Abstract: An integrated display with antenna is used in wireless communications devices, including mobile phones and Augmented Reality and Virtual Reality (AR/VR) devices, to enhance radio frequency coverage while minimizing the overall sized of the wireless communication devices. The antenna's geometry can be precisely determined by manipulating the conductive and dielectric pixels within the display panel. The dielectric material within the display panel can be composed of metamaterials. Additionally, the antenna in the display panel can be structured as an antenna array. This array configuration optimizes mobile device coverage and performance by shaping and directing the radiation pattern of signals.

Abstract: A wireless hub includes a vehicle power connector that can draw power from a vehicle battery on a vehicle, a first wireless transmission circuit that can send or receive data with base stations in a long-range wireless network, a second wireless transmission circuit that can provide a short-range wireless network and to transfer data to and from electronic devices, and a network processor that can process data in the first wireless transmission circuit and the second wireless transmission circuit. The wireless hub has an antenna array for millimeter wave communications. Antenna array beamforming techniques can be applied in various wireless systems, including cellular networks, Wi-Fi, radar systems, and satellite communications, to improve coverage, capacity, and link quality. Using antenna arrays, the system can shape and direct the radiation pattern of the transmitted or received signal. Beam steering can steer the main lobe of the radiation pattern in a particular direction.

Abstract: The wireless RF semiconductor system is described for use in wireless communication devices that operate in frequency range from 6 GHz to 100 GHz. The system comprises of at least one RF antenna and at least one active RF component fabricated (or built) on the same semiconductor substrate inside a one single packaged module. The wireless RF semiconductor system is described in a variety of different configurations with its functionality divided up over several single chip circuits. The system simplifies assembly, reduces size and cost, and allows for a quick time to market, while maximizing the RF performance demanded by fixed and mobile 4G, 5G and other wireless standards. The system uses a novel idea of design and packaging of active and passive RF components into a single package. This in turn allows RF designers to unlock the potential of very high frequencies operation that were previously thought too expensive and/or unattainable to average user.

Abstract: An antenna element comprises one or more directors, a resonator, and a three dimensional ground assembly. Parts of the antenna element are arranged on three metal layers. A top layer has an unconnected metal bar which forms a beam director, a resonator and a top part of the ground assembly. The resonator is an integral piece substantially in the form of a loop connected to a feed line and a feed line terminal ending. The feed line terminal ending serves as the ground plane for the feed line as well as providing impedance matching from the external transceiver circuit to the resonator. The ground assembly includes a top layer ground connected to a plurality of metallized half cylindrical hole channels (or metallized via holes) which connect to a ground terminal in a bottom layer.

Abstract: A communication device comprising: a first unit having a first antenna, a second antenna, and a first signal transmitting and receiving circuitry; a second unit having a third antenna, a fourth antenna, and a second signal transmitting and receiving circuitry, wherein the second unit is located in proximity to the first unit; and wherein the second unit is capable of receiving signals at a first signal frequency, down converting the signals to a second signal frequency, and relaying the signals through a barrier to the first unit. Wherein the first signal frequency is in the millimeter wave range and the second signal frequency is in the microwave range.

Abstract: A communication device comprising: a first unit having a first antenna, a second antenna, and a first signal transmitting and receiving circuitry; a second unit having a third antenna and a fourth antenna and wherein the second unit is located in proximity to the first unit; wherein the second unit is capable of receiving a first radio frequency (RF) signal at a first frequency, amplifying the first RF signal in a second unit low noise amplifier (LNA), and autonomously transmitting the first RF signal through a barrier to the first unit; and wherein the first unit is capable of transmitting signals at the first frequency to a wireless device. The communication device is capable of operating in a first mode by communicating with a terrestrial base station and in a second mode with a satellite.

Abstract: An antenna element comprises one or more directors, a resonator, and a three dimensional ground assembly. Parts of the antenna element are arranged on three metal layers. A top layer has an unconnected metal bar which forms a beam director, a resonator and a top part of the ground assembly. The resonator is an integral piece substantially in the form of a loop connected to a feed line and a feed line terminal ending. The feed line terminal ending serves as the ground plane for the feed line as well as providing impedance matching from the external transceiver circuit to the resonator. The ground assembly includes a top layer ground connected to a plurality of metallized half cylindrical hole channels (or metallized via holes) which connect to a ground terminal in a bottom layer.

Abstract: A wireless hub includes a vehicle power connector that can draw power from a vehicle battery on a vehicle, a first wireless transmission circuit that can send or receive data with base stations in a long-range wireless network, a second wireless transmission circuit that can provide a short-range wireless network and to transfer data to and from electronic devices, and a network processor that can process data in the first wireless transmission circuit and the second wireless transmission circuit. The wireless hub has an antenna array for millimeter wave communications.

Abstract: When it comes to monitoring human health, today's consumers are limited to so called “health trackers,” which count steps and calculate calorie burns. Traditional health trackers are only capable of measuring heart rate and are limited to external measurements. These devices are not capable of obtaining the internal body data and do not have access to human fluids. The personal health shield personal cloud case cover (or “health PCCC”) can not only analyze human fluids but also fluids being consumed by the user (food and drinks). The data collected from the fluids is then compared to a cloud or local data base. The results are displayed on a phone, tablet, personal computers, television, or any other device either mounted in the PCCC or connected to the health PCCC.

