Abstract: A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.

Abstract: A method for producing a surface mounting optoelectronic component comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, whereby the optical device comes into contact with the casting compound.

Abstract: The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.

Abstract: The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.

Abstract: The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body (1). In the first method, a suspension (4) containing a bonding agent and at least one luminescent material (5) is applied to the semiconductor body (1) in layers. In the next step the solvent escapes, leaving only the luminescent material (5) with the bonding agent on the semiconductor body. In the second method, the semiconductor body (1) is provided with a layer (6) of bonding agent to which the luminescent material (5) is applied directly.

Abstract: An apparatus having at least one fixing element is specified, the fixing dement being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.

Abstract: The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.

Abstract: A configuration of multiple LED modules comprising a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer, wherein the first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

Abstract: Presented is a method for simultaneously producing a multiplicity of surface-mountable semiconductor components each having at least one semiconductor chip, at least two external electrical connections, which are electrically conductively connected to at least two electrical contacts of the semiconductor chip, and an encapsulation material.

Abstract: A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.

Abstract: A light source module having a plurality of LEDs connected to a metal carrier (4) by means of an insulating layer (3). In order to afford protection against mechanical effects and in order to form a reflector, the LEDs are surrounded by a frame (10), which is segmented into a plurality of parts by expansion joints (13), in order that stresses occurring as a result of temperature fluctuations are absorbed.

Abstract: A lighting device is disclosed comprising a plurality of semiconductor light sources disposed on a carrier, wherein the light from the light sources is coupled into assigned lightguides at a set angle to the surface normals of the carrier and the lightguides are provided with reflecting and light exit faces such that the envelope of the light outcoupling faces forms a curved surface segment.

Abstract: The invention relates to an optoelectronic component, having a semiconductor chip (1) which is mounted on a flexible chip support (6), in which conductor tracks (3, 5) for electrically connecting the semiconductor chip (1) are embodied on a first main face, and on which a housing frame (7) is disposed that is filled with a radiation-permeable medium, in particular a filler compound. A display device, an illumination or backlighting device, and a method for producing components of the invention are also disclosed.

Abstract: A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.

Abstract: An LED module has a carrier, which contains a semiconductor layer and has a planar main area, on which LED semiconductor bodies are applied. Use is preferably made of LED semiconductor bodies which emit light of differing central wavelengths during operation, so that the LED module is suitable for generating mixed-color light, and in particular for generating white light.

Abstract: A device (1) with a number of light emitting diode chips (5) in a reflector (3) is formed in such a way that the direct line of sight between the light emitting diode chips (5) is interrupted by a partition (11). This improves the efficiency of the device (1) substantially.

Abstract: Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.

Abstract: An illumination device is specified which comprises an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is provided for fixing at the optoelectronic component and has an optical axis, the optical element having a radiation exit area and the radiation exit area having a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, the optical axis running through the concavely curved partial region.

Abstract: The invention relates to a method of making LED chips provided with a luminescence conversion material containing at least one phosphor. In the method, a layer composite is prepared that includes an LED layer sequence for a multiplicity of LED chips and comprises on a main surface at least one electrical contact surface for each LED chip, for electrically connecting said chip. A layer of adhesion promoter is applied to the main surface and selectively removed from at least portions of the contact surfaces. At least one phosphor is then applied to the main surface. Alternatively, a luminescence conversion material is applied to the main surface and selectively removed from at least portions of the contact surfaces. The invention also relates to an LED chip provided with a luminescence conversion material.

Abstract: A lighting device is disclosed comprising a plurality of semiconductor light sources disposed on a carrier, wherein the light from the light sources is coupled into assigned lightguides at a set angle to the surface normals of the carrier and the lightguides are provided with reflecting and light exit faces such that the envelope of the light outcoupling faces forms a curved surface segment.