Abstract: The invention relates to a lithography system comprising an optical column, a moveable target carrier for displacing a target such as a wafer, and a differential interferometer module, wherein the interferometer module is adapted for emitting three reference beams towards a first mirror and three measurement beams towards a second mirror for determining a displacement between said first and second mirror. In a preferred embodiment the same module is adapted for measuring a relative rotation around two perpendicular axes as well. The present invention further relates to an interferometer module and method for measuring such a displacement and rotations.

Abstract: The inventions relates to a lithography system in which an electronic image pattern is delivered to a exposure tool for projecting an image to a target surface, said exposure tool comprising a control unit for controlling exposure projections, said control unit at least partly being included in the projection space of the said exposure tool, and being provided with control data by means of light signals, said light signals being coupled in to said control unit by using a free space optical interconnect comprising modulated light beams that are emitted to a light sensitive part of said control unit, wherein the modulated light beams are coupled in to said light sensitive part using a holed mirror for on axis incidence of said light beams on said light sensitive part, the hole or, alternatively, holes of said mirror being provided for passage of said exposure projections.

Abstract: The invention relates to a lithography system comprising a plurality of lithography system units. Each lithography system unit comprises a lithography apparatus arranged in a vacuum chamber for patterning a substrate; a load lock system for transferring substrates into and out of the vacuum chamber; and a door for enabling entry into the vacuum chamber for servicing purposes. The load lock system and the door of each lithography system unit are provided at the same side and face a free area at a side of the lithography system, in particular the service area.

Abstract: The invention relates to a charged particle beam lithography system comprising: a charged particle optical column arranged in a vacuum chamber for projecting a charged particle beam onto a target, wherein the column comprises deflecting means for deflecting the charged particle beam in a deflection direction, a target positioning device comprising a carrier for carrying the target, and a stage for carrying and moving the carrier along a first direction, wherein the first direction is different from the deflection direction, wherein the target positioning device comprises a first actuator for moving the stage in the first direction relative to the charged particle optical column, wherein the carrier is displaceably arranged on the stage and wherein the target positioning device comprises retaining means for retaining the carrier with respect to the stage in a first relative position.

Abstract: A method for exposing a surface of a target in a system comprising a set of sensors (30) for measuring distance to the target. The method comprises clamping the target to a moveable table (134), moving the target to a plurality of positions in which one or more of the sensors are positioned above the target, receiving signals from one or more of the sensors positioned above the target, calculating one or more tilt correction values (Rx, Ry) based on the signals received from the sensors, adjusting the tilt of the table based on the one or more tilt correction values, and exposing the target.

Abstract: A capacitive sensing system comprising two or more capacitive sensors, one or more AC power sources for energizing the capacitive sensors, and a signal processing circuit for processing signals from the sensors. The sensors are arranged in pairs, wherein the one or more AC power sources are arranged to energize a first sensor of a pair of the sensors with an alternating current or voltage 180 degrees out of phase to a current or voltage for a second sensor of the pair of sensors, and wherein a pair of the sensors provides a measuring unit for a single measured distance value, the signal processing circuit receiving an output signal from each sensor of the pair and generating a measured value related to the average distance between the sensors of the pair and the target.

Abstract: An integrated sensor system for a lithography machine, the system comprising a projection lens system (132) for focusing one or more exposure beams onto a target, a moveable table (134) for carrying the target (9), a capacitive sensing system (300) for making a measurement related to a distance between a final focusing element of the projection lens system (104) and a surface of the target (9), and a control unit (400) for controlling movement of the moveable table (134) to adjust a position of the target (9) based at least in part on a signal from the capacitive sensing system. The capacitive sensing system (300) comprises a plurality of capacitive sensors (30), each comprising a thin film structure. The capacitive sensors and the final focusing element (104) of the projection lens system are mounted directly to a common base (112), and the sensors are located in close proximity to an edge of the final focusing element of the projection lens system.

