Patents by Inventor Grant Peng
Grant Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8226775Abstract: The embodiments of the present invention provide methods for cleaning patterned substrates with fine features. The methods for cleaning patterned substrate have advantages in cleaning patterned substrates with fine features without substantially damaging the features by using the cleaning materials described. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network).Type: GrantFiled: June 2, 2008Date of Patent: July 24, 2012Assignee: Lam Research CorporationInventors: David S. L. Mui, Satish Srinivasan, Grant Peng, Ji Zhu, Shih-Chung Kon, Dragan Podlesnik, Arjun Mendiratta
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Patent number: 8211846Abstract: The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network).Type: GrantFiled: June 2, 2008Date of Patent: July 3, 2012Assignee: Lam Research GroupInventors: David S. L. Mui, Satish Srinivasan, Grant Peng, Ji Zhu, Shih-Chung Kon, Dragan Podlesnik, Arjun Mendiratta
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Publication number: 20120132234Abstract: A cleaning system for removing contaminants on a surface of a patterned substrate for defining integrated circuit devices is provided. The system includes a substrate carrier for supporting edges of the patterned substrate, and a cleaning head positioned over the patterned substrate. The cleaning head includes a plurality of dispensing holes to dispense a cleaning material on the surface the patterned substrate for defining integrated circuit devices, wherein the cleaning material includes polymers of a polymeric compound. The cleaning head is coupled to a storage of the cleaning material, which is coupled to the cleaning material preparation system. A support structure holds the cleaning head in proximity to the surface of the patterned substrate.Type: ApplicationFiled: December 1, 2011Publication date: May 31, 2012Inventors: David S.L. Mui, Satish Srinivasan, Grant Peng, Ji Zhu, Shih-Chung Kon, Dragan Podlesnik, Arjun Mendiratta
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Publication number: 20120006359Abstract: Methods for monitoring meniscus processing of a wafer surface to stabilize a meniscus are provided. In one example, the processing is in response to a current recipe that defines a desired gap between the wafer surface and a proximity head. The method includes the operations of monitoring current meniscus processing to determine that a current gap is other than the desired gap, and identifying a calibration recipe that specifies the current gap. The method then continues the meniscus processing of the wafer surface using process parameters specified by the identified calibration recipe.Type: ApplicationFiled: September 22, 2011Publication date: January 12, 2012Inventors: G. Grant Peng, Cristian Paduraru, Katrina Mikhaylich
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Patent number: 8084406Abstract: The embodiments of the present invention provide apparatus for cleaning patterned substrates with fine features with cleaning materials. The apparatus using the cleaning materials has advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network).Type: GrantFiled: June 2, 2008Date of Patent: December 27, 2011Assignee: Lam Research CorporationInventors: David S. L. Mui, Satish Srinivasan, Grant Peng, Ji Zhu, Shih-Chung Kon, Dragan Podlesnik, Arjun Mendiratta
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Patent number: 8051863Abstract: Apparatus monitors a meniscus process that is performed on wafers. Monitoring data for a current process received by a processor indicates characteristics of a gap between the wafer and a process head. The processor is configured to respond to the data that is in the form of orientation monitor signals and to respond to a current recipe. The processor generates meniscus monitor signals for allowing the meniscus to remain stable in further meniscus processing. The monitoring is of current meniscus processing to determine whether a current gap (i) is other than a desired gap of the current recipe, and (ii) corresponds to a stable meniscus. If so, a calibration recipe is identified as specifying the current gap. This calibration recipe specifies parameters for meniscus processing the wafer surface with the current gap. The meniscus processing of the wafer surface is continued using the parameters specified by the identified calibration recipe.Type: GrantFiled: October 6, 2008Date of Patent: November 8, 2011Assignee: Lam Research CorporationInventors: G. Grant Peng, Cristian Paduraru, Katrina Mikhaylich
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Publication number: 20100108093Abstract: A method for cleaning a substrate is provided that includes applying a liquid medium to a surface of the substrate such that the liquid medium substantially covers a portion of the substrate that is being cleaned. One or more transducers are used to generate acoustic energy. The generated acoustic energy is applied to the substrate and the liquid medium meniscus such that the applied acoustic energy to the liquid medium prevents cavitation within the liquid medium. The acoustic energy applied to the substrate provides maximum acoustic wave displacement to acoustic waves introduced into the liquid medium. The acoustic energy introduced into the substrate and the liquid medium enables dislodging of the particle contaminant from the surface of the substrate. The dislodged particle contaminants become entrapped within the liquid medium and are carried away from the surface of the substrate by the liquid medium.Type: ApplicationFiled: October 30, 2008Publication date: May 6, 2010Applicant: Lam Research Corp.Inventors: Grant Peng, David Mui, Shih-Chung Kon
