Abstract: Several embodiments for ejecting a SIM tray from an electronic device are disclosed. In some embodiments, a lever positioned behind the tray can be actuated to eject the tray. In some embodiments, a pivot mechanism can be actuated to eject the tray. In other embodiments, a gear mechanism can be actuated to eject the tray. In other embodiments, a spring element can be actuated to eject the tray. In some embodiments, the electronic device may include a key feature that allows the tray to eject only when a tool is used having a mating key feature with the key feature of the electronic device.

Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

Abstract: An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.

Abstract: This application relates to methods and apparatus pertaining to a SIM tray that includes a deformable portion. When the SIM tray is subjected to stresses that result from tolerance stacking, the deformable portion accommodates the differences tolerance errors by allowing the non-deformable portion of the SIM tray to move substantially independently from one another. Creating the deformable portion can be accomplished by utilizing materials with lower relative moduli of elasticity, dovetails, magnets, or other means.

Abstract: This application relates generally to battery removal apparatuses. For example, one battery removal apparatus disclosed herein comprises a pull tab configured to be disposed between a battery and a casing of a portable computing device. The pull tab is shaped such that at least one area of the battery and the casing are exposed to one another when the battery, the pull tab and the casing are compressed together. An adhesive layer is shaped to cover the at least one exposed area such that the battery adheres to the casing, and the pull tab is reinforced so as to prevent the pull tab from tearing when used to remove the battery from the portable computing device. Other battery removal apparatuses include a pull string battery removal apparatus as well as a battery removal apparatus that incorporates both a pull tab and one or more pull strings.

Abstract: This application relates to methods and apparatus pertaining to a SIM tray that includes a deformable portion. When the SIM tray is subjected to stresses that result from tolerance stacking, the deformable portion accommodates the differences tolerance errors by allowing the non-deformable portion of the SIM tray to move substantially independently from one another. Creating the deformable portion can be accomplished by utilizing materials with lower relative moduli of elasticity, dovetails, magnets, or other means.

Abstract: This application relates to batteries that are capable of routing signals that are separate from the charge supplied by the batteries. In some embodiments, a battery can incorporate a conductive trace that extends through a portion of the battery to allow for signals to be routed through the battery, as opposed to around the battery. The conductive trace can be a single wire, multiple wires, a coaxial trace, optical cable, or any other mechanism for allowing a signal to be transmitted between one or more components. By providing the conductive trace within the battery, shorter pathways to components can be created thereby reducing signal or power loss over the pathways.

Abstract: In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations.

Abstract: The subject matter of the disclosure relates to connectors for antenna feed assemblies and display coupling components of a mobile device. The flexible connectors can be configured with a flexible spring connector component that couples a mobile device antenna to a main logic board of the mobile device within a housing of the mobile device such that the flexible connector can withstand a drop event, while at the same providing for an in-line inductance as part of an antenna-defined design requirement. The display of the mobile device can be coupled to a housing of the mobile device using a pin-screw arrangement that allows the display to controllably shift in the X-direction and the Y-direction, while only being purposefully constrained in the Z-direction (with reference to a 3-dimensional graph having X, Y, and Z axes). This configuration can prevent the display from being pulled out of alignment during a drop event.

Abstract: The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.

Abstract: The subject matter of the disclosure relates to connectors for antenna feed assemblies and display coupling components of a mobile device. The flexible connectors can be configured with a flexible spring connector component that couples a mobile device antenna to a main logic board of the mobile device within a housing of the mobile device such that the flexible connector can withstand a drop event, while at the same providing for an in-line inductance as part of an antenna-defined design requirement. The display of the mobile device can be coupled to a housing of the mobile device using a pin-screw arrangement that allows the display to controllably shift in the X-direction and the Y-direction, while only being purposefully constrained in the Z-direction (with reference to a 3-dimensional graph having X, Y, and Z axes). This configuration can prevent the display from being pulled out of alignment during a drop event.

Abstract: This application relates to methods and apparatus pertaining to a SIM tray that includes a deformable portion. When the SIM tray is subjected to stresses that result from tolerance stacking, the deformable portion accommodates the differences tolerance errors by allowing the non-deformable portion of the SIM tray to move substantially independently from one another. Creating the deformable portion can be accomplished by utilizing materials with lower relative moduli of elasticity, dovetails, magnets, or other means.

Abstract: In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations.

Abstract: Connectors that may provide an improved reliability by having a reduced tendency for damage to their contacts and may have a reduced size and complexity. One example may provide a magnetic connector having a magnetic pin. The magnetic pin may have a plunger that may remain protected in a barrel and housing when the magnetic connector is not engaged with a corresponding connector. When the magnetic connector is engaged with a corresponding connector, the plunger may be magnetically attracted to a corresponding contact on the corresponding connector and may emerge from the barrel or housing to make an electrical connection between the plunger and the corresponding contact.

Abstract: An antenna may be formed from a peripheral conductive housing structure in an electronic device that is separated from an antenna ground by a gap. An antenna feed may be formed from a metal trace on a flexible printed circuit that spans the gap. The metal trace may have a line segment that joins a wider pad portion of the trace at a junction. A stiffener on the flexible printed circuit may have a protrusion that overlaps the junction. A metal bracket attached to the peripheral housing structure may be soldered to the pad. A metal member with meandering paths may form a return path in the antenna. The meandering path may have parallel segments that extend along an inner surface of the peripheral conductive housing structure to prevent the metal member from rotating when a screw is used to screw the metal member to the peripheral conductive housing structure.

Abstract: Several embodiments for ejecting a SIM tray from an electronic device are disclosed. In some embodiments, a lever positioned behind the tray can be actuated to eject the tray. In some embodiments, a pivot mechanism can be actuated to eject the tray. In other embodiments, a gear mechanism can be actuated to eject the tray. In other embodiments, a spring element can be actuated to eject the tray. In some embodiments, the electronic device may include a key feature that allows the tray to eject only when a tool is used having a mating key feature with the key feature of the electronic device.

Abstract: The subject matter of the disclosure relates to connectors for antenna feed assemblies and display coupling components of a mobile device. The flexible connectors can be configured with a flexible spring connector component that couples a mobile device antenna to a main logic board of the mobile device within a housing of the mobile device such that the flexible connector can withstand a drop event, while at the same providing for an in-line inductance as part of an antenna-defined design requirement. The display of the mobile device can be coupled to a housing of the mobile device using a pin-screw arrangement that allows the display to controllably shift in the X-direction and the Y-direction, while only being purposefully constrained in the Z-direction (with reference to a 3-dimensional graph having X, Y, and Z axes). This configuration can prevent the display from being pulled out of alignment during a drop event.

Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.

Abstract: An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.

Abstract: An electronic device may have electrical components mounted on substrates such as printed circuits. The electrical components may include magnetic components such as inductors. A metal shielding can may be provided with a magnetic shielding layer to shield the magnetic components. The magnetic shielding layer may be formed on an inner surface of the metal shielding can. The magnetic shielding layer may include a ferromagnetic layer that is attached to the inner surface by a layer of adhesive. An insulating coating may be formed on the lower surface of the ferromagnetic layer to prevent shorts. An insulating layer for the lower surface of the ferromagnetic layer may be formed form a layer of polymer that is attached to the ferromagnetic layer with adhesive. The shielding can with magnetic shielding may withstand solder reflow temperatures, allowing the shielding can to be soldered to a printed circuit to shield an electrical component.