Abstract: A memory device and an operation method thereof are provided. The operation method includes: when a read operation or a write-verify operation is completed, during a word line voltage lowering phase, synchronously applying a plurality of different gradually lowering signal line reference voltages to a plurality of ground select lines and a plurality of string select lines, wherein values of the different gradually lowering signal line reference voltages are corresponding to a plurality of signal line positions of the ground select lines and the string select lines.

Abstract: A memory device and an operation method thereof are disclosed. The memory device includes a P-well region, a common source line, a ground selection line, at least one dummy ground selection line, a plurality of word lines, at least one dummy string selection line, a string selection line, at least one bit line and at least one memory string. The gates of a plurality of memory cells of the memory string are connected to the word lines. The operation method includes the following steps. Performing a read operation and applying a read voltage on the selected word line. Applying a pass voltage on other unselected word lines and the ground selection lines, etc. Before ending of the read operation, firstly decreasing voltages of the string selection line and the dummy string selection line in advance, then increasing voltage of the bit line.

Abstract: A memory device includes a substrate, a laminated structure and a memory string. The laminated structure is disposed on the substrate. The laminated structure includes a plurality of insulating layers and a plurality of conductive layers alternately stacked along a first direction. The memory string is accommodated in the laminated structure along the first direction. The memory string includes a memory layer and a channel layer, and the memory layer is disposed between the laminated structure and the channel layer. At least a portion of the memory layer and the insulating layers are overlapped along the first direction.

Abstract: A memory device and an operation method thereof are provided. The operation method includes: when a read operation or a write-verify operation is completed, during a word line voltage lowering phase, synchronously applying a plurality of different gradually lowering signal line reference voltages to a plurality of ground select lines and a plurality of string select lines, wherein values of the different gradually lowering signal line reference voltages are corresponding to a plurality of signal line positions of the ground select lines and the string select lines.

Abstract: A three-dimensional memory structure and a manufacturing method for the same are provided. The three-dimensional memory structure includes a channel layer, gate electrode layers and charge trapping layers. The charge trapping layers are between a channel sidewall surface of the channel layer and electrode sidewall surfaces of the gate electrode layers. The charge trapping layers are arranged in a discontinuous manner along a direction.

Abstract: A signal modulation apparatus, a memory storage apparatus, and a signal modulation method are disclosed. The signal modulation apparatus includes an observation circuit, a signal modulation circuit, and a phase control circuit. The signal modulation circuit is configured to generate a second signal according to a first signal and a reference clock signal. A frequency of the first signal is different from a frequency of the second signal. The phase control circuit is configured to obtain an observation information via the observation circuit. The observation information reflects a process variation of at least one electronic component in the signal modulation apparatus. The phase control circuit is further configured to control an offset between the first signal and the reference clock signal according to the observation information.

Abstract: A signal modulation apparatus, a memory storage apparatus, and a signal modulation method are disclosed. The signal modulation apparatus includes an observation circuit, a signal modulation circuit, and a phase control circuit. The signal modulation circuit is configured to generate a second signal according to a first signal and a reference clock signal. A frequency of the first signal is different from a frequency of the second signal. The phase control circuit is configured to obtain an observation information via the observation circuit. The observation information reflects a process variation of at least one electronic component in the signal modulation apparatus. The phase control circuit is further configured to control an offset between the first signal and the reference clock signal according to the observation information.

Abstract: A memory device includes a substrate, a laminated structure and a memory string. The laminated structure is disposed on the substrate. The laminated structure includes a plurality of insulating layers and a plurality of conductive layers alternately stacked along a first direction. The memory string is accommodated in the laminated structure along the first direction. The memory string includes a memory layer and a channel layer, and the memory layer is disposed between the laminated structure and the channel layer. At least a portion of the memory layer and the insulating layers are overlapped along the first direction.

Abstract: An operation method of a memory device is provided. The memory device includes P-type well, a common source line, a memory array, a plurality of word lines, and a serial selection line, a ground selection line, and at least one bit line. The word lines include a first word line and a second word line that are programmed and not adjacent to each other. The operation method includes the following steps. A read voltage is applied to a selected word line. A pass voltage is applied to unselected word lines, and the read voltage is less than the pass voltage. During a period when the pass voltage ramps down to a lower level before the end of a read operation, a channel potential of the memory string is down-coupled, a hole current is injected to flow from the P-type well to the memory string to neutralize the channel potential.

Abstract: Provided is an operation method for a memory device, comprising: preparing to program a target word line; judging whether at least one memory cell of a plurality of memory cells of an adjacent word line is to be programmed to a first target state; and based on whether the at least one memory cell of the memory cells of the adjacent word line is to be programmed to the first target state, determining to program the adjacent word line first or to program the target word line first.

Abstract: An operating method of a non-volatile memory includes: generating a first programming pulse with a first time period to a target memory cell in a memory array; reading and verifying whether a threshold voltage of the target memory cell reaches a target voltage level; and generating a second programming pulse with a second time period to the target memory cell when the threshold voltage of the target memory cell does not reach the target voltage level, wherein the second time period is longer than the first time period.

