Abstract: An electronic device contains electrical components. An electrical component is mounted to an electronic device housing using mounting structures. The mounting structures include a flexible printed circuit jumper having opposing ends with metal contact pads. Metal traces in the flexible printed circuit jumper form contact traces within openings in a solder mask layer. Solder in the openings may be used to connect the metal contact pads to the contact traces. A metal bracket may be screwed into the electronic device housing to mount the electrical component to the electronic device housing. The metal bracket may press the metal contact pads on one end of the jumper against mating contact terminals on the electrical component and may press the metal contacts on the other end of the jumper against mating contact pads on an additional printed circuit.

Abstract: Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.

Abstract: Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.

Abstract: The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.

Abstract: Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.

Abstract: This application relates generally to battery removal apparatuses. For example, one battery removal apparatus disclosed herein comprises a pull tab configured to be disposed between a battery and a casing of a portable computing device. The pull tab is shaped such that at least one area of the battery and the casing are exposed to one another when the battery, the pull tab and the casing are compressed together. An adhesive layer is shaped to cover the at least one exposed area such that the battery adheres to the casing, and the pull tab is reinforced so as to prevent the pull tab from tearing when used to remove the battery from the portable computing device. Other battery removal apparatuses include a pull string battery removal apparatus as well as a battery removal apparatus that incorporates both a pull tab and one or more pull strings.

Abstract: Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.

Abstract: An electronic device contains electrical components. An electrical component is mounted to an electronic device housing using mounting structures. The mounting structures include a flexible printed circuit jumper having opposing ends with metal contact pads. Metal traces in the flexible printed circuit jumper form contact traces within openings in a solder mask layer. Solder in the openings may be used to connect the metal contact pads to the contact traces. A metal bracket may be screwed into the electronic device housing to mount the electrical component to the electronic device housing. The metal bracket may press the metal contact pads on one end of the jumper against mating contact terminals on the electrical component and may press the metal contacts on the other end of the jumper against mating contact pads on an additional printed circuit.

Abstract: A portable electronic device comprises an electromechanical module having an actuator for positioning a mechanical element between first and second positions, and a controller coupled to the electromechanical module. The controller is configured to detect a mechanical event coupling to the electromechanical module, select an actuation signal to position the mechanical element in a safe position between the first and second positions, and transmit the selected signal, such that the mechanical element is positioned in the safe position during the event.

Abstract: Threaded standoff structures may be provided with features that control the flow of solder. A base structure for a standoff may be formed from a solderphobic material such as brass. A through hole may be formed in the base structure. The base structure may be coated with a solderphilic material such as an inner layer of nickel and an outer layer of tin. A tapping tool may be used to remove the solderphilic material from the opening by tapping threads into the opening, thereby exposing the underlying base metal of the standoff in the opening. During attachment to a substrate such as a printed circuit board, the standoff may be exposed to molten solder. The solderphilic coating on the outer surface of the standoff may attract the molten solder, whereas the solderphobic base metal in the threaded opening may help prevent solder from contaminating the threads in the opening.