Abstract: A probe includes a first deforming portion which includes a linkage mechanism formed by a vertical probe and a plurality of horizontal beams extending in a direction perpendicular to vertical direction, one ends of the horizontal beams being connected to a fixed end and the other ends being connected to the vertical probe, wherein: a vertical portion of the vertical probe extending from the horizontal beams forms a second deforming portion including a horizontal beam portion extending toward the fixed end from an intermediate part of the vertical portion; and scrubbing of the vertical probe in whole operation of an overdrive is strictly controlled by causing bending moment to act on the horizontal beam portion of the second deforming portion, simultaneously with the overdrive applying in a direction in which bending moment applied to the vertical probe of the first deforming portion is offset.

Abstract: Provided is a probe assembly that can be used for fine-pitch pads and can be made with lower cost. The probe assembly includes: a vertical probe which is formed by etching metal foil, and touches a to-be-inspected semiconductor chip electrode; an output terminal which projects from a side opposite to the side of the vertical probe and touches a wiring board; a thin plate-shaped probe which has a substantially rectangular cross section at a part thereof and includes an opening which engages a support rod; and a support rod which includes a first guide groove which guides the opening, a second guide groove which guides the vertical probe, and a third guide groove which guides the output terminal.

Abstract: An electrical signal connector which may be used for testing narrow-pitched chips or multi-chips, and causes no faulty connections between probes and pads or between probes and a circuit board even in a high temperature environment such as in a burn-in test is provided. The electrical signal connector has a probe unit in which a plurality of resin-made film probes, corresponding to one or more pads on a semiconductor chip to be tested, are supported in parallel on a plurality of support plates; a first probe holder of grid structure provided with a plurality of openings; and a second probe holder of the same configuration as that of the first probe holder, the second probe holder having projections at intersection points in the grid structure. The first and second probe holders are fastened to the circuit board with the projections of the second probe holder inserted in corresponding holes of the circuit board and the first probe holder being fastened to the circuit board with screws.

Abstract: A prober unit in which probes are brought into contact with to-be-tested semiconductor chips to establish electrical connection between the semiconductor chips and a test unit via the probes. A probe assembly and a plurality of wiring boards are prepared, the probe assembly being constituted by integrated regularly-arranged multiple probe groups including output terminals connected directly to the probes, and each of the wiring boards including wiring adhering to a surface of a non-conductive film; and an n-th row of an output terminal group of the probe assembly is brought into contact with a land group provided at an end of an n-th wiring board, and a wiring terminal provided at the other end of the n-th wiring board is connected to one of a wiring board of the test unit and a connector to establish electrical connection between the to-be-tested semiconductor chips and the test unit.

Abstract: Provided is a probe which secures large overdrive and makes strict control of a scrubbing amount.

Abstract: To facilitate connection between a narrow-pitched probe assembly and a coarse-pitched printed circuit board.

Abstract: An inexpensive probe assembly is provided which is applicable to narrow pad arrangements of LSI circuit designs, while closely-arranged wiring patterns near probe terminals is distributed effectively on an inspection substrate. A probe assembly is provided which is fabricated by etching metallic foil adhering to a resin film to form a conductive pattern including probing function on the resin film, and stacking or parallel-arranging a plurality of the resin films with probing function, the probe assembly used for inspecting circuits on a semiconductor chip by making probe tips collectively contact electrode pads on the chip, characterized in that the probe assembly includes an electrical terminal which is connected to the probe via the conductive pattern and is made to contact with a connecting land of the circuit board at an opposite side in a first direction (vertical direction) on the same plane as the probe.

Abstract: To precisely control behavior of a probe at a portion near a contact, and to provide a probe with small electric capacity which can be used to inspect chips having high-speed and high-capacity signals. A parallel spring probe based on a principle of a link mechanism, the link mechanism including: a vertically extending vertical probe; and a plurality of linear or curved horizontal beams extending in a direction perpendicular to the vertical direction, the beams being fastened to a fixed end at one ends and connected to the vertical probe at the other ends, characterized in that distance between at least a pair of adjacent horizontal beams varies along a direction perpendicular to the vertical direction.

Abstract: An electrical signal connector which may be used for testing narrow-pitched chips or multi-chips, and causes no faulty connections between probes and pads or between probes and a circuit board even in a high temperature environment such as in a burn-in test is provided. The electrical signal connector has a probe unit in which a plurality of resin-made film probes, corresponding to one or more pads on a semiconductor chip to be tested, are supported in parallel on a plurality of support plates; a first probe holder of grid structure provided with a plurality of openings; and a second probe holder of the same configuration as that of the first probe holder, the second probe holder having projections at intersection points in the grid structure. The first and second probe holders are fastened to the circuit board with the projections of the second probe holder inserted in corresponding holes of the circuit board and the first probe holder being fastened to the circuit board with screws.

Abstract: A probe card which can be used for testing narrow-pitched chips or multi-chips, and causes no faulty connections between probes and pads or between probes and a circuit board even in a high temperature environment such as in a burn-in test is provided. For this purpose, probe units in which multiple film probes are supported by support rods in a stacked or parallel-arranged manner are placed and fixed in each of the openings in a grid support. A plurality of fixing devices protruding from the grid support at a side to be connected to the circuit board are provided to be inserted in corresponding holes in the circuit board to fix the grid support to the circuit board. There is no or subtle difference between an outer diameter of an inserting section of the fixing device and an inner diameter of the hole in the circuit board around the center of the circuit board with the inserting section inserted in the hole, and the difference is larger at the rest of the area of the circuit board.

