Patents by Inventor Gregory Alan Fish

Gregory Alan Fish has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210278591
    Abstract: The wavelength response of an arrayed waveguide grating can be tuned, in accordance with various embodiments, using a beam sweeper including one or more heaters to shift a lateral position of light focused by the beam sweeper at an interface of the beam sweeper with an input free propagation region of the arrayed waveguide grating.
    Type: Application
    Filed: May 11, 2021
    Publication date: September 9, 2021
    Inventors: Jared Bauters, Brian R. Koch, Jonathan Edgar Roth, Gregory Alan Fish
  • Publication number: 20210227723
    Abstract: Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.
    Type: Application
    Filed: April 2, 2021
    Publication date: July 22, 2021
    Inventors: Roberto Marcoccia, Brian Robert Koch, Theodore J. Schmidt, Christopher Paul Wyland, Robert S. Guzzon, Gregory Alan Fish
  • Publication number: 20210225732
    Abstract: The thermal impedance of p-i-n diodes integrated on semiconductor-on-insulator substrates can be reduced with thermally conducting vias that shunt heat across thermal barriers such as, e.g., the thick top oxide cladding often encapsulating the p-i-n diode. In various embodiments, one or more thermally conducting vias extend from a top surface of the intrinsic diode layer to a metal structure connected to the doped top layer of the diode, and/or from that metal structure down to at least the semiconductor device layer of the substrate.
    Type: Application
    Filed: April 6, 2021
    Publication date: July 22, 2021
    Inventors: Erik Johan Norberg, Naser Dalvand, Gregory Alan Fish
  • Publication number: 20210215992
    Abstract: In photonic integrated circuits implemented in silicon-on-insulator substrates, nonconductive channels formed, in accordance with various embodiments, in the silicon device layer and/or the silicon handle of the substrate in regions underneath radio-frequency transmission lines of photonic devices can provide breaks in parasitic conductive layers of the substrate, thereby reducing radio-frequency substrate losses.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 15, 2021
    Inventors: John Parker, Gregory Alan Fish, Brian R. Koch
  • Patent number: 11051431
    Abstract: Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: June 29, 2021
    Assignee: Juniper Networks, Inc.
    Inventors: Roberto Marcoccia, Brian Robert Koch, Theodore J. Schmidt, Christopher Paul Wyland, Robert S. Guzzon, Gregory Alan Fish
  • Patent number: 11022751
    Abstract: The wavelength response of an arrayed waveguide grating can be tuned, in accordance with various embodiments, using a beam sweeper including one or more heaters to shift a lateral position of light focused by the beam sweeper at an interface of the beam sweeper with an input free propagation region of the arrayed waveguide grating.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: June 1, 2021
    Assignee: Aurrion, Inc.
    Inventors: Jared Bauters, Brian R. Koch, Jonathan Edgar Roth, Gregory Alan Fish
  • Patent number: 10998252
    Abstract: The thermal impedance of p-i-n diodes integrated on semiconductor-on-insulator substrates can be reduced with thermally conducting vias that shunt heat across thermal barriers such as, e.g., the thick top oxide cladding often encapsulating the p-i-n diode. In various embodiments, one or more thermally conducting vias extend from a top surface of the intrinsic diode layer to a metal structure connected to the doped top layer of the diode, and/or from that metal structure down to at least the semiconductor device layer of the substrate.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: May 4, 2021
    Assignee: Juniper Networks, Inc.
    Inventors: Erik Johan Norberg, Naser Dalvand, Gregory Alan Fish
  • Publication number: 20210126731
    Abstract: Described herein are photonic integrated circuits (PICs) comprising a semiconductor optical amplifier (SOA) to output a signal comprising a plurality of wavelengths, a sensor to detect data associated with a power value of each wavelength of the output signal of the SOA, a filter to filter power values of one or more of the wavelengths of the output signal of the SOA, and control circuitry to control the filter to reduce a difference between a pre-determined power value of each filtered wavelength of the output signal of the SOA and the detected power value of each filtered wavelength of the output signal of the SOA.
