Abstract: Embodiments of a methods and cleaning systems for cleaning components for use in substrate processing equipment are provided herein. In some embodiments, a cleaning system includes a boiler having a heater configured to heat a fluid; a clean chamber fluidly coupled to the boiler via at least one of a gas line and a liquid line, wherein the clean chamber includes one or more fixtures in an interior volume therein for holding at least one component to be cleaned, and wherein the clean chamber includes a heater for heating the interior volume; and an expansion chamber fluidly coupled to the clean chamber via a release line for evacuating the clean chamber, wherein the release line includes a release valve to selectively open or close a flow path between the expansion chamber and the clean chamber, and wherein the expansion chamber includes a chiller and a vacuum port.

Abstract: One example of the disclosure provides a method of fabricating a chamber component with a coating comprising a yttrium containing material with desired film properties. In one example, the method of fabricating a coating material includes providing a base structure comprising an aluminum containing material. The method further includes forming a coating layer that includes a yttrium containing material on the base structure. The method also includes thermal treating the coating layer to form a treated coating layer.

Abstract: Methods and apparatus for surface profiling and texturing of chamber components for use in a process chamber, such surface-profiled or textured chamber components, and method of use of same are provided herein. In some embodiments, a method includes measuring a parameter of a reference substrate or a heated pedestal using one or more sensors and modifying a surface of a chamber component physically based on the measured parameter.

Abstract: One example of the disclosure provides a method of fabricating a chamber component with a coating comprising a yttrium containing material with desired film properties. In one example, the method of fabricating a coating material includes providing a base structure comprising an aluminum containing material. The method further includes forming a coating layer that includes a yttrium containing material on the base structure. The method also includes thermal treating the coating layer to form a treated coating layer.

Abstract: Embodiments of a methods and cleaning systems for cleaning components for use in substrate processing equipment are provided herein. In some embodiments, a cleaning system includes a boiler having a heater configured to heat a fluid; a clean chamber fluidly coupled to the boiler via at least one of a gas line and a liquid line, wherein the clean chamber includes one or more fixtures in an interior volume therein for holding at least one component to be cleaned, and wherein the clean chamber includes a heater for heating the interior volume; and an expansion chamber fluidly coupled to the clean chamber via a release line for evacuating the clean chamber, wherein the release line includes a release valve to selectively open or close a flow path between the expansion chamber and the clean chamber, and wherein the expansion chamber includes a chiller and a vacuum port.

Abstract: A method for detecting corrosion on a conductive object includes submerging a surface of the conductive object at least partially in an aqueous solution, flowing current through the surface of the conductive object by forming a voltage differential across the surface, varying the voltage differential across the surface while monitoring the current through the surface of the conductive object, determining a total charge corresponding to a corrosion level of the surface of the conductive object based on current versus voltage levels. The corrosion level may further be utilized in selecting a cleaning process to remediate the corrosion of the surface based on the corrosion level and in applying a protective corrosion barrier to on at least part of the surface after the cleaning process.

Abstract: Methods and apparatus for surface profiling and texturing of chamber components for use in a process chamber, such surface-profiled or textured chamber components, and method of use of same are provided herein. In some embodiments, a method includes measuring a parameter of a reference substrate or a heated pedestal using one or more sensors and modifying a surface of a chamber component based on the measured parameter.

Abstract: A method for detecting corrosion on a conductive object includes submerging a surface of the conductive object at least partially in an aqueous solution, flowing current through the surface of the conductive object by forming a voltage differential across the surface, varying the voltage differential across the surface while monitoring the current through the surface of the conductive object, determining a total charge corresponding to a corrosion level of the surface of the conductive object based on current versus voltage levels. The corrosion level may further be utilized in selecting a cleaning process to remediate the corrosion of the surface based on the corrosion level and in applying a protective corrosion barrier to on at least part of the surface after the cleaning process.

Abstract: Embodiments of the present disclosure generally relate to a method for forming and treating a component in semiconductor manufacturing. In one embodiment, a method for treating a chamber component used in vacuum processing includes obtaining the chamber component including a recess formed in a surface of the chamber component, the surface being fabricated from a metal, and the recess has a depth ranging from about 0.5 mm to about 10 mm and a width ranging from about 1 mm to about 15 mm. The method further includes polishing the bottom surface of the recess using a laser to form a polished bottom surface having an Ra number of 1 micron or less. The laser can achieve high quality surface finishing.

Abstract: One example of the disclosure provides a method of fabricating a chamber component with a coating comprising a yttrium containing material with desired film properties. In one example, the method of fabricating a coating material includes providing a base structure comprising an aluminum containing material. The method further includes forming a coating layer that includes a yttrium containing material on the base structure. The method also includes thermal treating the coating layer to form a treated coating layer.

Abstract: Embodiments of the present disclosure provide methods of laser assisted modification, i.e., laser polishing, of ceramic substrates, or ceramic coated substrates, to desirably reduce the surface roughness and porosity thereof. In one embodiment, a method of laser polishing a workpiece surface includes scanning at least a portion of the workpiece surface with a pulsed laser beam. The laser beam has a pulse frequency of about 50 kHz or more and a spot size of about 10 mm2 or less and the workpiece surface comprises a ceramic material.

