Patents by Inventor Guang-Hwa Shiue

Guang-Hwa Shiue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120032755
    Abstract: A delay line structure includes a serpentine delay line, a first grounding guard trace and a second grounding guard trace. The serpentine delay line is disposed in a layout layer of a substrate in a manner of extending from an input end to an out put end in serpentine so as to form at least a first coupling area having a first opening toward a first direction and at least a second coupling area having a second opening toward a direction opposite to the first direction. The first grounding guard trace is disposed in the layout layer in a manner of extending from the first opening toward the first coupling area and an end of the first grounding guard trace close to the first opening is electrically connected to the grounding circuit through a first via.
    Type: Application
    Filed: July 13, 2011
    Publication date: February 9, 2012
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Guang-Hwa SHIUE, Po-Wei CHIU
  • Publication number: 20120032749
    Abstract: A differential signal line structure is disposed on a substrate including a signal layer, a filter layer and a grounding layer. The signal layer, the filter layer and the grounding layer are arranged from up to down and in parallel manner. The differential signal line structure accordingly includes a differential signal line group, a first wire and a first grounding circuit; the differential signal line group is disposed in the signal layer; and the first wire is disposed in the filter layer and is arranged in a corresponding position right underneath the differential signal line group. The first grounding circuit is disposed in the grounding layer and is electrically connected to an end point of the first wire through a first via.
    Type: Application
    Filed: July 13, 2011
    Publication date: February 9, 2012
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Guang-Hwa SHIUE, Che-Ming HSU, Cheng-Fu HSU