    Type: Application
    Filed: January 5, 2021
    Publication date: April 29, 2021
    Inventors: Erik Johan Norberg, John M. Garcia, Brian Robert Koch, Gregory Alan Fish
  • Patent number: 10976637
    Abstract: In photonic integrated circuits implemented in silicon-on-insulator substrates, non-conductive channels formed, in accordance with various embodiments, in the silicon device layer and/or the silicon handle of the substrate in regions underneath radio-frequency transmission lines of photonic devices can provide breaks in parasitic conductive layers of the substrate, thereby reducing radio-frequency substrate losses.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: April 13, 2021
    Assignee: Aurrion, Inc.
    Inventors: John Parker, Gregory Alan Fish, Brian R. Koch
  • Patent number: 10965369
    Abstract: Photonically integrated normal incidence photodetectors (NIPDs) and associated in-plane waveguide structures optically coupled to the NIPDs can be configured to allow for both in-plane and normal-incidence detection. In photonic circuits with light-generation capabilities, such as integrated optical transceivers, the ability of the NIPDs to detect in-plane light is used, in accordance with some embodiments, to provide self-test functionality.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: March 30, 2021
    Assignee: Juniper Networks, Inc.
    Inventors: John Parker, Brian Robert Koch, Gregory Alan Fish, Hyundai Park
  • Patent number: 10892599
    Abstract: Described herein are photonic integrated circuits (PICs) comprising a semiconductor optical amplifier (SOA) to output a signal comprising a plurality of wavelengths, a sensor to detect data associated with a power value of each wavelength of the output signal of the SOA, a filter to filter power values of one or more of the wavelengths of the output signal of the SOA, and control circuitry to control the filter to reduce a difference between a pre-determined power value of each filtered wavelength of the output signal of the SOA and the detected power value of each filtered wavelength of the output signal of the SOA.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: January 12, 2021
    Assignee: Aurrion, Inc.
    Inventors: Erik Johan Norberg, John M. Garcia, Brian Robert Koch, Gregory Alan Fish
  • Publication number: 20200358258
    Abstract: Embodiments of the invention describe polarization insensitive optical devices utilizing polarization sensitive components. Light comprising at least one polarization state is received, and embodiments of the invention select a first optical path for light comprising a first polarization state or a second optical path for light comprising a second polarization state orthogonal to the first polarization state. The optical paths include components to at least amplify and/or modulate light comprising the first polarization state; the second optical path includes a polarization rotator to rotate light comprising the second polarization state to the first polarization state.
    Type: Application
    Filed: July 28, 2020
    Publication date: November 12, 2020
    Inventors: Gregory Alan Fish, Erik Johan Norberg, John M. Garcia, Robert Silvio Guzzon, Daniel Knight Sparacin
  • Publication number: 20200340860
    Abstract: Described herein are optical sensing devices for photonic integrated circuits (PICs). A PIC may comprise a plurality of waveguides formed in a silicon on insulator (SOI) substrate, and a plurality of heterogeneous lasers, each laser formed from a silicon material of the SOI substrate and to emit an output wavelength comprising an infrared wavelength. Each of these lasers may comprise a resonant cavity included in one of the plurality of waveguides, and a gain material comprising a non-silicon material and adiabatically coupled to the respective waveguide. A light directing element may direct outputs of the plurality of heterogeneous lasers from the PIC towards an object, and one or more detectors may detect light from the plurality of heterogeneous lasers reflected from or transmitted through the object.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Inventors: Gregory Alan Fish, Jonathan Edgar Roth, Brandon Buckley
  • Publication number: 20200278496
    Abstract: The wavelength response of an arrayed waveguide grating can be tuned, in accordance with various embodiments, using a beam sweeper including one or more heaters to shift a lateral position of light focused by the beam sweeper at an interface of the beam sweeper with an input free propagation region of the arrayed waveguide grating.
