Patents by Inventor Guang Zhu

Guang Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230057842
    Abstract: The subject invention pertains to compositions comprising albofungin and/or derivatives thereof, including, chloroalbofungin, 477-albo, 492-albo, 505-albo, 506-1-albo, 506-2-albo, 519-albo, and 562-albo. The subject invention further pertains to methods of treating a subject with HIV using albofungin and/or derivatives thereof, including, chloroalbofungin, 477-albo, 492-albo, 505-albo, 506-1-albo, 506-2-albo, 519-albo, and 562-albo.
    Type: Application
    Filed: June 1, 2022
    Publication date: February 23, 2023
    Inventors: Peiyuan QIAN, Aifang CHENG, Changdong LIU, Wenkang YE, Guang ZHU
  • Patent number: 11532445
    Abstract: A key structure includes a keycap, a base plate and a supporting element. The supporting element includes a first frame and a second frame. The supporting element is connected with the keycap and the base plate. Consequently, the keycap is movable upwardly or downwardly relative to the base plate. When the first frame and a second frame are combined together, a first span and a second span are formed sequentially. The second span is smaller than the first frame.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: December 20, 2022
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: De-Guang Zhu, Rong-Biao Xu
  • Publication number: 20220339827
    Abstract: A composite release film may be configured to separate a current cured layer from a photocuring surface during a photocuring three-dimensional (3D) printing process. The composite release film may include a plastic layer and an elastic layer. An upper surface of the plastic layer may be the photocuring surface, and a lower surface of the plastic layer may fit with an upper surface of the elastic layer. The elastic layer may include an elastic medium of the elastic layer and a reinforcing scaffold. The elastic medium of the elastic layer may be filled in pores of the reinforcing scaffold. The reinforcing scaffold in the elastic layer may include a plurality of protrusions on a lower surface of the elastic layer. In addition, a device and a method using the composite release film to prepare a 3D object through a photocuring 3D printing technique in the field of additive manufacturing are disclosed.
    Type: Application
    Filed: July 7, 2022
    Publication date: October 27, 2022
    Applicant: LUXCREO (BEIJING) INC.
    Inventors: Guang ZHU, Wen FAN, Zhengwei WAN, Yutong WU
  • Patent number: 11432378
    Abstract: A planar heating structure is disclosed. The planar heating structure includes a glass substrate layer, a nanometallic transparent conductive layer, and a first passivation layer. The nanometallic transparent conductive layer is disposed on the glass substrate layer and receives a voltage to generate heat energy. The first passivation layer is disposed on the nanometallic transparent conductive layer and completely covers the nanometallic transparent conductive layer.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: August 30, 2022
    Assignee: Cambrios Film Solutions Corporation
    Inventors: Ho-Hsun Chi, Ying-Che Chen, Yu Zhang, Hebo Yang, Fu-Yu Su, Chao Gao, Shu-Guang Zhu, Chun-Ya Tang, Wen-Da Chen
  • Patent number: 11373949
    Abstract: Interconnect structures are provided. An interconnect structure includes a substrate; a first dielectric layer on the substrate and including an opening for a first interconnect layer extending to the substrate; a first metal layer having a first portion in the opening and a second portion in contact with the first portion and on a portion of the first dielectric layer adjacent to the opening; a second dielectric layer on the first dielectric layer and on the first metal layer, the second dielectric layer including a trench for a second interconnect layer, the trench exposing the second portion of the first metal layer; and a second metal layer in the trench, wherein the second portion of the first metal layer forms a lower portion of the second interconnect layer.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: June 28, 2022
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Ningbo Semiconductor International Corporation
    Inventors: Zuopeng He, Ji Guang Zhu
  • Publication number: 20220165517
    Abstract: A key structure includes a keycap, a base plate, a first scissors-type connecting element, a second scissors-type connecting element and a reinforced connecting rod. The first and second scissors-type connecting elements are arranged between the keycap and the base plate. The first scissors-type connecting element includes a first inner frame and a first outer frame. The second scissors-type connecting element includes a second inner frame and a second outer frame. The keycap is movable upwardly or downwardly relative to the base plate along a specified path with the assistance of the first and second scissors-type connecting elements. The reinforced connecting rod includes a hollow rectangular main body. The first outer frame has a first extension structure. The second outer frame has a second extension structure. Moreover, two opposite sides of the hollow rectangular main body are respectively received within the first extension structure and the second extension structure.
    Type: Application
    Filed: February 2, 2021
    Publication date: May 26, 2022
    Inventors: De-Guang Zhu, Rong-Biao Xu
  • Patent number: 11342139
    Abstract: A key structure includes a keycap, a base plate, a first scissors-type connecting element, a second scissors-type connecting element and a reinforced connecting rod. The first and second scissors-type connecting elements are arranged between the keycap and the base plate. The first scissors-type connecting element includes a first inner frame and a first outer frame. The second scissors-type connecting element includes a second inner frame and a second outer frame. The keycap is movable upwardly or downwardly relative to the base plate along a specified path with the assistance of the first and second scissors-type connecting elements. The reinforced connecting rod includes a hollow rectangular main body. The first outer frame has a first extension structure. The second outer frame has a second extension structure. Moreover, two opposite sides of the hollow rectangular main body are respectively received within the first extension structure and the second extension structure.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: May 24, 2022
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: De-Guang Zhu, Rong-Biao Xu
  • Publication number: 20220153715
    Abstract: The present disclosure provides processes for the purification of 2,5-furandicarboxylic acid (FDCA). The present disclosure further provides crystalline preparations of purified FDCA, as well as processes for making the same. In addition, the present disclosure provides mixtures used in processes for the purification of FDCA.
