Abstract: A transmission line structure includes a first transmission line having a first and a second extending line segments and a first and a second line segments extending along a first direction and a third line segment extending along a second direction, and a second transmission line having a third and a fourth extending line segments, a fourth and a fifth line segments extending along the first direction and a sixth line segment extending along the second direction. The first and the second extending line segment are connected to ends of the first and the second line segment. The third line segment is connected to sides of the first and the second line segment. The third and the fourth extending line segment are connected to ends of the fourth the fifth line segment. The sixth line segment is connected to sides of the fourth and the fifth line segment.

Abstract: A transmission line structure includes a first transmission line having a first and a second extending line segments and a first and a second line segments extending along a first direction and a third line segment extending along a second direction, and a second transmission line having a third and a fourth extending line segments, a fourth and a fifth line segments extending along the first direction and a sixth line segment extending along the second direction. The first and the second extending line segment are connected to ends of the first and the second line segment. The third line segment is connected to sides of the first and the second line segment. The third and the fourth extending line segment are connected to ends of the fourth the fifth line segment. The sixth line segment is connected to sides of the fourth and the fifth line segment.

Abstract: A structure of transmission line includes a first transmission line, a second transmission line and an interlayer via. The first transmission line includes a first line segment, a second segment and a first signal via. The second transmission line includes a third line segment, a fourth segment and a second signal via. Both of the first line segment and the third line segment are disposed in a first signal transmission layer and extend along a first direction. Both of the second line segment and the fourth line segment are disposed in a second signal transmission layer and extend along a second direction. The first signal via is connected to the first line segment and the second line segment. The second signal via is connected to the third line segment and the fourth line segment. The interlayer via is adjacent to the first line segment or the second line segment.

Abstract: A circuit board includes a substrate, two signal lines, two ground lines and two ground vias. The substrate includes a signal layer, a ground layer and an insulation layer. The signal layer is spaced apart from the ground layer. The signal lines are disposed on the signal layer with a first distance between the signal lines. The two signal lines are symmetrical about a reference line. The ground lines are disposed on the signal layer with a second distance between the first signal line and the first ground line. The second ground lines are disposed on the signal layer with one of the ground lines including two line portions having different widths. One of the ground vias is located at a joint between the two line portions. The two ground vias are symmetrical about the reference line.

Abstract: A structure of serpentine transmission line includes a first transmission line and a second transmission line. The first transmission line includes a first line segment, a second line segment and a third line segment. The second transmission line includes a fourth line segment, a fifth line segment and a sixth line segment. The first line segment, the second line segment, the fourth line segment and the fifth line segment extend along a first direction and have a first line width. The third line segment extends along a second direction and is connected to the first line segment and the second line segment. The sixth line segment extends along the second direction and is connected to the fourth line segment and the fifth line segment. Both the third line segment and the sixth line segment have a second line width. The second line width is greater than the first line width.

Abstract: A structure of transmission line includes a first transmission line, a second transmission line and an interlayer via. The first transmission line includes a first line segment, a second segment and a first signal via. The second transmission line includes a third line segment, a fourth segment and a second signal via. Both of the first line segment and the third line segment are disposed in a first signal transmission layer and extend along a first direction. Both of the second line segment and the fourth line segment are disposed in a second signal transmission layer and extend along a second direction. The first signal via is connected to the first line segment and the second line segment. The second signal via is connected to the third line segment and the fourth line segment. The interlayer via is adjacent to the first line segment or the second line segment.

Abstract: A circuit board includes a substrate, two signal lines, two ground lines and two ground vias. The substrate includes a signal layer, a ground layer and an insulation layer. The signal layer is spaced apart from the ground layer. The signal lines are disposed on the signal layer with a first distance between the signal lines. The two signal lines are symmetrical about a reference line. The ground lines are disposed on the signal layer with a second distance between the first signal line and the first ground line. The second ground lines are disposed on the signal layer with one of the ground lines including two line portions having different widths. One of the ground vias is located at a joint between the two line portions. The two ground vias are symmetrical about the reference line.

