Abstract: A fluid cooled electrical assembly that includes a metal box, having a bottom wall, side walls and a top wall. A set of straight-edged pins, each smaller than 3 mm across in widest dimension, extend down from the top wall and up from the bottom wall. Also, electrical components are mounted on top of the top wall and on bottom of the bottom wall.

Abstract: A method of making a fluid cooled assembly that incorporates a base that forms a partial enclosure defining an interior void space and having a top wall that has a top surface and that defines at least one opening through the top wall to the void space, the base further defining fluid entrance and exit ports into the void space, the top wall being made of material that can be friction stir welded. A lid having a size and shape substantially conformal to the opening, having a top surface and a bottom surface that defines a set of downwardly extending pins, and that is formed of a material that can be friction stir welded to the base is placed into the opening so that the lid top surface is flush with the top surface of the base top wall and friction welding the lid to the base.

Abstract: A structurally robust power switching assembly, that has a power transistor, comprising a thin and delicate layer of metal oxide, and a major surface of the layer of metal oxide being substantially coincident with a major surface of the power transistor, the major surface of the power transistor defining both an emitter and a gate. Also, dielectric material is placed over a portion of the emitter, so that it abuts the gate and a highly conductive pillar is constructed out of a relatively soft material, supported by the gate and the dielectric material, so that it has a larger area than would be possible if it was supported only by the gate.

Abstract: A structurally robust power switching assembly, that has a power transistor, comprising a thin and delicate layer of metal oxide, and a major surface of the layer of metal oxide being substantially coincident with a major surface of the power transistor, the major surface of the power transistor defining both an emitter and a gate. Also, dielectric material is placed over a portion of the emitter, so that it abuts the gate and a highly conductive pillar is constructed out of a relatively soft material, supported by the gate and the dielectric material, so that it has a larger area than would be possible if it was supported only by the gate.

Abstract: A structurally robust power switching assembly, that has a first rigid structural unit, defining a first unit major surface that is patterned to define a plurality of mutually electrically isolated, electrically conductive paths. Also, a similar, second rigid structural unit is spaced apart from the first unit major surface. Finally, a transistor is interposed between and electrically connected to the first unit major surface and the second unit major surface.

Abstract: A structurally robust power switching assembly, comprising a first rigid structural unit that defines a first unit major surface that is patterned to define a plurality of mutually electrically isolated, electrically conductive paths. Also, a similar, second rigid structural unit is spaced apart from the first unit major surface. Finally, a transistor is interposed between and electrically connected to the first unit major surface and the second unit major surface.

Abstract: A method of making a fluid cooled assembly that incorporates a base that forms a partial enclosure defining an interior void space and having a top wall that has a top surface and that defines at least one opening through the top wall to the void space, the base further defining fluid entrance and exit ports into the void space, the top wall being made of material that can be friction stir welded. A lid having a size and shape substantially conformal to the opening, having a top surface and a bottom surface that defines a set of downwardly extending pins, and that is formed of a material that can be friction stir welded to the base is placed into the opening so that the lid top surface is flush with the top surface of the base top wall and friction welding the lid to the base.

Abstract: An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.

Abstract: A multilayer polymer film capacitor block, adapted to accept high currents. At least one multilayer polymer film capacitor is fit into a cavity defined in a rigid, thermally conductive structure. The cavity is sized and shaped to receive said multilayer polymer film capacitor when said capacitor is at a temperature below 40° C., but fitting said capacitor in a conformal manner so that as said capacitor is raised to temperatures above 40° C., said cavity constrains expansion of said capacitor.

Abstract: A structurally robust power switching assembly, comprising a first rigid structural unit that defines a first unit major surface that is patterned to define a plurality of mutually electrically isolated, electrically conductive paths. Also, a similar, second rigid structural unit is spaced apart from the first unit major surface. Finally, a transistor is interposed between and electrically connected to the first unit major surface and the second unit major surface.

Abstract: A method of assembling and providing an electric power apparatus. The method uses a heat resistant housing having a structure adapted to accommodate and retain a power circuit card and also including a bracket adapted to accommodate and constrain a rigid conductive member. A power circuit card having an electrical terminal is placed into the housing and a rigid conductive member into the bracket. The rigid conductive member is flow soldered to the electrical terminal, thereby exposing the heat resistant housing to heat and creating a solder bond. Finally, the rigid conductive member is affirmatively connected to the housing. The bracket constrains the rigid conductive member so that the act of affirmatively connecting does not weaken the solder bond.

