Abstract: A probe which is cleaning-free, of which rubbing operation can be precisely controlled, and can be used for narrow-pitch pads, is provided. The probe assembly includes: a Z-deforming portion elastically deformable at least in a vertical direction; a tip contact element which includes a contact portion having a curved section, the tip contact element being connected to and supported on an end of the Z-deforming portion via an arm member, the contact portion being made to contact with an electrode pad and is vertically displaceable and rotatable; and a stopper for restricting movement of the tip contact element. After the tip contact element is rotated, due to pushing force from the electrode pad, for a certain distance in a direction of rotation, the stopper controls the movement of the tip contact element to prevent further rotation and to allow vertical movement.

Abstract: A contactor assembly suitable for high frequency testing and having a large overdrive is to be provided. For this purpose, there is realized a multiple beam-synthesized type contactor assembly including: a resin film constituting a base material; an electroconductive pattern formed over the resin film and made up of an electric conductor including a vertical probe; an electroconductive beam having a linear or curvilinear shape of which one end is fixed and the other is connected to the vertical probe; and one deformable beam extending substantially in parallel to the electroconductive beam, wherein the electroconductive beam and deformable beam(s) are firmly fixed mechanically in the vicinity of the vertical probe to constitute a cantilever of a parallel spring structure, the electroconductive beam and deformable beam(s) have an electrical characteristic of being electrically conductive or electrically non-conductive, and plural the resin films each with a vertical probe are stacked.

Abstract: The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into contact with terminals for electric connection created on electric functional elements to be tested for electric connection, and a resin film supporting the vertical probes, and the vertical probes are planted resiliently deformably in a surface of a resin film in a direction along the film surface, and an end of the vertical probes is brought into contact with terminals of electric functional elements to be tested and another end of the vertical probes is brought into contact with terminals of an electric function testing apparatus so that signals may be transmitted and received between the electric functional elements to be tested and the electric function testing apparatus.

Abstract: There is disclosed a coordinate transformation device for electrical signal connection used for a probe card applicable to narrow pitch pads, which particularly simplifies wiring from the terminal onto the inspection apparatus board and prevents electrical contact failure. In the coordinate transformation device for electrical signal connection, an input terminal of a first wiring group corresponding to one of probe output terminals is provided with at least two terminals independently movable in a yz plane. When the probe output terminal and the input terminal of the first wiring group are contacted and conducted with each other, a wall surface of a first terminal of the input terminal of the first wiring group comes into contact with a side wall of the probe output terminal, and a wall surface of a second terminal thereof comes into contact with a side surface on the opposite side of the probe output terminal.

Abstract: The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into contact with terminals for electric connection created on electric functional elements to be tested for electric connection, and a resin film supporting the vertical probes, and the vertical probes are planted resiliently deformably in a surface of a resin film in a direction along the film surface, and an end of the vertical probes is brought into contact with terminals of electric functional elements to be tested and another end of the vertical probes is brought into contact with terminals of an electric function testing apparatus so that signals may be transmitted and received between the electric functional elements to be tested and the electric function testing apparatus.

Abstract: A probe available for a narrow pitch pad without the need of cleaning is realized by providing a z deformed portion that is elastically deformed in a vertical direction, and a z? deformed portion that is serially connected to the z deformed portion to rotate while being elastically deformed at least in the vertical direction. The z? deformed portion has one or more rotation centers. The probe end has a curved surface in which the z? deformed portion rotates about the rotation centers when coming into contact with the pad and during overdrive in the inspection, the probe end comes into contact with the pad surface at one point or within a certain range, a relative displacement occurs between the pad surface and the probe end, the contaminant material is removed in the beginning of the contact, and then electrical continuity is established in the second half of the contact.

Abstract: Vertical contactors regularly arrayed over a film is brought into vertical contact with the end faces of wiring terminals formed at one end of a flexible flat cable, and signal lines from a narrowed-pitch contactor array are connected to a printed circuit board. For this purpose, there is to be realized a coordinate transforming apparatus for electrical signal connection including: a device that has probe input terminals and probe output terminals arrayed in narrow-pitch lines which come into contact with and establish continuity to a wafer pad and in which the probe output terminals are arrayed two-dimensionally in a wide pitch over a substantial plane; a y-directional wiring group in which the probe output terminals and transformation wiring input terminals cross each other to come into contact with and establish continuity among each other; and an x-directional wiring group that crosses and establishes continuity to the output terminals of the y-directional wiring group.

