Patents by Inventor Gopalakrishna B. Prabhu
Gopalakrishna B. Prabhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11768984Abstract: A method includes receiving measurement data from multiple sensors positioned along a delivery line that delivers a liquid as a gas to one of a gas panel or a processing chamber; simulating, using a computer-generated model, one or more process parameters associated with the delivery line and a plurality of heater jackets positioned around the delivery line; comparing the measurement data with values of the one or more process parameters; and determining, based on at least a threshold deviation between the measurement data and the values of the one or more process parameters, that a fault exists that is associated with maintaining temperature within the delivery line consistent with a gaseous state of the liquid.Type: GrantFiled: September 22, 2020Date of Patent: September 26, 2023Assignee: Applied Materials, Inc.Inventors: Ala Moradian, James Omer L'Heureux, Shuran Sheng, Rohit Mahakali, Karthik Ramanathan, Lin Zhang, Umesh Madhav Kelkar, Gopalakrishna B. Prabhu, Zheng Yuan, Jeonghoon Oh
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Publication number: 20230011748Abstract: Implementations disclosed describe, among other things, a system and a method of scanning a substrate with a beam of light and detecting for each of a set of locations of the substrate, a respective one of a set of intensity values associated with a beam of light reflected from (or transmitted through) the substrate. The detected intensity values are used to determine a profile of a thickness of the substrate.Type: ApplicationFiled: July 8, 2022Publication date: January 12, 2023Inventors: Mehdi Vaez-Iravani, Todd J. Egan, Gopalakrishna B. Prabhu
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Publication number: 20220092241Abstract: A method includes receiving measurement data from multiple sensors positioned along a delivery line that delivers a liquid as a gas to one of a gas panel or a processing chamber; simulating, using a computer-generated model, one or more process parameters associated with the delivery line and a plurality of heater jackets positioned around the delivery line; comparing the measurement data with values of the one or more process parameters; and determining, based on at least a threshold deviation between the measurement data and the values of the one or more process parameters, that a fault exists that is associated with maintaining temperature within the delivery line consistent with a gaseous state of the liquid.Type: ApplicationFiled: September 22, 2020Publication date: March 24, 2022Inventors: Ala Moradian, James Omer L'Heureux, Shuran Sheng, Rohit Mahakali, Karthik Ramanathan, Lin Zhang, Umesh Madhav Kelkar, Gopalakrishna B. Prabhu, Zheng Yuan, Jeonghoon Oh
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Publication number: 20140237905Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.Type: ApplicationFiled: May 5, 2014Publication date: August 28, 2014Applicant: Applied Materials, Inc.Inventors: Benjamin A. Bonner, Gopalakrishna B. Prabhu, Erik S. Rondum, Gregory E. Menk, Anand N. Iyer, Peter McReynolds, Garlen C. Leung
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Patent number: 8694145Abstract: A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d) calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model can information about the tool state to improve the model quality. The method can be used to provide feedback to a plurality of platen stations.Type: GrantFiled: November 8, 2011Date of Patent: April 8, 2014Assignee: Applied Materials, Inc.Inventors: Arulkumar P. Shanmugasundram, Alexander T. Schwarm, Gopalakrishna B. Prabhu
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Patent number: 8388412Abstract: Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.Type: GrantFiled: October 7, 2011Date of Patent: March 5, 2013Assignee: Applied Materials, Inc.Inventors: Gopalakrishna B. Prabhu, Yin Yuan, Jeonghoon Oh, Gregory E. Menk
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Patent number: 8231431Abstract: The present invention generally relates to an edge deletion module positioned within an automated solar cell fabrication line. The edge deletion module may include a grinding wheel device for removing material from edge regions of a solar cell device and cleaning the edge regions of the solar cell device after removing the material. The edge deletion module may also include an abrasive element, a portion of which is ground as it is periodically, laterally advanced toward the grinding wheel device. A controller is provided for controlling the operation and function of various facets of the module.Type: GrantFiled: January 23, 2009Date of Patent: July 31, 2012Assignee: Applied Materials, Inc.Inventors: Dhruv Gajaria, Zhiyong Li, Gopalakrishna B. Prabhu, Yacov Elgar, John Visitacion, Yong Liu, Jeffrey S. Sullivan, Salvador Umotoy, Tai T. Ngo, Michael Marriott, Peter Crundwell, Vinay Shah, Ho Gene Choi, Dennis C. Pierce
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Publication number: 20120053721Abstract: A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d) calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model can information about the tool state to improve the model quality. The method can be used to provide feedback to a plurality of platen stations.Type: ApplicationFiled: November 8, 2011Publication date: March 1, 2012Inventors: Arulkumar P. Shanmugasundram, Alexander T. Schwarm, Gopalakrishna B. Prabhu
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Publication number: 20120028548Abstract: Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.Type: ApplicationFiled: October 7, 2011Publication date: February 2, 2012Inventors: Gopalakrishna B. Prabhu, Yin Yuan, Jeonghoon Oh, Gregory E. Menk
