Abstract: An electronic device can include a tunnel structure that includes a first electrode, a second electrode, and tunnel dielectric layer disposed between the electrodes. In a particular embodiment, the tunnel structure may or may not include an intermediate doped region that is at the primary surface, abuts a lightly doped region, and has a second conductivity type opposite from and a dopant concentration greater than the lightly doped region. In another embodiment, the electrodes have opposite conductivity types. In a further embodiment, an electrode can be formed from a portion of a substrate or well region, and the other electrode can be formed over such portion of the substrate or well region.

Abstract: An electronic device can include a nonvolatile memory cell that includes a capacitor, a tunnel structure, a state transistor, and an access transistor. In an embodiment, the capacitor and tunnel structure can include upper electrodes, wherein the upper electrode of the capacitor has a first conductivity type, and the upper electrode of the tunnel structure includes at least a portion that has a second conductivity type opposite the first conductivity type. In another embodiment, a process of forming the nonvolatile memory is performed using a single poly process. In a further embodiment, charge carriers can tunnel through a gate dielectric layer of the state transistor during programming and tunnel through a tunnel dielectric of the tunnel transistor during erasing.

Abstract: An electronic device can include a tunnel structure that includes a first electrode, a second electrode, and tunnel dielectric layer disposed between the electrodes. In a particular embodiment, the tunnel structure may or may not include an intermediate doped region that is at the primary surface, abuts a lightly doped region, and has a second conductivity type opposite from and a dopant concentration greater than the lightly doped region. In another embodiment, the electrodes have opposite conductivity types. In a further embodiment, an electrode can be formed from a portion of a substrate or well region, and the other electrode can be formed over such portion of the substrate or well region.

Abstract: An electronic device includes a first memory cell and a second memory cell, of a nonvolatile memory array. The first memory cell includes a body region, a gate structure, a source region, and a drain region. The second memory cell includes a body region, a gate structure, a source region, and a drain region. In one embodiment, the body of the second memory cell is physically isolated from the body region of the first memory cell. A bitline segment is electrically connected to the drain region of the first memory cell and to the drain region of the second memory cell.

Abstract: An electronic device can include a nonvolatile memory cell. In a particular embodiment, during an erase pulse, all unselected lines are at substantially the same voltage, and a row or segment of a row, such as a word, is erased during the erase pulse. In another embodiment, selected control gate and erase lines are at substantially the same voltage during a programming pulse. In a further embodiment, charge carriers tunnel through a dielectric layer of a component during a program pulse, and charge carriers tunnel through a different dielectric layer of a different component during an erase pulse.

Abstract: An electronic device can include a nonvolatile memory cell. In a particular embodiment, during an erase pulse, all unselected lines are at substantially the same voltage, and a row or segment of a row, such as a word, is erased during the erase pulse. In another embodiment, selected control gate and erase lines are at substantially the same voltage during a programming pulse. In a further embodiment, charge carriers tunnel through a dielectric layer of a component during a program pulse, and charge carriers tunnel through a different dielectric layer of a different component during an erase pulse.

Abstract: An electronic device can include a nonvolatile memory cell that includes a capacitor, a tunnel structure, a state transistor, and an access transistor. In an embodiment, the capacitor and tunnel structure can include upper electrodes, wherein the upper electrode of the capacitor has a first conductivity type, and the upper electrode of the tunnel structure includes at least a portion that has a second conductivity type opposite the first conductivity type. In another embodiment, a process of forming the nonvolatile memory is performed using a single poly process. In a further embodiment, charge carriers can tunnel through a gate dielectric layer of the state transistor during programming and tunnel through a tunnel dielectric of the tunnel transistor during erasing.

Abstract: An electronic device can include a tunnel structure that includes a first electrode, a second electrode, and tunnel dielectric layer disposed between the electrodes. In a particular embodiment, the tunnel structure may or may not include an intermediate doped region that is at the primary surface, abuts a lightly doped region, and has a second conductivity type opposite from and a dopant concentration greater than the lightly doped region. In another embodiment, the electrodes have opposite conductivity types. In a further embodiment, an electrode can be formed from a portion of a substrate or well region, and the other electrode can be formed over such portion of the substrate or well region.

Abstract: An electronic device includes a first memory cell and a second memory cell, of a nonvolatile memory array. The first memory cell includes a body region, a gate structure, a source region, and a drain region. The second memory cell includes a body region, a gate structure, a source region, and a drain region. In one embodiment, the body of the second memory cell is physically isolated from the body region of the first memory cell. A bitline segment is electrically connected to the drain region of the first memory cell and to the drain region of the second memory cell.

Abstract: A method for starting or stopping each of at least two separately controllable roll-sets (22, 26, 34, 56) used for processing a yarn (Y) in a stretch-break process, each roll-set comrpising at least two rolls, the method is characterized by the step of each roll-set, changing the speed of each roll from an initial condition to a steady state condition in accordance with a predetermined sequence and in coordination with a change in speed of at least one of the other rolls, such that simultaneous complete breakage of a yarn (Y) being processed in a stretch-break process is minimized.