Abstract: A transmission line structure emplaces at a substrate which includes a first layout layer, a first dielectric layer, a second dielectric layer, a second dielectric layer, and a grounding layer includes a first transmission line pair and at least one second transmission line. The first transmission line pair is set on the first layout layer. The second transmission line is set on the second layout layer. A line of first transmission line pair and a line of the second transmission line cross each other and form a crossing area. A width of the line is narrow. A distance between the first transmission line pair and the second transmission line at the crossing area is less than a distance at an outstanding area.

Abstract: A serpentine delay line structure for reducing the common-mode noise is provided to a substrate having a layout layer, a first dielectric layer, a second dielectric layer, and a grounding layer. The serpentine delay line structure includes a first serpentine delay line pair, a second serpentine delay line pair, a third serpentine delay line pair, a first transition serpentine delay line pair, and a second transition serpentine delay line pair. The first serpentine delay line pair and the second serpentine delay line pair on the layout layer are electrically connected to the first transition serpentine delay line pair on the first dielectric layer through corresponding vertical vias. The second serpentine delay line pair and the third serpentine delay line pair on the layout layer are electrically connected to the second transition serpentine delay line pair on the first dielectric layer through corresponding vertical vias.

Abstract: Disclosed herein is a filter device for suppressing ground bounce and electromagnetic interference. The filter device comprises a dielectric substrate, a signal transmission layer, a signal via, a plurality of ground vias, and first, second, and third metal layers. The signal transmission layer is located on the dielectric substrate, the vias and the first and second metal layers in the dielectric substrate, and the third metal layer underneath it. The first metal layer has a filter portion and a resonance portion. The ground vias connect the second and third metal layers and are disposed perpendicularly to them. The signal via, disposed in a via space defined by the ground vias, connects the first metal layer and the signal transmission layer. As a result, the resonance portion is able to reduce noise of a certain frequency band, the ground vias abate ground bounce, and electromagnetic interference is minimized.

Abstract: A transmission line structure emplaces at a substrate which includes a first layout layer, a first dielectric layer, a second dielectric layer, a second dielectric layer, and a grounding layer includes a first transmission line pair and at least one second transmission line. The first transmission line pair is set on the first layout layer. The second transmission line is set on the second layout layer. A line of first transmission line pair and a line of the second transmission line cross each other and form a crossing area. A width of the line is narrow. A distance between the first transmission line pair and the second transmission line at the crossing area is less than a distance at an outstanding area.

Abstract: A serpentine delay line structure for reducing the common-mode noise is provided to a substrate having a layout layer, a first dielectric layer, a second dielectric layer, and a grounding layer. The serpentine delay line structure includes a first serpentine delay line pair, a second serpentine delay line pair, a third serpentine delay line pair, a first transition serpentine delay line pair, and a second transition serpentine delay line pair. The first serpentine delay line pair and the second serpentine delay line pair on the layout layer are electrically connected to the first transition serpentine delay line pair on the first dielectric layer through corresponding vertical vias. The second serpentine delay line pair and the third serpentine delay line pair on the layout layer are electrically connected to the second transition serpentine delay line pair on the first dielectric layer through corresponding vertical vias.

Abstract: A differential mode transmission line with a weak coupling structure is presented. The differential mode transmission line with a weak coupling structure includes a first transmission line and a second transmission line. The first transmission line includes a first wiring portion, a second wiring portion, and a third wiring portion. The second transmission line also includes a first wiring portion, a second wiring portion, and a third wiring portion. The wiring portions of the present disclosure are connected through connection portions, and the connection portions are designed as a corner structure. Due to the characteristics of the corner structure of the present disclosure, a pitch between the second wiring portions is greater than that between the first wiring portions or the third wiring portions, thereby generating a weak coupling structure to suppress common mode noises.