Abstract: A memory device includes a conductive strip stack structure having conductive strips and insulating layers stacked in a staggered manner and a channel opening passing through the conductive strips and the insulating layer; a memory layer disposed in the channel opening and overlying the conductive strips; a channel layer overlying the memory layer; a semiconductor pad extending upwards from a bottom of the channel opening beyond an upper surface of a bottom conductive strip, in contact with the channel layer, and electrically isolated from the conductive strips; wherein the channel layer includes a first portion having a first doping concentration and a second portion having a second doping concentration disposed on the first portion.

Abstract: A memory device includes a semiconductor substrate, a stack, a charge storage structure, a blocking layer, a tunneling layer, and a channel layer. The stack is disposed on a principle surface of the semiconductor substrate and includes alternately arranged conductive layers and insulating layers. The charge storage structure includes bent storage structures or discrete storage segments. Each bent storage structure or each discrete storage segment is substantially aligned with a corresponding one of the conductive layers in a direction parallel to the principle surface. The blocking layer is at least partially interposed between the conductive layers and the bent storage structures or between the conductive layers and the discrete storage segments. The tunneling layer is disposed on the bent storage structures or the discrete storage segments. The channel layer is disposed on the tunneling layer.

Abstract: A memory device includes a conductive strip stack structure having conductive strips and insulating layers stacked in a staggered manner and a channel opening passing through the conductive strips and the insulating layer; a memory layer disposed in the channel opening and overlying the conductive strips; a channel layer overlying the memory layer; a semiconductor pad extending upwards from a bottom of the channel opening beyond an upper surface of a bottom conductive strip, in contact with the channel layer, and electrically isolated from the conductive strips; wherein the channel layer includes a first portion having a first doping concentration and a second portion having a second doping concentration disposed on the first portion.

Abstract: A semiconductor device includes a substrate including a doped region of a first doping concentration that extends downward from an upper surface of the substrate; a first stack on the upper surface, including first insulating layers and first conductive layers alternatively stacked, a first channel layer, a first memory layer and a first conductive connector configured to receive a first voltage, the first conductive connector on the first channel layer, having a second doping concentration; a second stack on the first stack including second insulating layers and second conductive layers alternatively stacked, a second channel layer, a second memory layer, the second conductive layer configured to receive the second voltage; a second conductive connector on the second channel layer, configured to receive an erasing voltage, the first conductive connector electrically connected to the first and second channel layers; the first doping concentration smaller than the second doping concentration.

Abstract: An operating method of a non-volatile memory includes: generating a first programming pulse with a first time period to a target memory cell in a memory array; reading and verifying whether a threshold voltage of the target memory cell reaches a target voltage level; and generating a second programming pulse with a second time period to the target memory cell when the threshold voltage of the target memory cell does not reach the target voltage level, wherein the second time period is longer than the first time period.

Abstract: A memory device comprises an array of two-transistor memory cells, two-transistor memory cells in the array including a vertical select transistor and a vertical data storage transistor. The array comprises a plurality of stacks of conductive lines, a stack of conductive lines including a select gate line and a word line adjacent the select gate line. The device comprises an array of vertical channel lines disposed through the conductive lines to a reference line, gate dielectric structures surrounding the vertical channel lines at channel regions of vertical select transistors in the array of vertical channel lines and the select gate lines, charge storage structures surrounding the vertical channel lines at channel regions of vertical data storage transistors in the array of vertical channel lines and the word lines, and bit lines coupled to the vertical channel lines via upper ends of the vertical channel lines.

Abstract: A programming operation for high density memory, like 3D NAND flash memory, modifies the waveforms applied during program operations to mitigate unwanted disturbance of memory cells not selected for programming during the operation. Generally, the method provides for applying a bias arrangement during an interval of time between program verify pass voltages and program pass voltages in a program sequence that can include a soft ramp down, and pre-turn-on voltages designed to reduce variations in the potential distribution on floating channels of unselected NAND strings during a program operation.

Abstract: A programming operation for high density memory, like 3D NAND flash memory, modifies the waveforms applied during program operations to mitigate unwanted disturbance of memory cells not selected for programming during the operation. Generally, the method provides for applying a bias arrangement during an interval of time between program verify pass voltages and program pass voltages in a program sequence that can include a soft ramp down, and pre-turn-on voltages designed to reduce variations in the potential distribution on floating channels of unselected NAND strings during a program operation.

Abstract: A memory device comprises an array of two-transistor memory cells, two-transistor memory cells in the array including a vertical select transistor and a vertical data storage transistor. The array comprises a plurality of stacks of conductive lines, a stack of conductive lines including a select gate line and a word line adjacent the select gate line. The device comprises an array of vertical channel lines disposed through the conductive lines to a reference line, gate dielectric structures surrounding the vertical channel lines at channel regions of vertical select transistors in the array of vertical channel lines and the select gate lines, charge storage structures surrounding the vertical channel lines at channel regions of vertical data storage transistors in the array of vertical channel lines and the word lines, and bit lines coupled to the vertical channel lines via upper ends of the vertical channel lines.