Abstract: A probe available for a narrow pitch pad without the need of cleaning is realized by providing a z deformed portion that is elastically deformed in a vertical direction, and a z? deformed portion that is serially connected to the z deformed portion to rotate while being elastically deformed at least in the vertical direction. The z? deformed portion has one or more rotation centers. The probe end has a curved surface in which the z? deformed portion rotates about the rotation centers when coming into contact with the pad and during overdrive in the inspection, the probe end comes into contact with the pad surface at one point or within a certain range, a relative displacement occurs between the pad surface and the probe end, the contaminant material is removed in the beginning of the contact, and then electrical continuity is established in the second half of the contact.

Abstract: Vertical contactors regularly arrayed over a film is brought into vertical contact with the end faces of wiring terminals formed at one end of a flexible flat cable, and signal lines from a narrowed-pitch contactor array are connected to a printed circuit board. For this purpose, there is to be realized a coordinate transforming apparatus for electrical signal connection including: a device that has probe input terminals and probe output terminals arrayed in narrow-pitch lines which come into contact with and establish continuity to a wafer pad and in which the probe output terminals are arrayed two-dimensionally in a wide pitch over a substantial plane; a y-directional wiring group in which the probe output terminals and transformation wiring input terminals cross each other to come into contact with and establish continuity among each other; and an x-directional wiring group that crosses and establishes continuity to the output terminals of the y-directional wiring group.

Abstract: The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into contact with terminals for electric connection created on electric functional elements to be tested for electric connection, and a resin film supporting the vertical probes, and the vertical probes are planted resiliently deformably in a surface of a resin film in a direction along the film surface, and an end of the vertical probes is brought into contact with terminals of electric functional elements to be tested and another end of the vertical probes is brought into contact with terminals of an electric function testing apparatus so that signals may be transmitted and received between the electric functional elements to be tested and the electric function testing apparatus.

Abstract: A contact assembly and an LSI chip inspecting device using the same are disclosed. The contact assembly is mounted between an electronic device to be tested and a circuit inspecting device to electrically connect them. The contact assembly includes contacts, each of which includes vertical type probes and a ribbon-shaped resin film to which the vertical type probes are mounted apart from each other in a longitudinal direction of the ribbon-shaped resin film, a position determining member for overlapping the contacts in a thickness direction of the contact such that the contacts are separated from each other, and fixing the contacts, and a guide block which is formed with an opening for receiving the contacts. The guide block is formed with a recess in which the position determining member is seated, so that terminals of the vertical type probes protrude above and below surface planes of the guide block, perpendicularly thereto.

Abstract: A probe assembly for performing circuit inspection of semiconductor chips according to which a resin film with copper foil attached thereto is used to form a conductive portion including a vertical probe on the resin film by etching the copper foil, plural sheets of the resin film with the vertical probe are laminated, and end portions of the vertical probes are brought into contact with electrode pads of the chips.

Abstract: To precisely control behavior of a probe at a portion near a contact, and to provide a probe with small electric capacity which can be used to inspect chips having high-speed and high-capacity signals. A parallel spring probe based on a principle of a link mechanism, the link mechanism including: a vertically extending vertical probe; and a plurality of linear or curved horizontal beams extending in a direction perpendicular to the vertical direction, the beams being fastened to a fixed end at one ends and connected to the vertical probe at the other ends, characterized in that distance between at least a pair of adjacent horizontal beams varies along a direction perpendicular to the vertical direction.

Abstract: An inexpensive probe assembly is provided which is applicable to narrow pad arrangements of LSI circuit designs, while closely-arranged wiring patterns near probe terminals is distributed effectively on an inspection substrate. A probe assembly is provided which is fabricated by etching metallic foil adhering to a resin film to form a conductive pattern including probing function on the resin film, and stacking or parallel-arranging a plurality of the resin films with probing function, the probe assembly used for inspecting circuits on a semiconductor chip by making probe tips collectively contact electrode pads on the chip, characterized in that the probe assembly includes an electrical terminal which is connected to the probe via the conductive pattern and is made to contact with a connecting land of the circuit board at an opposite side in a first direction (vertical direction) on the same plane as the probe.

Abstract: A probe card which can be used for testing narrow-pitched chips or multi-chips, and causes no faulty connections between probes and pads or between probes and a circuit board even in a high temperature environment such as in a burn-in test is provided. For this purpose, probe units in which multiple film probes are supported by support rods in a stacked or parallel-arranged manner are placed and fixed in each of the openings in a grid support. A plurality of fixing devices protruding from the grid support at a side to be connected to the circuit board are provided to be inserted in corresponding holes in the circuit board to fix the grid support to the circuit board. There is no or subtle difference between an outer diameter of an inserting section of the fixing device and an inner diameter of the hole in the circuit board around the center of the circuit board with the inserting section inserted in the hole, and the difference is larger at the rest of the area of the circuit board.

Abstract: There is disclosed a coordinate transformation device for electrical signal connection used for a probe card applicable to narrow pitch pads, which particularly simplifies wiring from the terminal onto the inspection apparatus board and prevents electrical contact failure. In the coordinate transformation device for electrical signal connection, an input terminal of a first wiring group corresponding to one of probe output terminals is provided with at least two terminals independently movable in a yz plane. When the probe output terminal and the input terminal of the first wiring group are contacted and conducted with each other, a wall surface of a first terminal of the input terminal of the first wiring group comes into contact with a side wall of the probe output terminal, and a wall surface of a second terminal thereof comes into contact with a side surface on the opposite side of the probe output terminal.

Abstract: The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into contact with terminals for electric connection created on electric functional elements to be tested for electric connection, and a resin film supporting the vertical probes, and the vertical probes are planted resiliently deformably in a surface of a resin film in a direction along the film surface, and an end of the vertical probes is brought into contact with terminals of electric functional elements to be tested and another end of the vertical probes is brought into contact with terminals of an electric function testing apparatus so that signals may be transmitted and received between the electric functional elements to be tested and the electric function testing apparatus.