Abstract: A heat producing, fluid cooled assembly that includes a housing made of liquid-impermeable material, which defines a fluid inlet and a fluid outlet and an opening. Also included is an electrical package having a set of semiconductor electrical devices supported on a substrate and the second major surface is a heat sink adapted to express heat generated from the electrical apparatus and wherein the second major surface defines a rim that is fit to the opening. Further, the housing is constructed so that as fluid travels from the fluid inlet to the fluid outlet it is constrained to flow past the opening thereby placing the fluid in contact with the heat sink.

Abstract: A heat dissipation apparatus (51) has a lid (12) and an optimized fin arrangement (16) located in a cavity (57) of a base (11). Semiconductor chips (41, 42, 43, 44, 45, and 46) are coupled to the lid (12), and a heat conducting medium (47) is forced into the cavity (57) through a port (13) and out of the cavity (57) through a different port (14). Heat generated by the semiconductor chips (41, 42, 43, 44, 45, and 46) is thermally conducted into the fin arrangement (16) and then transferred into the heat conducting medium (47).

Abstract: An electronic component (10) has an electrically insulating substrate (20) that is encapsulated with an electrically conductive material (15) to provide thermal dissipation for the electronic component (10). The electrically insulating substrate (20) has cavities (21-24) that are either completely filled with an electrically conductive material (15) or are partially filled to provide recesses (26-27) for electronic devices (30,31). The electronic devices (30,31) are electrically coupled to the leads (60-63) of the electronic component (10) using either wire bonds (70) or metallic depositions (55-57).

Abstract: A method of fabricating a multi-chip package including an aluminum silicon substrate with an aluminum nitride layer thereon forming an electrically insulated surface and aluminum heat conductive areas positioned on the insulated surface. Conductors on the surface of the substrate defining mounting areas and external connections with each mounting area positioned adjacent an associated one of the heat conductive areas and a semiconductor chip mounted in each mounting area. Heat conductive elements connected to the rear surface of each chip and to the associated one of the plurality of heat conductive areas, and each chip encapsulated with reworkable encapsulant.

Abstract: A liquid cooled power dissipation apparatus (10) includes a metal matrix composite heat sink (11) with an insulation layer (17) integral to the apparatus (10). The insulation layer (17) is made integral to the apparatus (10) during infiltration of the metal matrix composite heat sink (11). Electronic components 23 are situated on top of the insulation layer (17).

Abstract: A wirebondless module package and method of fabrication including a molded preform of porous SiC with a cavity having therein an AlN substrate defining a plurality of pockets. The preform being infiltrated with Al and the Al being deposited in each of the pockets. A semiconductor die mounted on the Al in one of the pockets. A dielectric layer covering the Al and defining openings therethrough positioned to expose the aluminum and a connection to the die. A conductive material positioned on the dielectric layer in contact with the die and the Al so as to define terminals and interconnections between the die and the terminals.

Abstract: An electronic module (10) for removing heat from a semiconductor die (41) and a method of making the electronic module (10). The electronic module (10) has a baseplate (11) mated with an isolation structure (23). The isolation structure (23) has three portions: a first portion is bonded to the top surface (12) of the baseplate (11), a second portion is bonded to the bottom surface (13) of the baseplate (11), and a third portion is bonded to a side (14) of the baseplate (11). A semiconductor die (41) is bonded to the first portion of the isolation structure (23) and another semiconductor die (41) is bonded to the second portion of the isolation structure (23). The baseplate (11) has a cavity (20) through which a fluid flows and transports heat away from each semiconductor die (41).

Abstract: An electronic module and a method for coupling a power lead (32) to a bond pad (28) on a semiconductor die (17) within the electronic module. A clip support (13) having a slot (27) is coupled to a baseplate (11) via an isolation structure (14). The semiconductor die (17) is coupled to the baseplate (11) via an isolation structure (19). The power lead (32) is coupled to the isolation structure (14). The clip support (13) is coupled to the semiconductor die (17) via a clip (29), wherein a first end of the clip (29) is inserted in the slot (27) and a second end of the clip (29) is compressively mated with the semiconductor die (17). Compressively mating the clip (29) with the semiconductor die (17) eliminates the need for bond feet, thereby increasing the reliability of the module.

Abstract: A heat dissipation apparatus having a base structure (11) and fins (29, 43) and a method for making the heat dissipation apparatus. The base structure (11) is formed as a molded porous preform structure having a top surface (12), a bottom surface (13), and grooves (14) in the bottom surface (13). A layer of dielectric material (17) is placed on the top surface (12) and the porous base structure is infiltrated with a conductive material, thereby bonding the layer of dielectric material (17) to the base structure (11). The grooves (14) are coated with a conductive epoxy and the fins (29) are inserted into the grooves (14) to form a heat dissipation apparatus (30). Alternatively, the fins (43) are formed when the porous base structure is infiltrated with the conductive material, thereby forming a unitary heat dissipation apparatus (44).