Abstract: Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained.

Abstract: Embodiments of the present disclosure generally provide magnetron configurations that provide more efficient and/or more uniform cooling characteristics and methods for forming the magnetrons. The magnetron includes one or more flow directing structures disposed between parallel cooling fins. The flow directing structures direct air flow across various surfaces of the cooling fins that otherwise would be obstructed by magnetron components, reducing the incidence and/or magnitude of hot spots on the cooling fins and/or on other magnetron components. The flow directing structures also adjust flow rates to improve cooling efficiency.

Abstract: In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture disposed therethrough, a conductive liner disposed on the surface of the electrostatic chuck within the aperture, a conductive tubing extending from a lower surface of the electrostatic chuck and axially aligned with the aperture, and a conductive coating at least partially within the aperture and at least partially within the conductive tubing, wherein the conductive coating provides a conductive path between the conductive liner and the conductive tubing.

Abstract: Embodiments disclosed herein include a plasma source, and an abatement system for abating compounds produced in semiconductor processes. In one embodiment, a plasma source is disclosed. The plasma source includes a body having an inlet and an outlet, and the inlet and the outlet are fluidly coupled within the body. The body further includes inside surfaces, and the inside surfaces are coated with yttrium oxide or diamond-like carbon. The plasma source further includes a flow splitter disposed in the body in a position that formed two flow paths between the inlet and the outlet, and a plasma generator disposed in a position operable to form a plasma within the body between the flow splitter and inside surfaces of the body.

Abstract: Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained.

Abstract: Embodiments disclosed herein include a faceplate having a sensor assembly, a processing chamber having the same, and a method for monitoring a substrate in a processing chamber. In one embodiment, a faceplate is configured to introduce processing gases into a plasma processing chamber. The faceplate has one or more holes. A sensor assembly is disposed in the one or more holes. The sensor assembly has a sensor and a controller.

Abstract: Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained.

Abstract: Techniques are disclosed for methods and apparatuses for reducing particle contamination formation in a high temperature processing chamber with a cooled gas feed block. The cooled gas feed has a body. The body has a main center portion having a top surface and a bottom surface. The body also has a flange extending outward from the bottom surface of the main center portion. A gas channel is disposed through the body. The gas channel has an inlet formed in the top surface of the main center portion and an outlet formed in the bottom surface of the main center portion. The body also has a center coolant channel. The center coolant channel has a first portion having an inlet formed in the top surface of the main center portion, and a second portion coupled to the first portion, the second portion having an outlet formed a sidewall of the flange.

Abstract: The present disclosure generally relates to generally relates to equipment for performing semiconductor device fabrication, and more particularly, to a cover ring for partially covering a surface of a substrate support in high-density plasma chemical vapor deposition processing. In one embodiment, the cover ring may include an annular body, an inner support block with a beveled first edge for stability, one or more thermal breaks to increase thermal movement towards the outer diameter, a rounded shoulder to prevent particle deposition, an outer lip configured to a substrate support pedestal, a vertical appendage to support the substrate, and a thermally conductive coating disposed on the annular ring to direct thermal conductivity towards the outer edge of the ring and prevent particle accumulation.

Abstract: Implementations described herein protect a chamber components from corrosive cleaning gases used at high temperatures. In one embodiment, a chamber component includes at least a bellows that includes a top mounting flange coupled to a bottom mounting flange by a tubular accordion structure. A coating is disposed on an exterior surface of at least the tubular accordion structure. The coating includes of at least one of polytetrafluoroethylene, parylene C, parylene D, diamond-like carbon (DLC), yttria stabilized zirconia, nickel, alumina, or aluminum silicon magnesium yttrium oxygen compound. In one embodiment, the chamber component is a valve having an internal bellows.

Abstract: An aspect of the present invention provides for capturing of audit trail data related to processing of requests. In an embodiment, the received requests are classified into a first category and a second category. For each request in the first category, the corresponding audit trail data is stored directly into non-volatile storage upon processing of the request. On the other hand, for each request in the second category, the audit trail data is first stored into a volatile memory upon processing of the request, and then later copied from the volatile memory to non-volatile storage. Thus, the audit trail data corresponding to both categories of requests is eventually available stored on non-volatile storage.

Abstract: Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.

Abstract: Embodiments of the present disclosure generally provide magnetron configurations that provide more efficient and/or more uniform cooling characteristics and methods for forming the magnetrons. The magnetron includes one or more flow directing structures disposed between parallel cooling fins. The flow directing structures direct air flow across various surfaces of the cooling fins that otherwise would be obstructed by magnetron components, reducing the incidence and/or magnitude of hot spots on the cooling fins and/or on other magnetron components. The flow directing structures also adjust flow rates to improve cooling efficiency.

Abstract: A mechanism for efficient collection of data is described for runtime middleware environments. Two frequencies are used, a collection frequency (CF) to collect the data and an aggregation frequency (AF) to aggregate and persist the data in a repository. The collection cycle is a shorter time interval than the aggregation cycle. An agent residing in the container periodically collects a set of data upon every collection cycle from the components of the middleware system and caches the set of data locally. Upon every aggregation cycle, the agent applies an aggregation function to the collected set of data and persists the set of data into a repository after the aggregation function has been applied. The aggregation function is such that it resulting data represents the behavior of the runtime environment in the total duration of the aggregation cycle.

Abstract: Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.

Abstract: In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture disposed therethrough, a conductive liner disposed on the surface of the electrostatic chuck within the aperture, a conductive tubing extending from a lower surface of the electrostatic chuck and axially aligned with the aperture, and a conductive coating at least partially within the aperture and at least partially within the conductive tubing, wherein the conductive coating provides a conductive path between the conductive liner and the conductive tubing.

Abstract: A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has a textured surface. The textured surface includes a plurality of independent engineered macro features integrally formed with the component part body. The engineered macro features include a macro feature body extending from the textured surface.

Abstract: An electrostatic chuck assembly and processing chamber having the same are disclosed herein. In one embodiment, an electrostatic chuck assembly is provided that includes a body having an outer edge connecting a frontside surface and a backside surface. The body has chucking electrodes disposed therein. A wafer spacing mask is formed on the frontside surface of the body. The wafer spacing mask has a plurality of elongated features. The elongated features have long axes that are radial aligned from the center to the outer edge. The wafer spacing mask has a plurality of radially aligned gas passages defined between the elongated features.

Abstract: An edge ring and process for fabricating an edge ring are disclosed herein. In one embodiment, an edge ring includes an annular body and a plurality of thermal breaks disposed within the annular body. The thermal breaks are disposed perpendicular to a center line of the annular body of the edge ring.

Abstract: In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture disposed therethrough, a conductive liner disposed on the surface of the electrostatic chuck within the aperture, a conductive tubing extending from a lower surface of the electrostatic chuck and axially aligned with the aperture, and a conductive coating at least partially within the aperture and at least partially within the conductive tubing, wherein the conductive coating provides a conductive path between the conductive liner and the conductive tubing.