    Type: Application
    Filed: May 19, 2020
    Publication date: September 3, 2020
    Inventors: Jared Bauters, Brian R. Koch, Jonathan Edgar Roth, Gregory Alan Fish
  • Patent number: 10756516
    Abstract: Embodiments of the invention describe polarization insensitive optical devices utilizing polarization sensitive components. Light comprising at least one polarization state is received, and embodiments of the invention select a first optical path for light comprising a first polarization state or a second optical path for light comprising a second polarization state orthogonal to the first polarization state. The optical paths include components to at least amplify and/or modulate light comprising the first polarization state; the second optical path includes a polarization rotator to rotate light comprising the second polarization state to the first polarization state.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: August 25, 2020
    Assignee: Aurrion, Inc.
    Inventors: Gregory Alan Fish, Erik Johan Norberg, John M. Garcia, Robert Silvio Guzzon, Daniel Knight Sparacin
  • Publication number: 20200252126
    Abstract: Photonically integrated normal incidence photodetectors (NIPDs) and associated in-plane waveguide structures optically coupled to the NIPDs can be configured to allow for both in-plane and normal-incidence detection. In photonic circuits with light-generation capabilities, such as integrated optical transceivers, the ability of the NIPDs to detect in-plane light is used, in accordance with some embodiments, to provide self-test functionality.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 6, 2020
    Inventors: John Parker, Brian Robert Koch, Gregory Alan Fish, Hyundai Park
  • Patent number: 10732039
    Abstract: Described herein are optical sensing devices for photonic integrated circuits (PICs). A PIC may comprise a plurality of waveguides formed in a silicon on insulator (SOI) substrate, and a plurality of heterogeneous lasers, each laser formed from a silicon material of the SOI substrate and to emit an output wavelength comprising an infrared wavelength. Each of these lasers may comprise a resonant cavity included in one of the plurality of waveguides, and a gain material comprising a non-silicon material and adiabatically coupled to the respective waveguide. A light directing element may direct outputs of the plurality of heterogeneous lasers from the PIC towards an object, and one or more detectors may detect light from the plurality of heterogeneous lasers reflected from or transmitted through the object.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: August 4, 2020
    Assignee: Aurrion, Inc.
    Inventors: Gregory Alan Fish, Jonathan Edgar Roth, Brandon Buckley
  • Publication number: 20200233148
    Abstract: Methods and systems are presented for heterogeneous integration of photonics and electronics with atomic layer deposition (ALD) bonding. One method includes operations for forming a compound semiconductor and for depositing (e.g., via atomic layer deposition) a continuous film of a protection material (e.g., Al2O3) on a first surface of the compound semiconductor. Further, the method includes an operation for forming a silicon on insulator (SOI) wafer, with the SOI wafer comprising one or more waveguides. The method further includes bonding the compound semiconductor at the first surface to the SOI wafer to form a bonded structure and processing the bonded structure. The protection material protects the compound semiconductor from acid etchants during further processing of the bonded structure.
    Type: Application
    Filed: April 9, 2020
    Publication date: July 23, 2020
    Inventors: John Parker, Gregory Alan Fish, Martin A. Spannagel, Antonio Labaro
  • Publication number: 20200209496
    Abstract: Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.
    Type: Application
    Filed: March 9, 2020
    Publication date: July 2, 2020
    Inventors: Gregory Alan Fish, Brian R. Koch
  • Publication number: 20200211923
    Abstract: The thermal impedance of p-i-n diodes integrated on semiconductor-on-insulator substrates can be reduced with thermally conducting vias that shunt heat across thermal barriers such as, e.g., the thick top oxide cladding often encapsulating the p-i-n diode. In various embodiments, one or more thermally conducting vias extend from a top surface of the intrinsic diode layer to a metal structure connected to the doped top layer of the diode, and/or from that metal structure down to at least the semiconductor device layer of the substrate.
    Type: Application
    Filed: February 14, 2020
    Publication date: July 2, 2020
    Inventors: Erik Johan Norberg, Naser Dalvand, Gregory Alan Fish