Abstract: The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.

Abstract: A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Abstract: The invention proposes an arrangement of luminescent materials for excitation by means of a radiation source and involving the use of a luminescent material having a Ce-activated garnet structure A3B5O12, in which the first component A contains at least one element from the group consisting of Y, Lu, Se, La, Gd, Sm and Tb and the second component B represents at least one of the elements Al, Ga and In, and a plurality of the luminescent materials are mixed together. An associated wavelength-converting casting compound and an associated light-source arrangement are further proposed.

Abstract: Leadframe and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination arrangement with radiation-emitting components

Abstract: An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.

Abstract: The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.

Abstract: A method for producing a surface mounting optoelectronic component comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, whereby the optical device comes into contact with the casting compound.

Abstract: A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Abstract: A leadframe, a housing, a radiation-emitting component formed therefrom, and a method for producing the component includes the leadframe having a mount part with at least one bonding wire connecting area and at least one electrical solder connecting strip into which a separately manufactured thermal connecting part, which has a chip mounting area, is linked. To form a housing, the leadframe is sheathed, preferably, with a molding compound, with the thermal connecting part being embedded such that it can be thermally connected from the outside.

Abstract: A device (1) with a number of light emitting diode chips (5) in a reflector (3) is formed in such a way that the direct line of sight between the light emitting diode chips (5) is interrupted by a partition (11). This improves the efficiency of the device (1) substantially.

Abstract: The invention relates to an optoelectronic component, having a semiconductor chip (1) which is mounted on a flexible chip support (6), in which conductor tracks (3, 5) for electrically connecting the semiconductor chip (1) are embodied on a first main face, and on which a housing frame (7) is disposed that is filled with a radiation-permeable medium, in particular a filler compound. A display device, an illumination or backlighting device, and a method for producing components of the invention are also disclosed.

Abstract: A radiation source has a field of semiconductor chips, which are disposed below a field of micro-lenses (8) disposed in a hexagonal lattice structure. The radiation source is distinguished by high radiation output and radiation density.

Abstract: An LED module has a carrier, which contains a semiconductor layer and has a planar main area, on which LED semiconductor bodies are applied. Use is preferably made of LED semiconductor bodies which emit light of differing central wavelengths during operation, so that the LED module is suitable for generating mixed-color light, and in particular for generating white light.

Abstract: A method for producing a surface mounting optoelectronic component having comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, so whereby the optical device comes into contact with the casting compound.

Abstract: A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Abstract: The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.

Abstract: An assembly device, in particular a fully automatic assembly device for producing microsystem technical products and for assembling components in the semiconductor industries, comprising an assembly table, a material transport system that transports the products to be placed with components, at least one transport system mounted on the assembly table, and at least one movable component transport unit with at least one assembly head. The component transport unit(s) is/are arranged on one or more carrier system(s) displaceable by means of a transport system in parallel to the direction of transport of the products to be placed with components, which products are in turn displaced by the material transport system(s).

Abstract: A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured. Wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Abstract: The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversation element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.

Abstract: The optoelectronic semiconductor component has an optoelectronic semiconductor chip disposed on a chip carrier with an approximately planar chip carrier surface. The semiconductor chip is fastened with predetermined alignment of its optical axis. A plastic base part supports the chip carrier. The semiconductor chip is electrically conductively connected to at least two electrode terminals routed through the base part, and a lens is disposed above the semiconductor chip on top of the base part. The lens is formed with an independently configured cap produced from plastic material. The cap is mechanically form-locked to a support of the base part. When the cap is placed onto the base part, a holder of the cap and the support engage with one another. The holder and the support are configured such that when the cap is placed onto the base part, the two parts are automatically positioned with respect to one another in such a way that the optical axes of the lens and of the semiconductor chip coincide.