Abstract: Testing techniques for three-dimensional testing of printed circuit boards overcome the disadvantages that presently exist such as, for example, too little height resolution, low processing speed and difficult manipulation. The testing in the microscopic domain occurs within unaltering, displaceable evaluation windows on the basis of the calculation of cross-sectional areas at each scan point on a printed circuit board. Microscopic testing occurs on the basis of the calculation of defined, simple geometric values within a scan field and by following comparisons to reference values. The arrangement for the implementation of the methods utilize a laser scanner for triangulation, an evaluation unit, and at least one high-resolution, position-sensitive detector.

Abstract: Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards. In the electrical function testing of wiring matrices, particularly of printed circuit boards, the number of required leads and switch elements can be drastically reduced. In the present apparatus, every measuring locations of the printed circuit board can be selected by an associated busbar and by an intermediate mask that prevents the contacting of non-selected measuring locations. The busbars preferably are orientated transversely relative to the principal direction of the wiring of the printed circuit board. The bus bar interconnecting a number of elements, each of the contact elements being a test probe.

Abstract: A drive device for an apparatus for electrical function testing of wiring matrices, which has optimally simple electrode shapes for the purpose of a further miniaturization with a two-electrode arrangement. For testing printed circuit boards a non-touching plasma contacting is used whereby two respectively selected measuring locations of a wiring matrix can be contacted via allocated discharge channels and their electrodes. The drive of the measuring locations (test points) occurs via control gas discharges that are generated by applying an adequately high voltage between the electrodes. By applying a voltage between the gas discharges, a current conduction that can be evaluated for test purposes is generated for a conductive connection between the test points.

Abstract: A sensor for measuring the torque acting on a rotating shaft has two electrode structures which are respectively mechanically coupled to two axially spaced points on the shaft to be measured so that a relative movement between the two electrode structures occurs due to the torque. The electrode structures each have a number of parallel, spaced electrodes and are asymmetrically mounted in a plane so that a number of capacitors are formed by electrode pairs each having an electrode from each electrode structure. Because of the asymmetrical arrangement, the electrodes in a pair are spaced a relatively large distance away from the next closest electrode, so that a capacitive decoupling between the pairs is achieved. Changes in the spacing between the points on the shaft due to torsion of the shaft caused by the torque will change the spacing between the electrodes in each pair, thereby resulting in a total capacitance change which is proportional to the torque.

Abstract: Measurement sensor for length or distance changes, particularly for non-contacting measurement of torques of rotating shafts. In known measurement sensors, the length or distance change (.DELTA.x) is amplified by a mechanical lever system and is then converted into an electrical quantity. In the novel measurement sensor of the present invention, the length or distance change (.DELTA.x) to be measured is transmitted to a displacer in order to enhance the precision. A displaced liquid, particularly mercury, is introduced into a capillary and the length of a liquid column in the capillary is converted into an electrical quantity, preferably as a change of a resistor. The new measurement sensor is particularly suitable for torque measurement.

Abstract: A selection device for reliable selection of a plurality of lines or of a plurality of contact locations. In order to select at least two of a plurality of lines, at least two selection lines are connected to every line via a photoresistor, whereby every photoresistor is preferably controllably chargeable with light via a deflectable beam. The selection occurs when selected photoresistors are changed to a low resistance state by light impingement. For selecting at least two of a plurality of contact locations arranged in a grid pattern, the contact locations are connected to the lines via photoresistors. The device of the present invention is preferably utilized for the electrical function testing of printed circuit boards.

Abstract: Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards. In the electrical function testing of wiring matrices, particularly of printed circuit boards, the number of required leads and switch elements can be drastically reduced. In the present apparatus, every measuring locations of the printed circuit board can be selected by an associated busbar and by an intermediate mask that prevents the contacting of non-selected measuring locations. The busbars preferably are orientated transversely relative to the principal direction of the wiring of the printed circuit board.

Abstract: A device for the electrical function testing of wiring matrices, particularly of printed circuit boards. In the electrical function testing of wiring matrices, particularly of printed circuit boards, the contacting of selected measuring locations results via gas discharging channels. The plurality of leads required for the selection of the individual measuring locations is drastically reduced. In the new device, every gas discharge channel is selectable by an associated busbar and by the controllable charging with light of a photoconductor arranged between the gas discharge channel and the associated busbar.

