Patents by Inventor Gopalakrishna B. Prabhu
Gopalakrishna B. Prabhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20090088051Abstract: A polishing article includes an elongated substantially rectangular central portion and a substantially rectangular edge portion. The central portion includes a polishing layer with a polishing surface. The central portion has a width, a length greater than the width and defining a longitudinal axis, and an edge. The edge portion extends from the edge of the central portion, the edge portion is thinner than the central portion, and the polishing layer does not extend onto the edge portion.Type: ApplicationFiled: September 26, 2008Publication date: April 2, 2009Inventors: Gregory E. Menk, Peter McReynolds, Benjamin A. Bonner, Erik S. Rondum, Gopalakrishna B. Prabhu
-
Publication number: 20090021024Abstract: Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.Type: ApplicationFiled: July 19, 2007Publication date: January 22, 2009Inventors: Gopalakrishna B. Prabhu, Yin Yuan, Jeonghoon Oh, Gregory E. Menk
-
Patent number: 7429210Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.Type: GrantFiled: January 23, 2007Date of Patent: September 30, 2008Assignee: Applied Materials, Inc.Inventors: Benjamin A. Bonner, Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum, Robert L. Jackson, Garlen Leung
-
Publication number: 20080182413Abstract: Methods and compositions for planarizing a substrate surface with selective removal rates and low dishing are provided. One embodiment provides a method for selectively removing a dielectric disposed on a substrate having at least a first and a second dielectric material disposed thereon. The method generally includes positioning the substrate in proximity with a fixed abrasive polishing pad, dispensing an abrasive free polishing composition having at least one organic compound and a surfactant therein between the substrate and the polishing pad, and selectively polishing the second dielectric material relative to the first dielectric material.Type: ApplicationFiled: August 15, 2007Publication date: July 31, 2008Inventors: GREGORY E. MENK, Robert L. Jackson, Garlen C. Leung, Gopalakrishna B. Prabhu, Peter McReynolds, Anand N. Iyer
-
Patent number: 7179159Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.Type: GrantFiled: May 2, 2005Date of Patent: February 20, 2007Assignee: Applied Materials, Inc.Inventors: Benjamin A. Bonner, Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum, Robert L. Jackson, Garlen Leung
-
Patent number: 7160739Abstract: A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d)calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model can information about the tool state to improve the model quality. The method can be used to provide feedback to a plurality of platen stations.Type: GrantFiled: August 31, 2001Date of Patent: January 9, 2007Assignee: Applied Materials, Inc.Inventors: Arulkumar P. Shanmugasundram, Alexander T. Schwarm, Gopalakrishna B. Prabhu
-
Patent number: 7063597Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal topographical defect formation during a polishing process for dielectric materials. In one aspect a method is provided for polishing a substrate containing two or more dielectric layers, such as silicon oxide, silicon nitride, silicon oxynitride, with at least one processing step using a fixed-abrasive polishing article as a polishing article. The processing steps may be used to remove all, substantially all, or a portion of the one or more dielectric layers, which may include removal of the topography, the bulk dielectric, or residual dielectric material of a dielectric layer in two or more steps.Type: GrantFiled: October 24, 2003Date of Patent: June 20, 2006Assignee: Applied MaterialsInventors: Gopalakrishna B. Prabhu, Thomas H. Osterheld, Garlen C. Leung, Adam H. Zhong, Peter McReynolds, Yi-Yung Tao, Gregory E. Menk, Vasanth N. Mohan, Christopher Heung-Gyun Lee
-
Patent number: 7040966Abstract: A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid being subjected to carbonation prior to being dispensed to the polishing pad, and polishing the substrate. The polishing system generally includes a polishing platen having a polishing pad disposed thereon and in proximity to the substrate, a controller configured to cause the polishing pad to contact the substrate, and a polishing fluid delivery system to deliver a polishing fluid to the polishing pad, the polishing fluid delivery system including a carbonation system.Type: GrantFiled: April 16, 2004Date of Patent: May 9, 2006Assignees: Applied Materials, International Business Machine CorporationInventors: Joseph F. Salfelder, Wayne Swart, Gopalakrishna B. Prabhu, Srinivas R. Mirmira, Laertis Economikos, Fen Fen Jamin, Donald J. Delehanty, Daniel Heenan, Joseph M. Danza
-
Publication number: 20040142640Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal topographical defect formation during a polishing process for dielectric materials. In one aspect a method is provided for polishing a substrate containing two or more dielectric layers, such as silicon oxide, silicon nitride, silicon oxynitride, with at least one processing step using a fixed-abrasive polishing article as a polishing article. The processing steps may be used to remove all, substantially all, or a portion of the one or more dielectric layers, which may include removal of the topography, the bulk dielectric, or residual dielectric material of a dielectric layer in two or more steps.Type: ApplicationFiled: October 24, 2003Publication date: July 22, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Gopalakrishna B. Prabhu, Thomas H. Osterheld, Garlen C. Leung, Adam H. Zhong, Peter McReynolds, Yi-Yung Tao, Gregory E. Menk, Vasanth N. Mohan, Christopher Heung-Gyun Lee
-
Publication number: 20040072518Abstract: A platen having a patterned upper surface for supporting a polishing material in a chemical mechanical polishing system is provided. In one embodiment, a platen for supporting a polishing material in a chemical mechanical polishing system includes a body adapted to support a polishing material during processing and having a substantially rigid non-planar upper support surface for supporting the polishing material during polishing.Type: ApplicationFiled: October 7, 2003Publication date: April 15, 2004Applicant: Applied Materials, Inc.Inventors: Gopalakrishna B. Prabhu, Erik S. Rondum, Peter McReynolds, Thomas H. Osterheld, Garlen C. Leung, Jack Arluck, Adam H. Zhong, Gregory E. Menk