    Type: Application
    Filed: November 30, 2021
    Publication date: May 19, 2022
    Inventors: Henricus Johannes Cornelis Den Ouden, Valery Sokolovskii, Thomas R. Boussie, Gary M. Diamond, Eric L. Dias, Guang Zhu, Staffan Torssell, Vincent J. Murphy
  • Publication number: 20220112180
    Abstract: The subject invention pertains to compositions and methods for treating neurodegenerative diseases, including Alzheimer's disease (AD), Parkinson's disease (PD), amyotrophic lateral sclerosis (ALS), Huntington's disease (HD), multiple sclerosis, epilepsy, stroke, alcohol withdrawal, progressive supranuclear palsy (PSP), Pick's disease (PiD), corticobasal degeneration (CBD), frontotemporal dementia or parkinsonism linked to chromosome 17 (FTDP-17). The methods of the subject invention further relate to methods of fermentation of bacterial cells and methods of tautomerization of the subject compounds.
    Type: Application
    Filed: September 15, 2021
    Publication date: April 14, 2022
    Inventors: Pei-Yuan QIAN, Aifang CHENG, Changdong LIU, Wenkang YE, Guang ZHU
  • Publication number: 20220105681
    Abstract: A method and system for photopolymerization 3D printing is provided. The system includes a processing device, a micro light emitting diode (microLED) array including one or more individually addressable microLED emitters, and a printing component. The processing device is configured to determine one or more printing layers of an object. The microLED array is configured to generate light for each of the one or more printing layers. The printing component is configured to print the one or more printing layers. To generate the light for each of the one or more printing layers, the processing device is further configured to dynamically determine one or more microLED regions in the microLED array, determine one or more region printing parameters for each of the one or more microLED regions; and determine one or more control signals for the one or more individually addressable microLED emitters included in each of the one or more microLED regions based on the one or more region printing parameters.
    Type: Application
    Filed: December 14, 2021
    Publication date: April 7, 2022
    Inventors: Robert Michael STROHECKER, Shang-Yu Mike YANG, Meng-Han LIU, Yi-Ho LIN, Guang ZHU
  • Publication number: 20220089903
    Abstract: A prepolymer with multiple functional groups is disclosed. The embodiments of the prepolymer may have the compound of formula X: A polymerizable liquid comprising such prepolymer that can be used for producing three-dimensional objects by methods of additive manufacturing and the method using such polymerizable liquid to form three-dimensional objects is also described.
    Type: Application
    Filed: December 2, 2021
    Publication date: March 24, 2022
    Applicant: LUXCREO (BEIJING) INC.
    Inventors: Guang ZHU, Yisi LU, Jie GAO, Fan ZHANG
  • Patent number: 11253839
    Abstract: Shaped porous carbon products and processes for preparing these products are provided. The shaped porous carbon products can be used, for example, as catalyst supports and adsorbents. Catalyst compositions including these shaped porous carbon products, processes of preparing the catalyst compositions, and various processes of using the shaped porous carbon products and catalyst compositions are also provided.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: February 22, 2022
    Assignee: Archer-Daniels-Midland Company
    Inventors: Joshua Terrian, Andrew J. Ingram, Eric L. Dias, Alfred Hagemeyer, Hong X. Jiang, James Longmire, James A. W. Shoemaker, Valery Sokolovskii, Guang Zhu, Vincent J. Murphy, Gary M. Diamond
  • Patent number: 11192872
    Abstract: The present disclosure provides processes for the purification of 2,5-furandicarboxylic acid (FDCA). The present disclosure further provides crystalline preparations of purified FDCA, as well as processes for making the same. In addition, the present disclosure provides mixtures used in processes for the purification of FDCA.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: December 7, 2021
    Assignee: Stora Enso Oyj
    Inventors: Henricus Johannes Cornelis Den Ouden, Valery Sokolovskii, Thomas R. Boussie, Gary M. Diamond, Eric L. Dias, Guang Zhu, Staffan Torssell, Vincent J. Murphy
  • Publication number: 20210339479
    Abstract: The present disclosure is related to a support of a three-dimensional (3D) printed object. The support may include a main body and a connection component connected to the 3D printed object. At least one end of the support may be connected to the 3D printed object. A surface of the 3D printed object may be provided with a concave part. The connection component of the support may be connected to the concave part.
    Type: Application
    Filed: April 25, 2021
    Publication date: November 4, 2021
    Applicant: LUXCREO (BEIJING) INC.
