Abstract: A method of manufacturing a solar cell is disclosed. The method comprises the steps of: (a) positioning a plurality of silicon particles comprising a first layer on the outside on the dummy substrate including a plurality of holes corresponding to the holes; (b) forming an optically transparent layer on the dummy substrate to include at least one of the silicon particles; (c) removing the dummy substrate and exposing a portion of the first layer; (d) forming a plurality of first electrodes, wherein the first electrode is connected to the exposed first layer of each of the silicon particles; (e) forming an insulating layer on the first electrode; (f) removing a part of the first layer of silicon particle; (g) forming a second electrode electrically connected to the portion where the first layer of the silicon particle is removed.

Abstract: An electronic device is provided such that a user can experience a quick launch of an application therein. The electronic device includes a housing, a display, an input unit, a processor, a non-volatile memory to store an application program, and a volatile memory to store instructions that allow the processor to load a first part of the application program in the volatile memory based on a first change of state of the electronic device, to load a second part of the application program in the volatile memory based on a second change of state of the electronic device and to display an image or text generated by the loaded first or second part. Since at least part of the application is preloaded before the second input is generated, only the remainder of the application has to be loaded in order to execute the application after the second input is generated.

Abstract: An emergency braking control method for a vehicle may include: controlling, by a controller, an ambient information detector to take an image of surroundings of the road on which a vehicle is traveling; controlling, by the controller, a camera recognition fail state detector to analyze the image taken by the ambient information detector, and to determine a severity level of a temporary camera recognition fail state; and controlling, by the controller, an operation of an emergency braking apparatus or setting a control strategy according to the severity level of the temporary camera recognition fail state.

Abstract: An electronic device is provided such that a user can experience a quick launch of an application therein. The electronic device includes a housing, a display, an input unit, a processor, a non-volatile memory to store an application program, and a volatile memory to store instructions that allow the processor to load a first part of the application program in the volatile memory based on a first change of state of the electronic device, to load a second part of the application program in the volatile memory based on a second change of state of the electronic device and to display an image or text generated by the loaded first or second part. Since at least part of the application is preloaded before the second input is generated, only the remainder of the application has to be loaded in order to execute the application after the second input is generated.

Abstract: A diagnostic imaging apparatus includes an image acquiring unit acquiring a first image obtained by imaging an object in a first section of a first cycle and a second image obtained by imaging the object in a second section, which corresponds to the first section, of a second cycle, and an image reconstruction unit reconstructing the first image and the second image based on a difference between the first image and the second image.

Abstract: Provided is a computed tomography (CT) imaging apparatus, the CT imaging apparatus including a data obtainer configured to obtain first raw data from X-ray transmitted by an object; and a processor configured to interpolate a pixel value corresponding to a to-be-restored region within raw data, based on a pixel value of at least one line that penetrates through the to-be-restored region.

Abstract: A diagnostic imaging apparatus includes an image acquiring unit acquiring a first image obtained by imaging an object in a first section of a first cycle and a second image obtained by imaging the object in a second section, which corresponds to the first section, of a second cycle, and an image reconstruction unit reconstructing the first image and the second image based on a difference between the first image and the second image.

Abstract: A solar cell using a printed circuit board (PCB) includes a substrate that is formed of an insulating material and in and through which a plurality of fixing holes and communication holes are alternately formed; a plurality of photoelectric effect generators that have ball or polyhedral shapes fixed to the substrate to be disposed over the plurality of fixing holes, and generate photoelectric effects by receiving light through light-receiving portions that are exposed to an upper portion of the substrate; a plurality of upper electrodes that are formed on a top surface of the substrate, and are connected to the respective light-receiving portions of the photoelectric effect generators; and a plurality of lower electrodes that are formed on a bottom surface of the substrate to be connected to respective non-light-receiving portions of the photoelectric effect generators, and communicate with the plurality of upper electrodes through the plurality of communication holes.

Abstract: An electronic device is provided such that a user can experience a quick launch of an application therein. The electronic device includes a housing, a display, an input unit, a processor, a non-volatile memory to store an application program, and a volatile memory to store instructions that allow the processor to load a first part of the application program in the volatile memory based on a first change of state of the electronic device, to load a second part of the application program in the volatile memory based on a second change of state of the electronic device and to display an image or text generated by the loaded first or second part. Since at least part of the application is preloaded before the second input is generated, only the remainder of the application has to be loaded in order to execute the application after the second input is generated.