Abstract: A capacitive sensing system, comprising a sensor having thin film structure, the thin film structure comprising a sensor having a first insulating layer and a first conductive film comprising a sensing electrode formed on a first surface of the first insulating layer and a second conductive film comprising a back guard electrode. The back guard electrode is formed in a single plane and comprises a peripheral portion in the same plane, and is disposed on a second surface of the first insulating layer and a first surface of a second insulating layer or protective layer. The peripheral portion of the back guard electrode extends beyond the sensing electrode to form a side guard electrode which substantially or completely surrounds the sensing electrode.

Abstract: An arrangement comprising a plurality of charged particle lithography apparatuses, each charged particle lithography apparatus having a vacuum chamber. The arrangement further comprises a common robot for conveying wafers to the plurality of lithography apparatuses, and a wafer load unit for each charged particle lithography apparatus arranged at a front side of each respective vacuum chamber. The plurality of lithography apparatuses are arranged in a row with the front side of the lithography apparatuses facing an aisle accommodating passage of the common robot for conveying wafers to each apparatus, and the rear side of each lithography apparatus faces an access corridor, and the back wall of each vacuum chamber is provided with an access door for access to the respective lithography apparatus.

Abstract: The invention relates to a charged particle lithography apparatus with a charged particle source for creating one or more charged particle beams, a charged particle projector for projecting the beams onto a wafer; and a moveable wafer stage for carrying the wafer. The charged particle source, charged particle projector, and moveable wafer stage are disposed in a common vacuum chamber forming a vacuum environment. The vacuum chamber further has an opening for loading wafers into the chamber and a door.

Abstract: A vacuum chamber comprising a plurality of wall panels enclosing an interior space, in which the wall panels are removably attached to form the chamber using a plurality of connection members for locating the wall panels in a predetermined arrangement. The vacuum chamber further comprises one or more sealing members provided at the edges of the wall panels. The wall panels are arranged so that a vacuum tight seal is formed at the edges of the wall panels as a result of forming a vacuum in the interior space.

Abstract: The inventions relates to a lithography system in which an electronic image pattern is delivered to a exposure tool for projecting an image to a target surface, said exposure tool comprising a control unit for controlling exposure projections, said control unit at least partly being included in the projection space of the said exposure tool, and being provided with control data by means of light signals, said light signals being coupled in to said control unit by using a free space optical interconnect comprising modulated light beams that are emitted to a light sensitive part of said control unit, wherein the modulated light beams are coupled in to said light sensitive part using a holed mirror for on axis incidence of said light beams on said light sensitive part, the hole or, alternatively, holes of said mirror being provided for passage of said exposure projections.

Abstract: The inventions relates to a lithography system in which an electronic image pattern is delivered to a exposure tool for projecting an image to a target surface, said exposure tool comprising a control unit for controlling exposure projections, said control unit at least partly being included in the projection space of the said exposure tool, and being provided with control data by means of light signals, said light signals being coupled in to said control unit by using a free space optical interconnect comprising modulated light beams that are emitted to a light sensitive part of said control unit, wherein the modulated light beams are coupled in to said light sensitive part using a holed mirror for on axis incidence of said light beams on said light sensitive part, the hole or, alternatively, holes of said mirror being provided for passage of said exposure projections.

Abstract: The invention relates to a charged particle beam lithography system comprising: a charged particle optical column arranged in a vacuum chamber for projecting a charged particle beam onto a target, wherein the column comprises deflecting means for deflecting the charged particle beam in a deflection direction, a target positioning device comprising a carrier for carrying the target, and a stage for carrying and moving the carrier along a first direction, wherein the first direction is different from the deflection direction, wherein the target positioning device comprises a first actuator for moving the stage in the first direction relative to the charged particle optical column, wherein the carrier is displaceably arranged on the stage and wherein the target positioning device comprises retaining means for retaining the carrier with respect to the stage in a first relative position.

Abstract: The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target (1) such as a wafer, said target being included in said system by means of a target table (2), clamping means being present for clamping said target on said table. Said clamping means comprises a layer of stationary liquid (3), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target (1) and target table (2), a pressure drop (PCap) arises.