Abstract: A superconducting magnet coil arrangement has multiple superconducting coils and at least one of the superconducting coils is provided with a secondary coil of insulated resistive wire mechanically attached to a surface of the superconducting coil.

Abstract: A cylindrical superconducting magnet structure (24) comprising two superconducting main coils (10) respectively axially spaced apart by a spacer coil (16), said main coils and said spacer coil being bonded together in a single self-supporting structure.

Abstract: A superconducting magnet coil arrangement has multiple superconducting coils and at least one of the superconducting coils is provided with a secondary coil of insulated resistive wire mechanically attached to a surface of the superconducting coil.

Abstract: A method of manufacturing a solenoidal magnet structure, comprising the steps of providing a collapsible mold in which to wind coils; winding wire into defined positions (88) in the mold to form coils (34); placing a preformed tubular mechanical support structure (102, 120) over the coils (34) so wound; impregnating the coils and bonding them to the mechanical support structure by applying a thermosetting resin and allowing the thermosetting resin to harden; and collapsing the mold and removing the resultant solenoidal magnet structure comprising the resin impregnated coils and the mechanical support structure from the mold as a single solid piece.

Abstract: A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.

Abstract: A method of manufacturing a solenoidal magnet structure, comprising the steps of providing a collapsible mold in which to wind coils; winding wire into defined positions (88) in the mold to form coils (34); placing a preformed tubular mechanical support structure (102, 120) over the coils (34) so wound; 10 impregnating the coils and bonding them to the mechanical support structure by applying a thermosetting resin and allowing the thermosetting resin to harden; and collapsing the mold and removing the resultant solenoidal magnet structure comprising the resin impregnated coils and the mechanical support structure from the mold as a single solid piece.

Abstract: A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.

Abstract: A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material during the encapsulation process.

Abstract: A method of manufacturing a solenoidal magnet structure, comprising the steps of providing a collapsible mold in which to wind coils; winding wire into defined positions (88) in the mold to form coils (34); placing a preformed tubular mechanical support structure (102, 120) over the coils (34) so wound; impregnating the coils and bonding them to the mechanical support structure by applying a thermosetting resin and allowing the thermosetting resin to harden; and collapsing the mold and removing the resultant solenoidal magnet structure comprising the resin impregnated coils and the mechanical support structure from the mold as a single solid piece.

Abstract: The method for determination of the design of the basic magnet of a magnetic resonance apparatus with at least one gradient coil system, the design of the basic magnet is determined by taking into consideration forces acting on the at least one gradient coil system that may lead to vibrations of the gradient coil system due to switching processes of the gradient coil system in the field of the basic magnet.

Abstract: There is provided a method of forming an encapsulated coupled coil arrangement. The method comprises: coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material during the encapsulation process.

Abstract: The method for determination of the design of the basic magnet of a magnetic resonance apparatus with at least one gradient coil system, the design of the basic magnet is determined by taking into consideration forces acting on the at least one gradient coil system that may lead to vibrations of the gradient coil system due to switching processes of the gradient coil system in the field of the basic magnet.