    Inventors: Guang ZHU, Wen FAN, Haiyong SHI
  • Publication number: 20210263587
    Abstract: The present invention relates to a split-type head-mounted display system and an interaction method. The system comprises a host and at least one head-mounted display that are separately provided. The host comprises an information collection unit, a memory, a CPU and a first communication unit. The head-mounted display comprises a second communication unit for establishing a communication connection with the first communication unit, and a real-time positioning unit and an image output unit. The information collection unit is configured to acquire information of a target image source and send the same to the memory. The real-time positioning unit is configured to acquire position information of the head-mounted display and send the same to the memory. The CPU receives the information of the target image source and the position information of the head-mounted display, and sends first image information corresponding to the head-mounted display to the image output unit.
    Type: Application
    Filed: April 26, 2019
    Publication date: August 26, 2021
    Inventor: Guang Zhu
  • Publication number: 20210197494
    Abstract: The application discloses a hollowed-out printed object and a 3D printing support, a 3D printing support construction method and a 3D printing method of the hollowed-out printed object. At least one end of the 3D printing support of the hollowed-out printed object is connected to the hollowed-out printed object; the support includes a main body and a connecting portion connected to the hollowed-out printed object; a joint between at least part of the connecting portion and the hollowed-out printed object is located inside the hollowed-out printed object.
    Type: Application
    Filed: March 5, 2021
    Publication date: July 1, 2021
    Applicant: LUXCREO (BEIJING) INC.
    Inventors: Guang ZHU, Edward LIN, Zhijia LIN, Yang LI, Zhifeng YAO, Siyuan QU, Hongyi CHE
  • Publication number: 20210178682
    Abstract: Disclosed herein are an adhesion blocking element, a three-dimensional printing device and a three-dimensional printing method. The adhesion blocking element comprises: one light-transmittable main body comprising a first surface and a second surface which are disposed opposite to each other, and side faces connecting the first surface and the second surface; and a plurality of microstructures arranged on the main body, wherein each microstructure has one cavity formed in the main body and one first open face which is arranged on the first surface of the main body and communicated to the cavity. The present invention decreases the adhesion between the adhesion blocking element and the cured layer by improving the structure of the adhesion blocking element itself, and eliminates the negative pressure adsorption between the cured layer and the adhesion blocking element, so that it is easier to peel the adhesion blocking element off from the cured layer.
    Type: Application
    Filed: May 5, 2019
    Publication date: June 17, 2021
    Inventors: Guang Zhu, Zhifeng Yao, Fang Li, Yi-Ho Lin, Yanhui Guo, Hu Wang
  • Patent number: 11011410
    Abstract: A method for forming a semiconductor device includes forming a first insulator layer on a first substrate of a first semiconductor material, implanting hydrogen ions into the first substrate to form a hydrogen-implanted layer, forming a recessed region in the first substrate, forming a second semiconductor material in the recessed region, and forming a second insulator layer over the second semiconductor material and the first substrate. The method also includes providing a second substrate with a third insulator layer disposed thereon, bonding the first substrate with the second substrate, and removing a lower portion of the first substrate at the hydrogen-implanted layer. A portion of the first substrate is removed to expose a surface of the second semiconductor material in the recessed region, thereby providing a layer of the first semiconductor material adjacent to a layer of the second semiconductor material on the second insulator layer.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: May 18, 2021
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
    Inventors: Ji Guang Zhu, Hai Ting Li
  • Publication number: 20210094020
    Abstract: Disclosed are catalysts comprised of platinum and gold. The catalysts are generally useful for the selective oxidation of compositions comprised of a primary alcohol group and at least one secondary alcohol group wherein at least the primary alcohol group is converted to a carboxyl group. More particularly, the catalysts are supported catalysts including particles comprising gold and particles comprising platinum, wherein the molar ratio of platinum to gold is in the range of about 100:1 to about 1:4, the platinum is essentially present as Pt(0) and the platinum-containing particles are of a size in the range of about 2 to about 50 nm. Also disclosed are methods for the oxidative chemocatalytic conversion of carbohydrates to carboxylic acids or derivatives thereof. Additionally, methods are disclosed for the selective oxidation of glucose to glucaric acid or derivatives thereof using catalysts comprising platinum and gold. Further, methods are disclosed for the production of such catalysts.
    Type: Application
    Filed: October 19, 2020
    Publication date: April 1, 2021
    Applicant: Archer-Daniels-Midland Company
    Inventors: Vincent J. Murphy, James Shoemaker, Guang Zhu, Raymond Archer, George Frederick Salem, Eric L. Dias
  • Publication number: 20210078964
    Abstract: The present disclosure provides processes for the production of 2-5-furandicarboxylic acid (FDCA) and intermediates thereof by the chemocatalytic conversion of a furanic oxidation substrate. The present disclosure further provides processes for preparing derivatives of FDCA and FDCA-based polymers. In addition, the present disclosure provides crystalline preparations of FDCA, as well as processes for making the same.
    Type: Application
    Filed: November 13, 2020
    Publication date: March 18, 2021
    Inventors: Valery Sokolovskii, Vincent J. Murphy, Thomas R. Boussie, Gary M. Diamond, Eric L. Dias, Guang Zhu, James M. Longmire, Stanley Herrmann, Staffan Torssell, Mayya Lavrenko