-
Publication number: 20040053566Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: ApplicationFiled: July 15, 2003Publication date: March 18, 2004Applicant: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
-
Patent number: 6677239Abstract: Methods and apparatus are provided for planarizing substrate surfaces with selective removal rates and low dishing. One aspect of the method provides for processing a substrate including providing a substrate to a polishing platen having polishing media disposed thereon, providing an abrasive free polishing composition comprising one or more surfactants to the substrate surface to modify the removal rates of the at least the first dielectric material and the second dielectric material, polishing the substrate surface, and removing the second material at a higher removal rate than the first material from a substrate surface. One aspect of the apparatus provides a system for processing substrates including a platen adapted for polishing the substrate with polishing media and a computer based controller configured to perform one aspect of the method.Type: GrantFiled: August 24, 2001Date of Patent: January 13, 2004Assignee: Applied Materials Inc.Inventors: Wei-Yung Hsu, Gopalakrishna B. Prabhu, Lizhong Sun, Daniel A. Carl
-
Patent number: 6592438Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: GrantFiled: January 12, 2001Date of Patent: July 15, 2003Assignee: Applied Materials Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
-
Patent number: 6575825Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.Type: GrantFiled: January 12, 2001Date of Patent: June 10, 2003Assignee: Applied Materials Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen
-
Patent number: 6558236Abstract: Generally, a method and apparatus for polishing a substrate is provided. In one embodiment, an apparatus for polishing a substrate includes a polishing material having a fluid disposed thereon. The polishing material has a plurality of elements extending from a backing. The fluid that fills the entire volume between the elements comprising the polishing material has a viscosity between about 100 to about 10,000 centipoises. The fluid allows generation of a hydrostatic force that ensures the full and completed envelopment of fluid surrounding the fixed abrasive elements when polishing, thus substantially reducing the deformation of the elements, resulting in extended polishing material life.Type: GrantFiled: June 26, 2001Date of Patent: May 6, 2003Assignee: Applied Materials, Inc.Inventors: Timothy James Donohue, Declan Liam Brett, Gopalakrishna B. Prabhu, Winston Y. Su
-
Publication number: 20030040182Abstract: Methods and apparatus are provided for planarizing substrate surfaces with selective removal rates and low dishing. One aspect of the method provides for processing a substrate including providing a substrate to a polishing platen having polishing media disposed thereon, providing an abrasive free polishing composition comprising one or more surfactants to the substrate surface to modify the removal rates of the at least the first dielectric material and the second dielectric material, polishing the substrate surface, and removing the second material at a higher removal rate than the first material from a substrate surface. One aspect of the apparatus provides a system for processing substrates including a platen adapted for polishing the substrate with polishing media and a computer based controller configured to perform one aspect of the method.Type: ApplicationFiled: August 24, 2001Publication date: February 27, 2003Applicant: APPLIED MATERIALS, INC.Inventors: Wei-Yung Hsu, Gopalakrishna B. Prabhu, Lizhong Sun, Daniel A. Carl
-
Publication number: 20030013384Abstract: Generally, a method and apparatus for polishing a substrate is provided. In one embodiment, an apparatus for polishing a substrate includes a polishing material having a fluid disposed thereon. The polishing material has a plurality of elements extending from a backing. The fluid that fills the entire volume between the elements comprising the polishing material has a viscosity between about 100 to about 10,000 centipoises. The fluid allows generation of a hydrostatic force that ensures the full and completed envelopment of fluid surrounding the fixed abrasive elements when polishing, thus substantially reducing the deformation of the elements, resulting in extended polishing material life.Type: ApplicationFiled: June 26, 2001Publication date: January 16, 2003Applicant: Applied Materials, Inc.Inventors: Timothy James Donohue, Declan Liam Brett, Gopalakrishna B. Prabhu, Winston Y. Su
-
Publication number: 20020197745Abstract: A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d)calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model can information about the tool state to improve the model quality. The method can be used to provide feedback to a plurality of platen stations.Type: ApplicationFiled: August 31, 2001Publication date: December 26, 2002Inventors: Arulkumar P. Shanmugasundram, Alexander T. Schwarm, Gopalakrishna B. Prabhu
-
Patent number: 6361420Abstract: A carrier head, particularly suited for chemical mechanical polishing of a flatted substrate, includes a flexible membrane and an edge load ring. A lower surface of the flexible membrane provides a receiving surface for a center portion of the substrate, whereas a lower surface of the edge load ring provides a receiving surface for a perimeter portion of the substrate. A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.Type: GrantFiled: February 8, 2000Date of Patent: March 26, 2002Assignee: Applied Materials, Inc.Inventors: Steven Zuniga, Hung Chen, Gopalakrishna B. Prabhu
-
Publication number: 20010008830Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.Type: ApplicationFiled: January 12, 2001Publication date: July 19, 2001Applicant: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen