Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.

Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.

Abstract: A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount.

Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.

Abstract: A circuit card assembly includes a heat sink, a locking mechanism, and a thermal insert. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downwards along the upper surface thereof. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The thermal insert is disposed within the heat sink and is an elongated member. The thermal insert is configured to contact a portion of at least one of the solid wedges, thus assisting in removing a first amount of thermal energy from the circuit board.

Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

Abstract: A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.

Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

Abstract: A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount.

Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.

Abstract: An electronic device assembly includes a heat sink coupled to an electronic device to dissipate the heat produced by the electronic device. A heat spreader is coupled between the electronic device and the heat sink to transfer heat from the electronic device to the heat sink. Furthermore, at least one of the electronic device, the heat spreader, and the heat sink is disposed with a disordered carbon coating.

Abstract: A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.

Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

Abstract: A heat exchange assembly for dissipating heat from a hot component of a circuit card is disclosed. The heat exchange assembly includes a support structure having a first support end, a second support end, and a support portion extending between the first support end and the second support end. The support structure further includes a plurality of first projections protruding from a portion of a surface of the support structure, corresponding to the support portion. Further, the heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is coupled to a surface of the support structure.

Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.

Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.

Abstract: The thermal interface material including a thermally conductive metal a thermally conductive metal having a first surface and an opposing second surface, a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal, and a thermal resistance reducing layer coupled to the diffusion barrier plate.

Abstract: The thermal interface material including a thermally conductive metal a thermally conductive metal having a first surface and an opposing second surface, a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal, and a thermal resistance reducing layer coupled to the diffusion barrier plate.

Abstract: A plug is provided for use with a heat sink body and an electronic device. The plug includes a first plug member and a second plug member. The first plug member defines a socket therein. The second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.