Abstract: Integrated circuits are manufactured using a direct write lithography step to at least partially form at least one layer within the integrated circuit. The performance characteristics of an at least partially formed integrated circuit are measured and then the layout design to be applied with a direct write lithography step is varied in dependence upon those performance characteristics. Accordingly, the performance of an individual integrated circuit, wafer of integrated circuits or batch of wafers may be altered.

Abstract: Integrated circuits are manufactured using a direct write lithography step to at least partially form at least one layer within the integrated circuit. The performance characteristics of an at least partially formed integrated circuit are measured and then the layout design to be applied with a direct write lithography step is varied in dependence upon those performance characteristics. Accordingly, the performance of an individual integrated circuit, wafer of integrated circuits or batch of wafers may be altered.

Abstract: Various implementations described herein are directed to systems and methods for mitigating contact resistance. In one implementation, a method may include analyzing operating conditions for cells of an integrated circuit. The method may include selectively marking instances of the cells having timing degradation along a critical path of the integrated circuit. The method may include reducing contact resistance for the selectively marked instances of the cells having timing degradation.

Abstract: An integrated circuit device has at least one environment-hardened die and at least one less-environment-hardened die. Environment-hardened circuitry on the environment-hardened die is more resistant to the degradation when exposed to a predetermined environmental condition than the less-environment-hardened circuitry on the environment-hardened die. The dice are combined using a 3D or 2.5D integrated circuit technology. This is very useful for testing circuits at adverse environmental conditions (e.g. high temperature), or for providing circuits to operate at such conditions.

Abstract: Integrated circuits are manufactured using a direct write lithography step to at least partially form at least one layer within the integrated circuit. The performance characteristics of an at least partially formed integrated circuit are measured and then the layout design to be applied with a direct write lithography step is varied in dependence upon those performance characteristics. Accordingly, the performance of an individual integrated circuit, wafer of integrated circuits or batch of wafers may be altered.

Abstract: An integrated circuit is formed using an lithographic process including a stage of forming a lithographic layer from a plurality of separately printed pattern layers. Within the integrated circuit there is formed a circuit including at least two devices that are matched devices such that the performance of the circuit is degraded if the match devices deviate from having matched performance characteristics. Dummy contacts 32 (structural features) are provided within the circuit design so as to force allocation of functional contacts (structural features) of the matched devices into the same pattern layer thereby reducing inter-device variation in contact position and/or size.

Abstract: A monitoring circuit 14, 16, 18, 20, 22 for monitoring an operating parameter of an integrated circuit 2 comprises a ring oscillator circuit 80 comprising a plurality of serially connected inverting stages 82-1, 82-2, 82-3. At least one of the inverting stages 82-1, 82-2 comprises at least one leakage transistor 64-1, 64-2 which is configured to operate in a leakage mode in which substantially all current through the at least one leakage transistor is a leakage current, and a capacitive element 70-1 arranged to be charged or discharged in dependence on the leakage current. The ring oscillator circuit 80 thus generates an oscillating signal with an oscillation period dependent on a rate at which the capacitive element 70-1 is charged or discharged. The operating parameter controls a magnitude of the leakage current so that the oscillation period indicates the operating parameter.

Abstract: An integrated circuit 2 is provided with one or more monitoring circuits 14, 16, 18, 20 in the form of ring oscillators 22. These ring oscillators 22 include a plurality of tri-state inverters 24, 26, 28 containing a current-limiting transistor 42 operating in a leakage mode. The leakage current through the transistor 42 is dependent upon an operating parameter of the integrated circuit 2 being monitored. Accordingly, the oscillation frequency Fosc of the ring oscillator 22 varies in dependence upon the operating parameter to be measured.

Abstract: An integrated circuit is formed using an lithographic process including a stage of forming a lithographic layer from a plurality of separately printed pattern layers. Within the integrated circuit there is formed a circuit including at least two devices that are matched devices such that the performance of the circuit is degraded if the match devices deviate from having matched performance characteristics. Dummy contacts 32 (structural features) are provided within the circuit design so as to force allocation of functional contacts (structural features) of the matched devices into the same pattern layer thereby reducing inter-device variation in contact position and/or size.

Abstract: An integrated circuit 2 is provided with one or more monitoring circuits 14, 16, 18, 20 in the form of ring oscillators 22. These ring oscillators 22 include a plurality of tri-state inverters 24, 26, 28 containing a current-limiting transistor 42 operating in a leakage mode. The leakage current through the transistor 42 is dependent upon an operating parameter of the integrated circuit 2 being monitored. Accordingly, the oscillation frequency Fosc of the ring oscillator 22 varies in dependence upon the operating parameter to be measured.

Abstract: A monitoring circuit 14, 16, 18, 20, 22 for monitoring an operating parameter of an integrated circuit 2 comprises a ring oscillator circuit 80 comprising a plurality of serially connected inverting stages 82-1, 82-2, 82-3.At least one of the inverting stages 82-1, 82-2 comprises at least one leakage transistor 64-1, 64-2 which is configured to operate in a leakage mode in which substantially all current through the at least one leakage transistor is a leakage current, and a capacitive element 70-1 arranged to be charged or discharged in dependence on the leakage current. The ring oscillator circuit 80 thus generates an oscillating signal with an oscillation period dependent on a rate at which the capacitive element 70-1 is charged or discharged. The operating parameter controls a magnitude of the leakage current so that the oscillation period indicates the operating parameter.

Abstract: An integrated circuit is formed using an lithographic process including a stage of forming a lithographic layer from a plurality of separately printed pattern layers. Within the integrated circuit there is formed a circuit including at least two devices that are matched devices such that the performance of the circuit is degraded if the match devices deviate from having matched performance characteristics. Dummy contacts 32 (structural features) are provided within the circuit design so as to force allocation of functional contacts (structural features) of the matched devices into the same pattern layer thereby reducing inter-device variation in contact position and/or size.

Abstract: A method of forming an integrated circuit 68 provides over a diffusion region 28 on a substrate 26 a gate electrode 36. A source electrode is provided by a source local interconnect conductor 30 and a drain electrode is provided by a drain local interconnect conductor 32. An insulator layer 38 is formed over these electrodes and respective electrode openings are formed through the insulator layer 38 so as to provide electrical connection to a Metal1 layer 46, 48, 50. The etching process for the electrode openings is controlled such that the maximum etching depth is insufficient to penetrate through the insulating layer 38 and accordingly short circuit a gate insulator layer 34 provided between the diffusion region 28 and the gate electrode 36. Thus, the gate opening may be positioned over the diffusion region 28.

Abstract: A method of forming an integrated circuit 68 provides over a diffusion region 28 on a substrate 26 a gate electrode 36. A source electrode is provided by a source local interconnect conductor 30 and a drain electrode is provided by a drain local interconnect conductor 32. An insulator layer 38 is formed over these electrodes and respective electrode openings are formed through the insulator layer 38 so as to provide electrical connection to a Metal1 layer 46, 48, 50. The etching process for the electrode openings is controlled such that the maximum etching depth is insufficient to penetrate through the insulating layer 38 and accordingly short circuit a gate insulator layer 34 provided between the diffusion region 28 and the gate electrode 36. Thus, the gate opening may be positioned over the diffusion region 28.