Abstract: Disclosed is an apparatus for spinning a test tray and an in-line test handler including the above apparatus, wherein the apparatus may include a supporting unit for supporting a test tray transported between first and second chamber units facing in the different directions, wherein the first chamber unit is provided at a predetermined interval from the second chamber unit; a base unit to which the supporting unit is spinnably connected; and a spinning unit which spins the test tray so that semiconductor devices received in the test tray are tested at the same arrangement in each of the first chamber unit and the second chamber unit.

Abstract: A diagnostic imaging apparatus includes an image acquiring unit acquiring a first image obtained by imaging an object in a first section of a first cycle and a second image obtained by imaging the object in a second section, which corresponds to the first section, of a second cycle, and an image reconstruction unit reconstructing the first image and the second image based on a difference between the first image and the second image.

Abstract: A solar cell using a printed circuit board (PCB) includes a substrate that is formed of an insulating material and in and through which a plurality of fixing holes and communication holes are alternately formed; a plurality of photoelectric effect generators that have ball or polyhedral shapes fixed to the substrate to be disposed over the plurality of fixing holes, and generate photoelectric effects by receiving light through light-receiving portions that are exposed to an upper portion of the substrate; a plurality of upper electrodes that are formed on a top surface of the substrate, and are connected to the respective light-receiving portions of the photoelectric effect generators; and a plurality of lower electrodes that are formed on a bottom surface of the substrate to be connected to respective non-light-receiving portions of the photoelectric effect generators, and communicate with the plurality of upper electrodes through the plurality of communication holes.

Abstract: A chip package comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided. The carrier has a carrying surface and a back surface opposite to the carrying surface. Furthermore, the carrier has a plurality of common contacts in the periphery of the carrying surface. The chip is disposed on the carrying surface and electrically connected to the carrier. In addition, the first conductive elements are disposed on the common contacts respectively. The encapsulation is disposed on the carrying surface and encapsulating the chip. Moreover, the conductive film is disposed over the encapsulation and the first conductive elements, so as to electrically connect with the common contacts via the first conductive elements. A process for fabricating the chip package is further provided. The chip package is capable of preventing the EMI problem and thus provides superior electrical performance.

Abstract: A chip package comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided. The carrier has a carrying surface and a back surface opposite to the carrying surface. Furthermore, the carrier has a plurality of common contacts in the periphery of the carrying surface. The chip is disposed on the carrying surface and electrically connected to the carrier. In addition, the first conductive elements are disposed on the common contacts respectively. The encapsulation is disposed on the carrying surface and encapsulating the chip. Moreover, the conductive film is disposed over the encapsulation and the first conductive elements, so as to electrically connect with the common contacts via the first conductive elements. A process for fabricating the chip package is further provided. The chip package is capable of preventing the EMI problem and thus provides superior electrical performance.

Abstract: Disclosed is an apparatus for spinning a test tray and an in-line test handler including the above apparatus, wherein the apparatus may include a supporting unit for supporting a test tray transported between first and second chamber units facing in the different directions, wherein the first chamber unit is provided at a predetermined interval from the second chamber unit; a base unit to which the supporting unit is spinnably connected; and a spinning unit which spins the test tray so that semiconductor devices received in the test tray are tested at the same arrangement in each of the first chamber unit and the second chamber unit.

Abstract: The present invention relates to a transparent color coating composition containing nano-sized dispersed pigments, to a coated substrate, and to a method for preparing the same. When used in coating glass, the transparent color coating composition expresses a variety of colors, maintains continuous color transparency, gives sun protection to glass, and has superior adhesion, solvent resistance, and sun protection properties.

Abstract: Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.

Abstract: The present invention relates to a transparent color coating composition containing nano-sized dispersed pigments, to a coated substrate, and to a method for preparing the same. When used in coating glass, the transparent color coating composition expresses a variety of colors, maintains continuous color transparency, gives sun protection to glass, and has superior adhesion, solvent resistance, and sun protection properties.

Abstract: A stackable package substrate has an opening shaped and dimensioned to accommodate but not contact a mold cap of a package upon which the stackable package is to be mounted. On the die attach surface, the frame substrate accommodates a die attach margin adjacent at the edge of the opening; and a row of wire bond sites arranged along at an outer frame edge, for electrical interconnection. The frame substrate accommodates z-interconnect ball pads arranged to align with corresponding z-interconnect pads on the substrate of a package. A stackable package has a frame substrate. A stacked package assembly includes a second package mounted on a first package using peripheral solder ball z-interconnect, in which the first package includes a die enclosed by a mold cap and in which the second package includes one die mounted on the frame substrate.

Abstract: Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.