Abstract: A contactor assembly suitable for high frequency testing and having a large overdrive is to be provided. For this purpose, there is realized a multiple beam-synthesized type contactor assembly including: a resin film constituting a base material; an electroconductive pattern formed over the resin film and made up of an electric conductor including a vertical probe; an electroconductive beam having a linear or curvilinear shape of which one end is fixed and the other is connected to the vertical probe; and one deformable beam extending substantially in parallel to the electroconductive beam, wherein the electroconductive beam and deformable beam(s) are firmly fixed mechanically in the vicinity of the vertical probe to constitute a cantilever of a parallel spring structure, the electroconductive beam and deformable beam(s) have an electrical characteristic of being electrically conductive or electrically non-conductive, and plural the resin films each with a vertical probe are stacked.

Abstract: A probe assembly for performing circuit inspection of semiconductor chips according to which a resin film with copper foil attached thereto is used to form a conductive portion including a vertical probe on the resin film by etching the copper foil, plural sheets of the resin film with the vertical probe are laminated, and end portions of the vertical probes are brought into contact with electrode pads of the chips.

Abstract: A contact assembly and an LSI chip inspecting device using the same are disclosed. The contact assembly is mounted between an electronic device to be tested and a circuit inspecting device to electrically connect them. The contact assembly includes contacts, each of which includes vertical type probes and a ribbon-shaped resin film to which the vertical type probes are mounted apart from each other in a longitudinal direction of the ribbon-shaped resin film, a position determining member for overlapping the contacts in a thickness direction of the contact such that the contacts are separated from each other, and fixing the contacts, and a guide block which is formed with an opening for receiving the contacts. The guide block is formed with a recess in which the position determining member is seated, so that terminals of the vertical type probes protrude above and below surface planes of the guide block, perpendicularly thereto.

Abstract: The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into contact with terminals for electric connection created on electric functional elements to be tested for electric connection, and a resin film supporting the vertical probes, and the vertical probes are planted resiliently deformably in a surface of a resin film in a direction along the film surface, and an end of the vertical probes is brought into contact with terminals of electric functional elements to be tested and another end of the vertical probes is brought into contact with terminals of an electric function testing apparatus so that signals may be transmitted and received between the electric functional elements to be tested and the electric function testing apparatus.

Abstract: A prove pin assembly is provided in which the probe pins for a chip under test occupy the only space above the chip, not extending into the space above the adjacent chip. The probe pin assembly has a lateral array of parallel probe pins of a plurality of first perpendicular-type probe pins and a vertical array of parallel probe pins of a plurality of second perpendicular-type probe pins, wherein said lateral array of parallel probe pins and vertical array of parallel probe pins occupy different spaces for deformation above the region of the chip under test and fit in the limited planar range corresponding to the chip.

Abstract: A probe device is provided which solves a problem of connection between vertical probes assembled at a narrow pitch and connection terminals formed on a printed circuit board at a coarse pitch. For this purpose, the probe device comprises: a probe assembly made up of a plurality of regularly arrayed vertical probes; a flexible flat cable having metal lines formed and bonded to a surface of a non-conductive flexible film; and a fixing device for fixing one end of the flexible flat cable; wherein metal line terminals formed at the one end of the flexible flat cable secured to the fixing device are put in contact with the probe assembly, metal line terminals formed at the other end of the flexible flat cable are connected to a printed circuit board, and the semiconductor chip to be inspected and the printed circuit board are electrically connected together through the probe assembly and the flexible flat cable.

Abstract: A probe device is provided which solves a problem of connection between vertical probes assembled at a narrow pitch and connection terminals formed on a printed circuit board at a coarse pitch. For this purpose, the probe device comprises: a probe assembly made up of a plurality of regularly arrayed vertical probes; a flexible flat cable having metal lines formed and bonded to a surface of a non-conductive flexible film; and a fixing device for fixing one end of the flexible flat cable; wherein metal line terminals formed at the one end of the flexible flat cable secured to the fixing device are put in contact with the probe assembly, metal line terminals formed at the other end of the flexible flat cable are connected to a printed circuit board, and the semiconductor chip to be inspected and the printed circuit board are electrically connected together through the probe assembly and the flexible flat cable.

Abstract: A prove pin assembly is provided in which the probe pins for a chip under test occupy the only space above the chip, not extending into the space above the adjacent chip. The probe pin assembly has a lateral array of parallel probe pins of a plurality of first perpendicular-type probe pins and a vertical array of parallel probe pins of a plurality of second perpendicular-type probe pins, wherein said lateral array of parallel probe pins and vertical array of parallel probe pins occupy different spaces for deformation above the region of the chip under test and fit in the limited planar range corresponding to the chip.

Abstract: The present invention provides a mechanism of a lattice type contact assembly capable of ensuring an appropriate space occupied by an deformation section, and a contact having an appropriate deformation structure conforming to the arrangement in which thin plate contacts are inclined. Contacts having winding elastic deformation sections such that the shape of elastic deformation sections can be selected from many possible alternatives and the relative positional relationship between input sections and output sections can be freely selected are arranged so as to have a certain angle with respect to the x-axis, thereby making it possible to realize a contact assembly with a lattice arrangement of a small pitch.