKA, Takaaki TANAKA
  • Publication number: 20220204830
    Abstract: Provided is a boron nitride powder including: an agglomerated particle obtained by aggregating flaky primary particles, in which in-plane directions of the primary particles are oriented in a direction parallel to a short-side direction of the agglomerated particle. In addition, provided is a method for producing a boron nitride powder including: a nitriding step of firing a boron carbide powder having an aspect ratio of 1.5 to 10 in a nitrogen pressurized atmosphere to obtain a fired product; and a crystallization step of heating a formulation that contains the fired product and a boron source to produce flaky boron nitride primary particles and obtaining a boron nitride powder containing an agglomerated particle obtained by aggregating the primary particles.
    Type: Application
    Filed: March 25, 2020
    Publication date: June 30, 2022
    Applicant: Denka Company Limited
    Inventors: Go TAKEDA, Takaaki TANAKA
  • Publication number: 20220153583
    Abstract: The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, including a spacer type coupling agent. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member produced by mixing with a resin, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.
    Type: Application
    Filed: March 25, 2020
    Publication date: May 19, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Go TAKEDA, Takaaki TANAKA
  • Publication number: 20220154059
    Abstract: The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, having a specific surface area measured by the BET method of 2 to 6 m2/g and a crushing strength of 5 MPa or more. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member and can improve the insulation breakdown characteristics and the thermal conductivity of a heat dissipation member, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.
    Type: Application
    Filed: March 25, 2020
    Publication date: May 19, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Go TAKEDA, Takaaki TANAKA
  • Publication number: 20220154060
    Abstract: A surface-treated aggregated boron nitride powder is prepared by using the boron nitride powder as the raw material, adding an oxidizer to the boron nitride aggregated grains, wet-pulverizing or wet-crushing the grains for surface modification treatment of the particles and allowing reaction of the particles with a metal coupling agent. The surface-treated boron nitride aggregated grains are formed by aggregation of hexagonal h-BN primary particles; (B) have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (C) have a crushing strength of 5 MPa or more; and (D) have an average particle diameter of 20 ?m or more and 100 ?m or less.
    Type: Application
    Filed: January 31, 2022
    Publication date: May 19, 2022
    Inventors: Go TAKEDA, Yoshitaka TANIGUCHI
  • Patent number: 11268004
    Abstract: A boron nitride powder includes boron nitride aggregated grains that are formed by aggregation of scaly hexagonal boron nitride primary particles, the boron nitride powder having the following characteristic properties (A) to (C): (A) the primary particles of the scaly hexagonal boron nitride have an average long side length of 1.5 ?m or more and 3.5 ?m or less and a standard deviation of 1.2 ?m or less; (B) the boron nitride aggregated grains have a grain strength of 8.0 MPa or more at a cumulative breakdown rate of 63.2% and a grain strength of 4.5 MPa or more at a cumulative breakdown rate of 20.0%; and (C) the boron nitride powder has an average particle diameter of 20 ?m or more and 100 ?m or less. Also provided are a method for producing the same and a thermally conductive resin composition including the same.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: March 8, 2022
    Assignee: DENKA COMPANY LIMITED
    Inventors: Go Takeda, Yoshitaka Taniguchi
  • Publication number: 20210261413
    Abstract: An aspect of the present disclosure provides aggregate boron nitride particles in which primary hexagonal boron nitride particles are aggregated, wherein an average value of an area proportion of the primary particles in a cross section is 45% or more, a standard deviation of the area proportion of the primary particles in a cross section is less than 25, and a crushing strength is 8.0 MPa or more.
    Type: Application
    Filed: June 27, 2019
    Publication date: August 26, 2021
    Applicant: DENKA COMPANY LIMITED
    Inventors: Go TAKEDA, Yoshitaka TANIGUCHI
  • Publication number: 20210163288
    Abstract: A hexagonal boron powder having a purity of 98% by mass or more and a specific surface area of less than 2.0 m2/g.
    Type: Application
    Filed: August 6, 2019
    Publication date: June 3, 2021
    Applicant: DENKA COMPANY LIMITED
    Inventors: Go TAKEDA, Masao TSUICHIHARA, Yoshitaka TANIGUCHI
  • Patent number: 10752503
    Abstract: The present invention provides a spherical boron nitride fine powder and the other superior in filling property into resin. The present invention relates to a spherical boron nitride fine powder having the following characteristics (A) to (C): (A) the spherical boron nitride fine particles have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (B) the spherical boron nitride fine powder has an average particle diameter of 0.05 ?m or more and 1 ?m or less; and (C) the spherical boron nitride fine powder has an average circularity of 0.8 or more.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: August 25, 2020
    Assignee: DENKA COMPANY LIMITED
    Inventors: Go Takeda, Yoshitaka Taniguchi, Takemi Oguma
  • Publication number: 20200247672
    Abstract: To provide a boron nitride powder having excellent heat conductivity and high particle strength. Provided is a boron nitride powder which comprises bulky boron nitride formed such that scaly primary particles of hexagonal boron nitride are aggregated to form bulky particles, and which has the following characteristics (A) to (C): (A) a particle strength of the bulky particles at a cumulative breakdown rate of 63.2% is 5.0 MPa or more; (B) an average particle size of the boron nitride powder is 2 ?m or more and 20 ?m or less; and (C) an orientation index of the boron nitride powder as determined from X-ray diffraction is 20 or less.