Abstract: Integral temperature measurement in electrical machines, transformers and energy conversion systems. An integral temperature measurement for electrical machines, transformers and energy conversion systems produces no additonal potential or voltage in the windings of such equipment. As a result, no conductive or semiconductive material can be used in a temperature sensor. The present invention utilizes the temperature dependency of the propagation conditions of sound or ultrasound in gases and also makes use of light waveguide technology. The sound or ultrasound is guided in a flexible capillary along a path along which an integral temperature measurement is to be taken.

Abstract: A method for high precision position measurement of two-dimensional structures such as structures on semiconductor wafers or masks, utilizing a reference mask having a two-dimensional grid, the relative position of the structures relative to the grid being identified by opto-electronic scanning using an image sensor and subsequent image processing. The absolute position of the structures to be measured can then be identified from the position of the grid elements. A reference mask is preferably employed whose grid elements carry a binary coding which can be read and decoded by the image processing means. The coding thereby indicates the position of the grid elements in the grid.

Abstract: An apparatus for electrical function checking of wiring matrices includes a carrier plate having a plurality of gas discharge channels therein is put in place on a wiring matrix to be checked and selected test locations of the wiring matrix are ionically contacted through the gas discharge channels. Each gas discharge channel is equipped with at least two electrodes and is selectable in accordance with the coincidence principle by electrode bus bars that are preferably arranged in the form of rows so that a matrix addressing of selected test locations can be undertaken.

Abstract: An apparatus for checking electrical microprinted circuits comprising an insulating body formed with a number of openings in which electrodes are mounted and which can be aligned with circuit points on the printed circuit board and with electrodes mounted in each of the openings in the insulated body above a hollow space formed between the surface of the printed circuit board and the end of the electrodes with gas such as air or other material being within the opening such that when a voltage is applied between electrodes connected to opposite ends of a common printed circuit conductor discharge will occur through the gas to the electrodes thus allowing current to flow which can be detected to measure the conductivity of the printed circuit path.

Abstract: An automated opto-electronic test system for quality control of two-dimensional elements with high geometric figure density, such as printed circuits, intermediate printed circuit products, and printing tools has a semiconductor image sensor disposed above a compound table having a position sensor which moves the test specimen beneath a lens in a meandering path at a velocity which is known relative to the semiconductor image sensor. The signals from the image sensor are first analyzed in an analog signal pre-precessor to which are connected a number of error recognition circuits operating in parallel each of which produces an error report which is transmitted to an error coordinating circuit.

Abstract: Mask adjustment is automated in order to be able to adjust edges having extremely low contrast on silicon disks (wafer) with the highest precision possible with respect to edges on the mask. Different straight lines which extend orthogonally with respect to one another on the disk and the mask are integrated line-wise by line-wise opto-electronic scanning of the intensity of brightness on a parallel basis. The values obtained are stored and the difference in values of successive lines is formed and centroids are formed from the resultant course, which are further combined into a mean value which is to be assigned to the position of the center line of a stroke on the disk or, respectively, mask. The process is likewise carried out for both directions (x,y) on the basis of the corresponding adjustment structures on the mask and the disk.

Abstract: The position of semiconductor elements is recognized automatically by opto-electronic, non-contact techniques. Recognition of the position of the semiconductor elements, such as integrated circuits, is largely independent of pattern and surface properties, in particular for adjustment purposes in automatic wire assembly and in the transfer of semiconductor elements to automatic alloying/adhesive equipment. The positions of the semiconductor elements are determined via a rectilinear cut edge or system edge by means of a row-by-row scanning which leads from the surroundings of an element and moves across the element, with the rows running parallel or virtually parallel to the direction of the rectilinear edge. The instantaneous intensities of the brightness values are integrated row-wise or row-section-wise, the resulting values are stored and the difference of the results of consecutive rows is formed. Then, only the polarity which corresponds to the investigated edge is used for further analysis.