Abstract: A differential signal line structure is disposed on a substrate including a signal layer, a filter layer and a grounding layer. The signal layer, the filter layer and the grounding layer are arranged from up to down and in parallel manner. The differential signal line structure accordingly includes a differential signal line group, a first wire and a first grounding circuit; the differential signal line group is disposed in the signal layer; and the first wire is disposed in the filter layer and is arranged in a corresponding position right underneath the differential signal line group. The first grounding circuit is disposed in the grounding layer and is electrically connected to an end point of the first wire through a first via.

Abstract: A delay line structure includes a flat spiral delay line and two grounding guard traces. The flat spiral delay line is disposed in the layout layer in a manner of extending from an input end, bending clockwise inward until reaching a U-turn part, continuously extending and bending counterclockwise outward to an out put end so as to form two coupling areas, which are spiral and have an opening respectively. The two grounding guard traces are disposed in the layout layer in a manner of extending from the openings respectively toward the coupling areas, having an interval between the grounding guard traces and the flat spiral delay line, wherein the grounding guard traces close to the openings of the coupling areas are electrically connected to the grounding circuit through a via respectively.

Abstract: A differential mode transmission line with a weak coupling structure is presented. The differential mode transmission line with a weak coupling structure includes a first transmission line and a second transmission line. The first transmission line includes a first wiring portion, a second wiring portion, and a third wiring portion. The second transmission line also includes a first wiring portion, a second wiring portion, and a third wiring portion. The wiring portions of the present disclosure are connected through connection portions, and the connection portions are designed as a corner structure. Due to the characteristics of the corner structure of the present disclosure, a pitch between the second wiring portions is greater than that between the first wiring portions or the third wiring portions, thereby generating a weak coupling structure to suppress common mode noises.

Abstract: A delay line structure disposed on a substrate having a dielectric base layer formed with a via, a layout layer and a grounding layer with a grounding circuit, includes two parallel spiral delay lines having a first outer straight section, a first outer bent section, an inner spiral region, a second outer bent section and a second outer straight section. The inner spiral region bends reciprocally between the first and second outer straight sections to form several inner bent parts and several inner straight parts. A grounding guard trace is disposed among the first and second outer straight sections and the inner straight parts and is coupled electrically to the grounding circuit, wherein each of the first and second outer bent sections and the inner bent parts has a width smaller than each of the first and second outer straight sections and the inner straight parts.

Abstract: A delay line structure disposed on a substrate having a dielectric base layer formed with a via, a layout layer and a grounding layer with a grounding circuit, includes two parallel spiral delay lines having a first outer straight section, a first outer bent section, an inner spiral region, a second outer bent section and a second outer straight section. The inner spiral region bends reciprocally between the first and second outer straight sections to form several inner bent parts and several inner straight parts. A grounding guard trace is disposed among the first and second outer straight sections and the inner straight parts and is coupled electrically to the grounding circuit, wherein each of the first and second outer bent sections and the inner bent parts has a width smaller than each of the first and second outer straight sections and the inner straight parts.

Abstract: A delay line structure has a serpentine delay line pair, a first and second grounding guard trace and two third grounding guard traces. The delay line pair is located in a layout layer extending from an input to an output end, The first and second grounding guard traces are connected to the grounding circuit through respective vias and are located in the layout layer. The third grounding guard traces are respectively located in the layout layer by an upper and lower edge of the delay line pair and are connected to the grounding circuit through respective vias.

Abstract: A delay line structure includes a flat spiral delay line and two grounding guard traces. The flat spiral delay line is disposed in the layout layer in a manner of extending from an input end, bending clockwise inward until reaching a U-turn part, continuously extending and bending counterclockwise outward to an out put end so as to form two coupling areas, which are spiral and have an opening respectively. The two grounding guard traces are disposed in the layout layer in a manner of extending from the openings respectively toward the coupling areas, having an interval between the grounding guard traces and the flat spiral delay line, wherein the grounding guard traces close to the openings of the coupling areas are electrically connected to the grounding circuit through a via respectively.