Patents by Inventor Gregory E. Menk
Gregory E. Menk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958162Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: GrantFiled: January 17, 2020Date of Patent: April 16, 2024Assignee: Applied Materials, Inc.Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
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Patent number: 11724362Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: December 8, 2020Date of Patent: August 15, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Jagdish Khanna, Jason G. Fung, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Gregory E. Menk, Nag B. Patibandla
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Publication number: 20210107116Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: ApplicationFiled: December 8, 2020Publication date: April 15, 2021Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh Jagdish KHANNA, Jason G. FUNG, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava Reddy KAKIREDDY, Gregory E. MENK, Nag B. PATIBANDLA
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Patent number: 10875145Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: October 22, 2015Date of Patent: December 29, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
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Patent number: 10821573Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: October 19, 2015Date of Patent: November 3, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
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Patent number: 10786885Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.Type: GrantFiled: January 19, 2018Date of Patent: September 29, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Robert D. Tolles, Gregory E. Menk, Eric Davey, You Wang, Huyen Karen Tran, Fred C. Redeker, Veera Raghava Reddy Kakireddy, Ekaterina Mikhaylichenko, Jay Gurusamy
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Publication number: 20200147750Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: ApplicationFiled: January 17, 2020Publication date: May 14, 2020Inventors: Rajeev BAJAJ, Kasiraman KRISHNAN, Mahendra C. ORILALL, Daniel REDFIELD, Fred C. REDEKER, Nag B. PATIBANDLA, Gregory E. MENK, Jason G. FUNG, Russell Edward PERRY, Robert E. DAVENPORT
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Publication number: 20200135517Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.Type: ApplicationFiled: December 31, 2019Publication date: April 30, 2020Inventors: Jason G. FUNG, Rajeev BAJAJ, Daniel REDFIELD, Aniruddh Jagdish KHANNA, Mario CORNEJO, Gregory E. MENK, JOHN WATKINS
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Publication number: 20200101657Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.Type: ApplicationFiled: December 2, 2019Publication date: April 2, 2020Inventors: Kasiraman KRISHNAN, Daniel REDFIELD, Russell Edward PERRY, Gregory E. MENK, Rajeev BAJAJ, Fred C. REDEKER, Nag B. PATIBANDLA, Mahendra C. ORILALL, Jason G. FUNG
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Patent number: 10593574Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.Type: GrantFiled: November 6, 2015Date of Patent: March 17, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Jason G. Fung, Rajeev Bajaj, Daniel Redfield, Aniruddh Khanna, Mario Cornejo, Gregory E. Menk, John Watkins
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Patent number: 10537974Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: GrantFiled: January 22, 2018Date of Patent: January 21, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
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Patent number: 10493691Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.Type: GrantFiled: October 2, 2017Date of Patent: December 3, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Kasiraman Krishnan, Daniel Redfield, Russell Edward Perry, Gregory E. Menk, Rajeev Bajaj, Fred C. Redeker, Nag B. Patibandla, Mahendra C. Orilall, Jason G. Fung
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Publication number: 20190299357Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.Type: ApplicationFiled: June 17, 2019Publication date: October 3, 2019Inventors: Mahendra Christopher ORILALL, Timothy MICHAELSON, Kasiraman KRISHNAN, Rajeev BAJAJ, Nag B. PATIBANDLA, Daniel REDFIELD, Fred C. REDEKER, Gregory E. MENK
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Patent number: 10384330Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: October 16, 2015Date of Patent: August 20, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
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Patent number: 10322491Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.Type: GrantFiled: October 16, 2015Date of Patent: June 18, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Mahendra Christopher Orilall, Timothy Michaelson, Kasiraman Krishnan, Rajeev Bajaj, Nag B. Patibandla, Daniel Redfield, Fred C. Redeker, Gregory E. Menk
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Publication number: 20180207770Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.Type: ApplicationFiled: January 19, 2018Publication date: July 26, 2018Inventors: Robert D. TOLLES, Gregory E. MENK, Eric DAVEY, You WANG, Huyen Karen TRAN, Fred C. REDEKER, Veera Raghava Reddy KAKIREDDY, Ekaterina MIKHAYLICHENKO, Jay GURUSAMY
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Publication number: 20180161954Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: ApplicationFiled: January 22, 2018Publication date: June 14, 2018Inventors: Rajeev BAJAJ, Kasiraman KRISHNAN, Mahendra C. ORILALL, Daniel REDFIELD, Fred C. REDEKER, Nag B. PATIBANDLA, Gregory E. MENK, Jason G. FUNG, Russell Edward PERRY, Robert E. DAVENPORT
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Publication number: 20180043613Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.Type: ApplicationFiled: October 2, 2017Publication date: February 15, 2018Inventors: Kasiraman KRISHNAN, Daniel REDFIELD, Russell Edward PERRY, Gregory E. MENK, Rajeev BAJAJ, Fred C. REDEKER, Nag B. PATIBANDLA, Mahendra C. ORILALL, Jason G. FUNG
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Patent number: 9873180Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: GrantFiled: April 24, 2015Date of Patent: January 23, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
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Patent number: 9776361Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.Type: GrantFiled: September 23, 2015Date of Patent: October 3, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Kasiraman Krishnan, Daniel Redfield, Russell Edward Perry, Gregory E. Menk, Rajeev Bajaj, Fred C. Redeker, Nag B. Patibandla, Mahendra C. Orilall, Jason G. Fung