Patents by Inventor Gregory E. Menk
Gregory E. Menk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170133252Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.Type: ApplicationFiled: November 6, 2015Publication date: May 11, 2017Inventors: Jason G. FUNG, Rajeev BAJAJ, Daniel REDFIELD, Aniruddh KHANNA, Mario CORNEJO, Gregory E. MENK, John WATKINS
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Publication number: 20160114458Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: ApplicationFiled: October 22, 2015Publication date: April 28, 2016Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh KHANNA, Jason G. FUNG, Mario CORNEJO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava REDDY, Ashavani KUMAR, Venkatachalam HARIHARAN, Gregory E. MENK, Fred C. REDEKER, Nag B. PATIBANDLA, Hou T. NG, Robert E. DAVENPORT, Amritanshu SINHA
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Publication number: 20160107290Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: ApplicationFiled: April 24, 2015Publication date: April 21, 2016Inventors: Rajeev BAJAJ, Kasiraman KRISHNAN, Mahendra C. ORILALL, Daniel REDFIELD, Fred C. REDEKER, Nag B. PATIBANDLA, Gregory E. MENK, Jason G. FUNG, Russell Edward PERRY, Robert E. DAVENPORT
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Publication number: 20160107295Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: ApplicationFiled: October 16, 2015Publication date: April 21, 2016Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh KHANNA, Jason G. FUNG, Mario CORNEJO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava Reddy KAKIREDDY, Ashavani KUMAR, Venkatachalam HARIHARAN, Gregory E. MENK, Fred C. REDEKER, Nag B. PATIBANDLA, Hou T. NG, Robert E. DAVENPORT, Amritanshu SINHA
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Publication number: 20160107287Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: ApplicationFiled: October 19, 2015Publication date: April 21, 2016Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh KHANNA, Jason G. FUNG, Mario CORNEJO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava Reddy KAKIREDDY, Ashavani KUMAR, Venkatachalam HARIHARAN, Gregory E. MENK, Fred C. REDEKER, Nag B. PATIBANDLA, Hou T. NG, Robert E. DAVENPORT, Amritanshu SINHA
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Publication number: 20160107288Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.Type: ApplicationFiled: October 16, 2015Publication date: April 21, 2016Inventors: Mahendra Christopher ORILALL, Timothy MICHAELSON, Kasiraman KRISHNAN, Rajeev BAJAJ, Nag B. PATIBANDLA, Daniel REDFIELD, Fred C. REDEKER, Gregory E. MENK
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Publication number: 20160107381Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.Type: ApplicationFiled: September 23, 2015Publication date: April 21, 2016Inventors: Kasiraman KRISHNAN, Daniel REDFIELD, Russell Edward PERRY, Gregory E. MENK, Rajeev BAJAJ, Fred C. REDEKER, Nag B. PATIBANDLA, Mahendra C. ORILALL, Jason G. FUNG
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Publication number: 20160101500Abstract: A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.Type: ApplicationFiled: April 24, 2015Publication date: April 14, 2016Inventors: Jason Garcheung FUNG, Rajeev BAJAJ, Kasiraman KRISHNAN, Mahendra C. ORILALL, Fred C. REDEKER, Russell Edward PERRY, Gregory E. MENK, Daniel REDFIELD
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Patent number: 9221147Abstract: A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.Type: GrantFiled: October 23, 2012Date of Patent: December 29, 2015Assignee: Applied Materials, Inc.Inventors: Jun Qian, Sivakumar Dhandapani, Benjamin Cherian, Thomas H. Osterheld, Jeffrey Drue David, Gregory E. Menk, Boguslaw A. Swedek, Doyle E. Bennett
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Patent number: 9138860Abstract: Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.Type: GrantFiled: April 14, 2011Date of Patent: September 22, 2015Assignee: APPLIED MATERIALS, INC.Inventors: Sivakumar Dhandapani, Jun Qian, Christopher D. Cocca, Jason G. Fung, Shou-Sung Chang, Charles C. Garretson, Gregory E. Menk, Stan D. Tsai