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Publication number: 20100055920Abstract: The present invention discloses a new apparatus and method to enhance the plasma etch rate, etch selectivity and etch uniformity. The present invention will apply sonic waves to the work during plasma etch process. The sonic waves will enhance the plasma etch rate. The applied sonic waves can be of a mixture of multiple frequencies at the same time or at a different time. Applying different sonic frequency for etching different material will further amplify the etch selectivity. Sonic waves with multiple frequencies, especially with some lower frequency components, will further improve the etch uniformity over a large area.Type: ApplicationFiled: September 2, 2008Publication date: March 4, 2010Inventor: Gang Grant Peng
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Publication number: 20100043867Abstract: The present invention discloses a new apparatus and method for converting solar energy or thermal energy to electricity, requiring simple design and production. The present invention will apply the work from the solar or thermal energy to the variable capacitors that convert into electric energy. The output energy from the present invention will be ready for grid connection.Type: ApplicationFiled: August 19, 2008Publication date: February 25, 2010Inventor: Gang Grant Peng
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Publication number: 20090156452Abstract: The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network).Type: ApplicationFiled: June 2, 2008Publication date: June 18, 2009Inventors: David S.L. Mui, Satish Srinivasan, Grant Peng, Ji Zhu, Shih-Chung Kon, Dragan Podlesnik, Arjun Mendiratta
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Publication number: 20090151752Abstract: The embodiments of the present invention provide methods for cleaning patterned substrates with fine features. The methods for cleaning patterned substrate have advantages in cleaning patterned substrates with fine features without substantially damaging the features by using the cleaning materials described. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network).Type: ApplicationFiled: June 2, 2008Publication date: June 18, 2009Inventors: David S.L. Mui, Satish Srinivasan, Grant Peng, Ji Zhu, Shih-Chung Kon, Dragan Podlesnik, Arjun Mendiratta
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Publication number: 20090151757Abstract: The embodiments of the present invention provide apparatus for cleaning patterned substrates with fine features with cleaning materials. The apparatus using the cleaning materials has advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network).Type: ApplicationFiled: June 2, 2008Publication date: June 18, 2009Inventors: David S. L. Mui, Satish Srinivasan, Grant Peng, Ji Zhu, Shih-Chung Kon, Dragan Podlesnik, Arjun Mendiratta
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Publication number: 20090101173Abstract: Apparatus monitors a meniscus process that is performed on wafers. Monitoring data for a current process received by a processor indicates characteristics of a gap between the wafer and a process head. The processor is configured to respond to the data that is in the form of orientation monitor signals and to respond to a current recipe. The processor generates meniscus monitor signals for allowing the meniscus to remain stable in further meniscus processing. The monitoring is of current meniscus processing to determine whether a current gap (i) is other than a desired gap of the current recipe, and (ii) corresponds to a stable meniscus. If so, a calibration recipe is identified as specifying the current gap. This calibration recipe specifies parameters for meniscus processing the wafer surface with the current gap. The meniscus processing of the wafer surface is continued using the parameters specified by the identified calibration recipe.Type: ApplicationFiled: October 6, 2008Publication date: April 23, 2009Inventors: G. Grant Peng, Cristian Paduraru, Katrina Mikhaylich
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Publication number: 20080038448Abstract: In one embodiment a chamber body enabling semiconductor processing equipment to be at least partially housed in the chamber body, the semiconductor processing equipment being configured to process a substrate using fluids is disclosed. The chamber body being comprised of a base material implemented to form the chamber body, the chamber body defined by at least a bottom surface and wall surfaces that are integrally connected to the bottom surface to enable capture of overflows of fluids during the processing of the substrate over the chamber body. Additionally, the base material is metallic. The chamber body also has a primer coat material disposed over and on the base material. The primer coat material has metallic constituents to define an integrated bond with the base material along with non-metallic constituents. The chamber body further includes a main coat material disposed over and on the primer coat material.Type: ApplicationFiled: March 30, 2007Publication date: February 14, 2008Applicant: LAM RESEARCH CORP.Inventors: Arnold Kholodenko, Wing Cheng, Helen Cheng, Mark Mardelboym, Grant Peng, Katrina Mikhaylichenko
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Patent number: 6897489Abstract: Group III-V compound semiconductor high brightness white or desire color light emitting diodes (LEDs) are disclosed. One of embodiments of the LEDs of the present invention comprises a first active layer, a second active layer, and a transition active layer sandwiched between the first and the second active layers, and is flip chip bonded on an electrically conductive submount for faster heat dissipation. Material systems for active layers of the LEDs of the present invention comprise (Al.sub.xGa.sub.1-x).sub.yIn.sub.1-yP.sub.z N.sub. 1-z. With combinations of different values of “x”, “y”, and “z”, the active layers and the transition active layer emit lights of different wavelengths. Appropriately adjusting wavelengths and intensities of emitted lights provides high brightness white or desire color.Type: GrantFiled: March 10, 2004Date of Patent: May 24, 2005Inventors: Hui Peng, Gang Grant Peng