Abstract: Methods and systems for forming a layer from a fluid mixture on a web are provided. The system includes a fluid delivery apparatus for delivering the fluid mixture onto the web. The fluid delivery apparatus includes a cascade device and a chemical dispenser device. The system also includes a fluid stirring apparatus comprising at least one fan positioned over the web and configured to generate a flow pattern that stirs the fluid mixture on the web while the layer is being formed, without the at least one fan contacting the fluid mixture. The system further includes a fluid removal apparatus having a rinsing device and a suction device. The rinsing device is configured to dispense a rinsing fluid onto the web. The suction device is configured to remove by suction the rinsing fluid and a remaining portion of the fluid mixture remaining on the web after formation of the layer.

Abstract: Disclosed are methods and systems for forming a layer on a web with reduced levels of particulates. The layer is formed from a fluid mixture(s) or solution of chemical reagents that react to form the layer. The system includes a conveyor device provided configured to carry the web within the chamber while the first surface of the web undergoes one or more processing steps; a first fluid delivery apparatus and a second fluid delivery apparatus, and a first fluid removal apparatus. The first fluid removal apparatus is positioned within a space arranged between the first and the second delivery apparatuses.

Abstract: Disclosed are methods and systems for processing a web. The web (402) has a first surface, a second surface opposite the first surface, and includes a magnetic material. An example system includes a processing bed (202) configured to support the web while the first surface of the web undergoes one or more processing steps. The system also includes magnets (300) positioned relative to the processing bed so as to exert a magnetic force on the web that pulls the center of the web (403) toward the processing bed. The system further includes a conveyor belt (404) configured to move the web over the processing bed (202). The conveyor belt has a first contact surface and a second contact surface opposite the first contact surface. The first contact surface is configured to contact the second surface of the web, and the second contact surface is configured to contact the processing bed.

Abstract: Methods and systems for forming a layer from a fluid mixture on a web are provided. The system includes a fluid delivery apparatus for delivering the fluid mixture onto the web. The fluid delivery apparatus includes a cascade device and a chemical dispenser device. The system also includes a fluid stirring apparatus comprising at least one fan positioned over the web and configured to generate a flow pattern that stirs the fluid mixture on the web while the layer is being formed, without the at least one fan contacting the fluid mixture. The system further includes a fluid removal apparatus having a rinsing device and a suction device. The rinsing device is configured to dispense a rinsing fluid onto the web. The suction device is configured to remove by suction the rinsing fluid and a remaining portion of the fluid mixture remaining on the web after formation of the layer.

Abstract: An actively heated aluminum baffle component such as a thermal control plate or baffle ring of a showerhead electrode assembly of a plasma processing chamber has an exposed outer aluminum oxide layer which is formed by an electropolishing procedure. The exposed outer aluminum oxide layer minimizes defects and particles generated as a result of differential thermal stresses experienced by the aluminum component and outer aluminum oxide layer during plasma processing compared to an identically shaped component having a Type III anodized surface.

Abstract: An actively heated aluminum baffle component such as a thermal control plate or baffle ring of a showerhead electrode assembly of a plasma processing chamber has an exposed outer aluminum oxide layer which is formed by an electropolishing procedure. The exposed outer aluminum oxide layer minimizes defects and particles generated as a result of differential thermal stresses experienced by the aluminum component and outer aluminum oxide layer during plasma processing compared to an identically shaped component having a Type III anodized surface.

Abstract: An apparatus for cleaning a substrate includes a dispense head configured to supply a liquid medium as a meniscus to the surface of the substrate and a rinse head that is equipped with at least an inlet conduit to supply rinse chemical to a top substrate surface as a meniscus. An outlet conduit is disposed on either side of the inlet conduit and is configured to remove the rinse chemical and liquid medium from the substrate surface. The inlet conduit and the outlet conduits are perpendicular to the surface of the rinse head that faces the substrate and parallel to one another. A first and second transducers are disposed in a portion of the rinse head between the inlet conduit and each of the outlet conduits. The transducers are configured to transmit acoustic energy to the meniscus when formed between the surface of the rinse head and the substrate.

Abstract: A method for cleaning a substrate is provided that includes applying a liquid medium to a surface of the substrate such that the liquid medium substantially covers a portion of the substrate that is being cleaned. One or more transducers are used to generate acoustic energy. The generated acoustic energy is applied to the substrate and the liquid medium meniscus such that the applied acoustic energy to the liquid medium prevents cavitation within the liquid medium. The acoustic energy applied to the substrate provides maximum acoustic wave displacement to acoustic waves introduced into the liquid medium. The acoustic energy introduced into the substrate and the liquid medium enables dislodging of the particle contaminant from the surface of the substrate. The dislodged particle contaminants become entrapped within the liquid medium and are carried away from the surface of the substrate by the liquid medium.

Abstract: Methods for monitoring meniscus processing of a wafer surface to stabilize a meniscus are provided. In one example, the processing is in response to a current recipe that defines a desired gap between the wafer surface and a proximity head. The method includes the operations of monitoring current meniscus processing to determine that a current gap is other than the desired gap, and identifying a calibration recipe that specifies the current gap. The method then continues the meniscus processing of the wafer surface using process parameters specified by the identified calibration recipe.