    Type: Application
    Filed: August 17, 2018
    Publication date: August 6, 2020
    Applicant: DENKA COMPANY LIMITED
    Inventors: Go TAKEDA, Michiharu NAKASHIMA, Yoshitaka TANIGUCHI
  • Publication number: 20200048091
    Abstract: The present invention provides a spherical boron nitride fine powder and the other superior in filling property into resin. The present invention relates to a spherical boron nitride fine powder having the following characteristics (A) to (C): (A) the spherical boron nitride fine particles have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (B) the spherical boron nitride fine powder has an average particle diameter of 0.05 ?m or more and 1 ?m or less; and (C) the spherical boron nitride fine powder has an average circularity of 0.8 or more.
    Type: Application
    Filed: August 31, 2017
    Publication date: February 13, 2020
    Inventors: Go TAKEDA, Yoshitaka TANIGUCHI, Takemi OGUMA
  • Publication number: 20200040245
    Abstract: A boron nitride powder includes boron nitride aggregated grains that are formed by aggregation of scaly hexagonal boron nitride primary particles, the boron nitride powder having the following characteristic properties (A) to (C): (A) the primary particles of the scaly hexagonal boron nitride have an average long side length of 1.5 ?m or more and 3.5 ?m or less and a standard deviation of 1.2 ?m or less; (B) the boron nitride aggregated grains have a grain strength of 8.0 MPa or more at a cumulative breakdown rate of 63.2% and a grain strength of 4.5 MPa or more at a cumulative breakdown rate of 20.0%; and (C) the boron nitride powder has an average particle diameter of 20 ?m or more and 100 ?m or less. Also provided are a method for producing the same and a thermally conductive resin composition including the same.
    Type: Application
    Filed: August 31, 2017
    Publication date: February 6, 2020
    Inventors: Go TAKEDA, Yoshitaka TANIGUCHI
  • Publication number: 20180230012
    Abstract: A method of producing a spherical boron nitride fine particle includes reacting ammonia with an alkoxide borate at an ammonia/alkoxide borate molar ratio of 1 to 10 in an inert gas stream at 750° C. or higher within 30 seconds, then applying heat treatment to a reaction product in an atmosphere of ammonia gas or a mixed gas of ammonia gas and an inert gas at 1,000 to 1,600° C. for at least 1 hour, and further firing the reaction product in an inert gas atmosphere at 1,800 to 2,200° C. for at least 0.5 hour.
    Type: Application
    Filed: April 17, 2018
    Publication date: August 16, 2018
    Inventors: Fumihiro KUROKAWA, Seitaro KOBAYASHI, Takashi KAWASAKI, Go TAKEDA, Yoshio BANDO, Dmitri GOLBERG
  • Publication number: 20180230352
    Abstract: A heat dissipation member having excellent thermal conductivity and dielectric breakdown characteristics is able to be achieved by using a thermally conductive resin composition according to the present invention. A thermally conductive resin composition which is characterized in that: the blending ratio of a spherical boron nitride fine powder having an average particle diameter of 0.05-1.0 ?m, an average circularity of 0.80 or more and a purity of boron nitride of 96% by mass or more to a boron nitride coarse powder having an average particle diameter of 20-85 ?m and a graphitization index of 1.5-4.0 is from 5:95 to 40:60 in terms of volume ratio; and the total content of the spherical boron nitride fine powder and the boron nitride coarse powder in the resin composition is 40-85% by volume. A heat dissipation sheet which uses this thermally conductive resin composition. A heat dissipation member for electronic components, which uses this thermally conductive resin composition.
    Type: Application
    Filed: August 25, 2016
    Publication date: August 16, 2018
    Inventor: Go TAKEDA
  • Patent number: 10017386
    Abstract: A spherical boron nitride fine particle suited for use as a highly thermoconductive filler or the like has an average particle diameter of 0.01 to 1.0 ?m, an orientation index of 1 to 15, a boron nitride purity of 98.0% by mass or greater, and an average circularity of 0.80 or greater. A method of producing a spherical boron nitride fine particle includes reacting ammonia with an alkoxide borate at an ammonia/alkoxide borate molar ratio of 1 to 10 in an inert gas stream at 750° C. or higher within 30 seconds, then applying heat treatment to a reaction product in an atmosphere of ammonia gas or a mixed gas of ammonia gas and an inert gas at 1,000 to 1,600° C. for at least 1 hour, and further firing the reaction product in an inert gas atmosphere at 1,800 to 2,200° C. for at least 0.5 hour.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: July 10, 2018
    Assignees: DENKA COMPANY LIMITED, NATIONAL INSTITUTE FOR MATERIALS SCIENCE
    Inventors: Fumihiro Kurokawa, Seitaro Kobayashi, Takashi Kawasaki, Go Takeda, Yoshio Bando, Dmitri Golberg