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Publication number: 20140323017Abstract: Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the polishing pad on a platen; energizing a fluid within the energized fluid delivery assembly; applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and removing the dislodged slurry residue and debris using a vacuum suction unit. Systems and apparatus for carrying out the methods are provided, as are numerous additional aspects.Type: ApplicationFiled: April 24, 2013Publication date: October 30, 2014Inventors: Jianshe Tang, Thomas H. Osterheld, Fred C. Redeker, Gregory E. Menk
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Publication number: 20140242881Abstract: A method of controlling a polishing operation is described. A controller stores an optical model for a layer stack having a plurality of layers and a plurality of input parameters including a first parameter and a second parameter. The controller stores data defining a plurality of default values for the first parameter and measures an optical property of a substrate and generates a second value. Using the optical model and the second value and iterating over the first values, a number of reference spectra are calculated. A spectrum is measured and the measured spectrum is matched to the reference spectra and the best matched reference spectrum is determined. The first value of the best matched reference spectrum is determined and is used to adjust a polishing endpoint or a polishing parameter of a polishing apparatus.Type: ApplicationFiled: February 27, 2013Publication date: August 28, 2014Inventors: Jeffrey Drue David, Gregory E. Menk, Doyle E. Bennett, Jun Qian, Sivakumar Dhandapani, Benjamin Cherian, Thomas H. Osterheld, Boguslaw A. Swedek
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Publication number: 20140237905Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.Type: ApplicationFiled: May 5, 2014Publication date: August 28, 2014Applicant: Applied Materials, Inc.Inventors: Benjamin A. Bonner, Gopalakrishna B. Prabhu, Erik S. Rondum, Gregory E. Menk, Anand N. Iyer, Peter McReynolds, Garlen C. Leung
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Patent number: 8758085Abstract: Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.Type: GrantFiled: July 7, 2011Date of Patent: June 24, 2014Assignee: Applied Materials, Inc.Inventors: Sivakumar Dhandapani, Asheesh Jain, Charles C. Garretson, Gregory E. Menk, Stan D. Tsai
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Publication number: 20140113524Abstract: A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.Type: ApplicationFiled: October 23, 2012Publication date: April 24, 2014Inventors: Jun Qian, Sivakumar Dhandapani, Benjamin Cherian, Thomas H. Osterheld, Jeffrey Drue David, Gregory E. Menk, Boguslaw A. Swedek, Doyle E. Bennett
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Publication number: 20130122783Abstract: A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change.Type: ApplicationFiled: April 13, 2011Publication date: May 16, 2013Applicant: APPLIED MATERIALS, INCInventors: Gregory E. Menk, Stan D. Tsai, Sang J. Cho, Slvakumar Dhandapani, Christopher D. Cocca, Jason G. Fung, Shou-Sung Chang, Charles C. Garretson
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Patent number: 8439723Abstract: A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.Type: GrantFiled: August 11, 2008Date of Patent: May 14, 2013Assignee: Applied Materials, Inc.Inventors: Robert A. Marks, Christopher Heung-Gyun Lee, Garlen C. Leung, Gregory E. Menk, Jie Diao, Erik S. Rondum
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Patent number: 8388412Abstract: Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.Type: GrantFiled: October 7, 2011Date of Patent: March 5, 2013Assignee: Applied Materials, Inc.Inventors: Gopalakrishna B. Prabhu, Yin Yuan, Jeonghoon Oh, Gregory E. Menk
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Patent number: 8337279Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.Type: GrantFiled: June 22, 2009Date of Patent: December 25, 2012Assignee: Applied Materials, Inc.Inventors: Sivakumar Dhandapani, Stan D. Tsai, Daxin Mao, Sameer Deshpande, Shou-Sung Chang, Gregory E. Menk, Charles C. Garretson, Jason Garcheung Fung, Christopher D. Cocca, Hung Chih Chen
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Publication number: 20120100779Abstract: Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.Type: ApplicationFiled: July 7, 2011Publication date: April 26, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Sivakumar Dhandapani, Asheesh Jain, Charles C. Garretson, Gregory E. Menk, Stan D. Tsai