Abstract: By using a controlled arc-heated gas flow, material may be milled away from a substrate. By controlling the size of a gas flow aperture as well as other variables such as gas flow and arc current, small holes can be drilled into the substrate. Typically, these holes would have a diameter between 0.025 mm and 0.125 mm.In one embodiment, an arc made between an anode and cathode is placed above the work. A gas vortex is produced and is caused to pass through the arc, with the holes being drilled by the heated high-energy gas. Alternatively, the work may be used as the anode, with the gas flow carrying away material heated at the arc attachment point of the anode.The use of the arc-generated plasma gas vortex is particularly advantageous in the milling of multi-layer circuit boards.

Abstract: A plasma arc discharge method for deposition of metallic and semiconductor layers on a substrate for the purpose of producing semiconductor grade materials such as silicon at a reduced cost. Magnetic fields are used so that silicon ions and electrons can be directed toward a target area where they are deposited. The ions and electrons are preferably injected as a compound in gaseous of liquid form but may also be injected in liquid elemental form or vaporized from a thermionic cathode. The magnetic fields include an accelerating magnetic field and a focusing magnetic field. The accelerating magnetic field is adjusted to support a desired high ion flux rate and the focusing magnet can control the plasma beam direction and divergence.The silicon provided in a compound form or in the form of metallurigical silicon is purified during the deposition process by a carrier substance which may be a part of the compound or separately injected.

Abstract: A plasma arc discharge method for deposition of metallic and semiconductor layers on a substrate for the purpose of producing semiconductor grade materials such as silicon at a reduced cost is disclosed. Magnetic fields are used so that silicon ions and electrons can be directed toward a target area where they are deposited. The ions and electrons are preferably injected as a compound in gaseous or liquid form but may also be injected in liquid elemental form or vaporized from a thermionic cathode. The magnetic fields include an accelerating magnetic field and a focusing magnetic field. The accelerating magnetic field is adjusted to support a desired high ion flux rate and the focusing magnet can control the plasma beam direction and divergence.The silicon provided in a compound form or in the form of metallurigical silicon is purified during the deposition process by a carrier substance which may be a part of the compound or separately injected.

Abstract: Method and apparatus for micro-arc brazing and welding of metal to metal or ceramic. The control of arc heat flux density is accomplished by controlling the ambient gas pressure and providing an argon, argon/5% hydrogen or other inert gas atmosphere. The discharge current is controlled so as to provide an arc which is operable at 100 microamps to 20 amps.Prior to welding or brazing, the work is cleaned by high frequency electrical discharge cleaning techniques using high energy ions from either the ambient gas or from an electrode. By providing a small amount of DC during the high frequency discharge a "tinning" capability is established.The welding or brazing may be formed in a closed chamber so that arc stabilization can be accomplished.

Abstract: A Rankine cycle engine is disclosed which maximizes heat transfer efficiency between rotor cooling surfaces and coolant disposed within rotor collant passages. Further, internal passages utilize centrifugal pressure to provide accelerated movement of coolant utilizing the principle of the heat pipe. In a first embodiment the stator housing includes an outer chamber which functions as a boiler, heat being provided to this chamber through an outer wall thereof. In a second embodiment an additional internal wall is provided in the stator housing to enable connection of a separate superheater so that additional energy may be provided to the engine when necessary. Modification of the rotor cooling surfaces is also disclosed.