Abstract: A radio frequency (RF) front end device has a signal traveling from a first antenna to a second antenna in an uplink path and a signal traveling from a third antenna to a fourth antenna in a downlink path. The device is under the control of automatic on/off controller (AOOC) which upon receiving a signal indication from a receive signal detector and amplifier (RSDA) turns on the operations of power amplifier (PA) and simultaneously turns off a low noise amplifier (LNA). This LNA is turned off when the power amplifier is turned on to prevent uplink path and downlink path forming a feedback loop which would result in oscillation, noise and interference.

Abstract: The wireless RF semiconductor system is described for use in wireless communication devices that operate in frequency range from approximately 6 GigaHertz (GHz) to 100 GHz. The system comprises of at least one RF antenna and at least one RF integrated circuit fabricated (or built) on the same semiconductor substrate inside a one single packaged module. The wireless RF semiconductor system is described in a variety of different configurations with its functionality divided up over several single chip circuits. The system simplifies assembly, reduces size and cost, and allows for a quick time to market, while maximizing the RF performance demanded by fixed and mobile 4G, 5G and other wireless standards. The system uses a novel idea of configuration and packaging of active and passive RF components into a single module. This in turn allows RF manufacturers to unlock the potential of very high frequencies operation that were previously thought too expensive and unattainable to average user.

Abstract: A Handy Base Station (HBS) which is capable of connecting through a base portion into a power socket (e.g., lamp socket). The HBS may have a plurality of functional modules capable of being detachably mounted in a housing. One of the functional modules may be a light emitter such as a light emitting diode (LED). Another module may be a a communication module which may communicate using a wire line or wirelessly using standard wireless communication protocols. Further disclosed is a combination unit which has the HBS located on a pole such as a utility pole with a landing pad for an unmanned aerial vehicle (UAV) to allow the UAV a recharging location between deliveries and to allow the HBS to guide the UAV on its flight.

Abstract: An antenna element comprises one or more directors, a resonator, and a three dimensional ground assembly. Parts of the antenna element are arranged on three metal layers. A top layer has an unconnected metal bar which forms a beam director, a resonator and a top part of the ground assembly. The resonator is an integral piece substantially in the form of a loop connected to a feed line and a feed line terminal ending. The feed line terminal ending serves as the ground plane for the feed line as well as providing impedance matching from the external transceiver circuit to the resonator. The ground assembly includes a top layer ground connected to a plurality of metallized half cylindrical hole channels (or metallized via holes) which connect to a ground terminal in a bottom layer.

Abstract: A touch display device, including a substrate and multiple light-emitting units bonded to the substrate, is provided. Each of the multiple light-emitting units includes at least one light-emitting element. A first light-emitting unit of the multiple light-emitting units includes at least one sensing element. In the first light-emitting unit, the at least one sensing element is located between the at least one light-emitting element and the substrate. The orthographic projection of the at least one sensing element on the substrate overlaps the orthographic projection of the at least one light-emitting element on the substrate.

Abstract: A communication device comprising: a first unit having a first antenna, a second antenna, and a first signal transmitting and receiving circuitry; a second unit having a third antenna, a fourth antenna, and a second signal transmitting and receiving circuitry, wherein the second unit is located in proximity to the first unit; and wherein the second unit is capable of receiving signals at a first signal frequency, down converting the signals to a second signal frequency, and relaying the signals through a barrier to the first unit. Wherein the first signal frequency is in the millimeter wave range and the second signal frequency is in the microwave range.

Abstract: A touch display device, including a substrate and multiple light-emitting units bonded to the substrate, is provided. Each of the multiple light-emitting units includes at least one light-emitting element. A first light-emitting unit of the multiple light-emitting units includes at least one sensing element. In the first light-emitting unit, the at least one sensing element is located between the at least one light-emitting element and the substrate. The orthographic projection of the at least one sensing element on the substrate overlaps the orthographic projection of the at least one light-emitting element on the substrate.

Abstract: The present disclosure relates generally to instantaneous communication network systems and methods and, in particular, in one or more embodiments, the present disclosure relates to a first multi-mode and multi-frequency communication device capable of connecting directly with a proximate second first multi-mode and multi-frequency communication device. A display screen on the communication device is capable of displaying icons and avatars over a map to show other communication devices which are proximate.

Abstract: An antenna array for millimeter wave communications with a cell tower having a base station which allow for penetration of signals within a vehicle, building, glass or the like. In alternative embodiments, it may be a plurality of antenna arrays in communication with a base station (or cell tower) to provide 360 degrees of reception.

Abstract: A radio frequency (RF) system is described for use in a wireless communication device. The RF system may contain power amplifiers, additional circuitry and components (e.g., gain controllers, phase shifters), and/or antennas. The RF system is described in a variety of different configurations with its functionality divided up over several single chip circuits. Using the single chip circuits simplifies assembly, reduces size, and allows for high speed RF performance demanded by fixed and mobile wireless standards. The system may use a first amplifier circuit combined with an adjacent channel leakage correction circuit so that the output of the first amplifier has the signal leakage substantially cancelled.

Abstract: A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a via penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer; a first electrode formed in the via and on the second semiconductor layer; a second electrode formed on the second semiconductor layer; and an insulating structure covering the first electrode, the second electrode and the semiconductor structure and including a first opening to expose the first electrode and a second opening to expose the second electrode, wherein the first electrode and the second electrode respectively include a metal layer contacting the insulating layer, the metal layer includes a material including a surface tension value larger than 1500 dyne/cm and a standard reduction potential larger than 0.3 V.