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Publication number: 20120021671Abstract: A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, a method for monitoring at least one surface of a retaining ring coupled to a carrier head is provided. The method includes moving the carrier head adjacent a sensor device disposed in a polishing module, transmitting energy from the sensor device toward the retaining ring, receiving energy reflected from the retaining ring, and determining a condition of the retaining ring based on the received energy.Type: ApplicationFiled: July 26, 2010Publication date: January 26, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Peter McReynolds, Eric S. Rondum, Garlen C. Leung, Adam H. Zhong, Gregory E. Menk, Gopalakrishna B. Prabhu, Thomas H. Osterheld
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Patent number: 8070909Abstract: A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d) calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model can information about the tool state to improve the model quality. The method can be used to provide feedback to a plurality of platen stations.Type: GrantFiled: December 27, 2006Date of Patent: December 6, 2011Assignee: Applied Materials, Inc.Inventors: Arulkumar P. Shanmugasundram, Alexander T. Schwarm, Gopalakrishna B. Prabhu
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Patent number: 8033895Abstract: Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.Type: GrantFiled: July 19, 2007Date of Patent: October 11, 2011Assignee: Applied Materials, Inc.Inventors: Gopalakrishna B. Prabhu, Yin Yuan, Jeonghoon Oh, Gregory E. Menk
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Patent number: 7908743Abstract: Embodiments of the present invention provide a method of forming an electrical connection on a device. In one embodiment, the electrical connection is attached to the device via an adhesive having electrically conductive particles disposed therein. In one embodiment, the adhesive is cured while applying pressure such that the conductive particles align, have a reduced particle-to-particle spacing, or come into contact with each other to provide a more directly conductive (less resistive) path between the electrical connection and the device. In one embodiment of the present invention, a method for forming an electrical lead on a partially formed solar cell during formation of the solar cell device is provided.Type: GrantFiled: April 27, 2009Date of Patent: March 22, 2011Assignee: Applied Materials, Inc.Inventors: Zhiyong Li, Chuck Luu, Gopalakrishna B. Prabhu, Danny Cam Toan Lu, Garry Kwong, David Tanner
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Patent number: 7841925Abstract: A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.Type: GrantFiled: June 19, 2009Date of Patent: November 30, 2010Assignee: Applied Materials, Inc.Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung
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Publication number: 20100112919Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.Type: ApplicationFiled: November 3, 2008Publication date: May 6, 2010Inventors: Benjamin A. Bonner, Gopalakrishna B. Prabhu, Erik S. Rondum, Gregory E. Menk, Anand N. Iyer, Peter McReynolds, Garlen C. Leung
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Publication number: 20090277006Abstract: Embodiments of the present invention provide a method of forming an electrical connection on a device. In one embodiment, the electrical connection is attached to the device via an adhesive having electrically conductive particles disposed therein. In one embodiment, the adhesive is cured while applying pressure such that the conductive particles align, have a reduced particle-to-particle spacing, or come into contact with each other to provide a more directly conductive (less resistive) path between the electrical connection and the device. In one embodiment of the present invention, a method for forming an electrical lead on a partially formed solar cell during formation of the solar cell device is provided.Type: ApplicationFiled: April 27, 2009Publication date: November 12, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Zhiyong Li, Chuck Luu, Gopalakrishna B. Prabhu, Danny Cam Toan Lu, Garry Kwong, David Tanner
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Patent number: 7601050Abstract: A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.Type: GrantFiled: February 15, 2007Date of Patent: October 13, 2009Assignee: Applied Materials, Inc.Inventors: Steven M. Zuniga, Peter McReynolds, Erik S. Rondum, Benjamin A. Bonner, Henry H. Au, Gregory E. Menk, Gopalakrishna B. Prabhu, Anand N. Iyer, Garlen C. Leung
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Publication number: 20090253358Abstract: A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.Type: ApplicationFiled: June 19, 2009Publication date: October 8, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung
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Publication number: 20090221217Abstract: The present invention generally relates to an edge deletion module positioned within an automated solar cell fabrication line. The edge deletion module may include a grinding wheel device for removing material from edge regions of a solar cell device and cleaning the edge regions of the solar cell device after removing the material. The edge deletion module may also include an abrasive element, a portion of which is ground as it is periodically, laterally advanced toward the grinding wheel device. A controller is provided for controlling the operation and function of various facets of the module.Type: ApplicationFiled: January 23, 2009Publication date: September 3, 2009Applicant: APPLIED MATERIALS, INC.Inventors: DHRUV GAJARIA, Zhiyong Li, Gopalakrishna B. Prabhu, Yacov Elgar, John Visitacion, Yong Liu, Jeffrey S. Sullivan, Salvador Umotoy, Tai T. Ngo, Michael Marriott, Peter Crundwell, Vinay Shah, Ho Gene Choi, Dennis C. Pierce
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Patent number: 7553214Abstract: A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.Type: GrantFiled: February 15, 2007Date of Patent: June 30, 2009Assignee: Applied Materials, Inc.Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung