Abstract: Embodiments of the invention are directed to a self-sanitizing structure that includes a body region having a contact surface that can be contacted by a person during an intended use of the self-sanitizing structure. The self-sanitizing structure further includes an energy source configured to generate electromagnetic radiation and direct the electromagnetic radiation through the body region to the contact surface. The body region is configured to scatter the electromagnetic radiation and pass the scattered electromagnetic radiation to the contact surface in a manner that maintains the scattered electromagnetic radiation that reaches the contact surface as sanitizing electromagnetic radiation. The sanitizing electromagnetic radiation is electromagnetic radiation that is at or above a minimum irradiance level that neutralizes infectious agents.

Abstract: Embodiments of the invention include a self-sanitizing structure and method of forming the same, where the self-sanitizing structure includes a body having a contact surface that can be contacted by a person, along with an energy source formed as an array of addressable energy sources. The energy source generates electromagnetic radiation and directs the electromagnetic radiation through the body to the contact surface. The body scatters the electromagnetic radiation and passes it through the body to the contact surface in a manner that maintains the scattered electromagnetic radiation that reaches the contact surface as sanitizing electromagnetic radiation at or above a minimum irradiance level that neutralizes infectious agents. A sensor system generates touch data in response to the contact surface being touched, and a controller uses the touch data to control the addressable energy sources.

Abstract: Electrical circuitry is produced on the surface of an organic polymer. The electrical circuitry is produced on a support, and a polymerizable composition is brought into contact with the support and the circuitry. The polymerizable composition is polymerized while in contact with support and the circuitry to produce a solid, organic polymer. The electrical circuitry becomes adhered to and partially embedded in a surface of the solid organic polymer. The support may be removed subsequent to the polymerization step to expose the circuitry at the surface of the solid organic polymer.

Abstract: A conductive structure is fabricated on a substrate (either flexible or rigid) by first printing a precursor seed layer of a conductive ink, then electroplating a highly conductive metal such as Cu or Ag onto the precursor. The plated layer has a conductivity approaching that of the bulk metal. To improve the uniformity of plating, an intervening layer of electroless metal may be deposited onto the precursor prior to electroplating. The structure may be used for applications such as coils used in a wireless power transfer system.

Abstract: A panel to enhance telecommunication signal range includes a base sheet. A reflector on a side of the base sheet reflects a telecommunication signal that is of a predetermined wavelength and that is incident on the base sheet. A reflected telecommunication signal is reflected in a predetermined direction, and the attenuation loss in the reflected telecommunication signal is less than a predetermined threshold. Methods to manufacture such panels are also described.

Abstract: The invention provides a polymer-polymer composite polishing method comprising a polishing layer having a polishing surface for polishing or planarizing a substrate. The method includes attaching a polymer-polymer composite having a polishing layer and a polymeric matrix. The polymer matrix has fluoropolymer particles embedded in the polymeric matrix. Then a cationic particle slurry is applied to the polymer-polymer composite polishing pad. Conditioning the polymer-polymer composite polishing pad with an abrasive cuts the polymer-polymer composite polishing pad; and rubbing the cut polymer-polymer composite polishing pad against the substrate forms the polishing surface. The polishing surface has a fluorine concentration measured in atomic percent at a penetration depth of 1 to 10 nm of at least ten percent higher than the bulk fluorine concentration measured with at a penetration depth of 1 to 10 ?m to polish or planarize the substrate.

Abstract: Embodiments of the invention are directed to a self-sanitizing structure that includes a body region having a contact surface that can be contacted by a person during an intended use of the self-sanitizing structure. The self-sanitizing structure further includes an energy source configured to generate electromagnetic radiation and direct the electromagnetic radiation through the body region to the contact surface. The body region is configured to scatter the electromagnetic radiation and pass the scattered electromagnetic radiation to the contact surface in a manner that maintains the scattered electromagnetic radiation that reaches the contact surface as sanitizing electromagnetic radiation. The sanitizing electromagnetic radiation is electromagnetic radiation that is at or above a minimum irradiance level that neutralizes infectious agents.

Abstract: Embodiments of the invention are directed to a self-sanitizing structure that includes a body having a contact surface that can be contacted by a person, along with an energy source formed as an array of addressable energy sources. The energy source generates electromagnetic radiation and direct the electromagnetic radiation through the body to the contact surface. A sensor system is coupled to the contact surface, and a controller is coupled to the energy source and the sensor system. The body scatters the electromagnetic radiation and passes it through the body to the contact surface in a manner that maintains the scattered electromagnetic radiation that reaches the contact surface as sanitizing electromagnetic radiation at or above a minimum irradiance level that neutralizes infectious agents. The sensor system generates touch data in response to the contact surface being touched, and the controller uses the touch data to control the addressable energy sources.

Abstract: A conductive structure is fabricated on a substrate (either flexible or rigid) by first printing a precursor seed layer of a conductive ink, then electroplating a highly conductive metal such as Cu or Ag onto the precursor. The plated layer has a conductivity approaching that of the bulk metal. To improve the uniformity of plating, an intervening layer of electroless metal may be deposited onto the precursor prior to electroplating.

Abstract: A conductive structure is fabricated on a substrate (either flexible or rigid) by first printing a precursor seed layer of a conductive ink, then electroplating a highly conductive metal such as Cu or Ag onto the precursor. The plated layer has a conductivity approaching that of the bulk metal. To improve the uniformity of plating, an intervening layer of electroless metal may be deposited onto the precursor prior to electroplating. The structure may be used for applications such as inductive sensors.

Abstract: A conductive structure is fabricated on a substrate (either flexible or rigid) by first printing a precursor seed layer of a conductive ink, then electroplating a highly conductive metal such as Cu or Ag onto the precursor. The plated layer has a conductivity approaching that of the bulk metal. To improve the uniformity of plating, an intervening layer of electroless metal may be deposited onto the precursor prior to electroplating. The structure may be used for applications such as coils used in a wireless power transfer system.

Abstract: A solid surface comprises (i) a crosslinked acrylic or unsaturated polyester resin present in an amount no greater than 52 volume fraction percent, and (ii) no greater than 48 volume fraction percent of inorganic filler particles distributed evenly throughout the solid surface wherein (a) 95-99 volume fraction percent of the filler particles has a major dimension in the range of from 0.5 to no greater than 10 microns, (b) the D50 of the filler particles is from 0.5-2.5 microns, and (c) the D90 of the filler particles is equal to or less than 10 microns.

Abstract: The invention provides a polymer-polymer composite polishing pad comprising a polishing layer having a polishing surface for polishing or planarizing a substrate. A polymeric matrix forms the polishing layer. Fluoropolymer particles are embedded in the polymeric matrix. Wherein diamond abrasive materials cut the fluoropolymer particles and rubbing the cut fluoropolymer against a patterned silicon wafer forms a thin film covering at least a portion of the polishing layer and the thin film has a zeta potential more negative than the polymeric matrix at a pH of 7. The polishing surface formed from rubbing with the wafer has a fluorine concentration at a penetration depth of 1 to 10 nm of at least ten atomic percent higher than the bulk fluorine concentration at a penetration depth of 1 to 10 ?m.

Abstract: The invention provides a polymer-polymer composite polishing method comprising a polishing layer having a polishing surface for polishing or planarizing a substrate. The method includes attaching a polymer-polymer composite having a polishing layer and a polymeric matrix. The polymer matrix has fluoropolymer particles embedded in the polymeric matrix. Then a cationic particle slurry is applied to the polymer-polymer composite polishing pad. Conditioning the polymer-polymer composite polishing pad with an abrasive cuts the polymer-polymer composite polishing pad; and rubbing the cut polymer-polymer composite polishing pad against the substrate forms the polishing surface. The polishing surface has a fluorine concentration measured in atomic percent at a penetration depth of 1 to 10 nm of at least ten percent higher than the bulk fluorine concentration measured with at a penetration depth of 1 to 10 ?m to polish or planarize the substrate.

Abstract: A puncture-resistant, electrically-energized sheet heater comprises a conductive polymeric film laminated between a top puncture-resistant, polymeric protective layer and a bottom backing layer that may comprise an insulated backing layer of extruded polystyrene closed-cell foam board. The heater is appointed to be placed beneath, or embedded in, a pavement material, and energized to provide heat to remove frozen precipitation from the pavement, or prevent it from accumulating thereon.

Abstract: An electrically-energized heater comprises a sheet heater element and a control element in thermal communication therewith. Certain embodiments make the heater self-limiting.

Abstract: A voltage detecting glove comprises a glove liner and an outer glove shell. A conductive antenna is disposed inside the outer glove shell but separated from the glove liner by a buffer. The antenna is connected to electronic circuitry configured to sense a voltage indicative of the proximity of the antenna to an AC electric field resulting from energized AC source, and to activate an alarm if the strength of the field exceeds a preselected threshold limit.

Abstract: A voltage detecting glove comprises a glove liner and an outer glove shell. A conductive antenna is disposed inside the outer glove shell but separated from the glove liner by a buffer. The antenna is connected to electronic circuitry configured to sense a voltage indicative of the proximity of the antenna to an AC electric field resulting from energized AC source, and to activate an alarm if the strength of the field exceeds a preselected threshold limit.

Abstract: A solid surface comprises (i) a crosslinked acrylic or unsaturated polyester resin present in an amount no greater than 51 or 52 volume fraction percent, and (ii) no greater than 48 or 49 volume fraction percent of inorganic filler particles that are modified with discrete functional particles that are bound, or adhered to the filler particles, the filler particles being distributed evenly throughout the solid surface wherein (a) 95-99 volume fraction percent of the filler particles has a major dimension in the range of from 0.5 to no greater than 10 microns, (b) the D50 of the filler particles is from 0.5-2.5 microns, (c) the D90 of the filler particles is equal to or less than 10 microns and (d) the filler particles are modified with discrete functional particles that are bound, or adhered to the filler particles.

Abstract: A solid surface comprises (i) a crosslinked acrylic or unsaturated polyester resin present in an amount no greater than 52 volume fraction percent, and (ii) no greater than 48 volume fraction percent of inorganic filler particles distributed evenly throughout the solid surface wherein (a) 95-99 volume fraction percent of the filler particles has a major dimension in the range of from 0.5 to no greater than 10 microns, (b) the D50 of the filler particles is from 0.5-2.5 microns, and (c) the D90 of the filler particles is equal to or less than 10 microns.