Abstract: An electrical connector assembly includes an electrical connector and a pick up cap. The connector includes an insulative housing, a plurality of contacts received in the housing, a stiffener being able to support and secure the housing, and a metal clip. The housing defines a conduction region for supporting a central processing unit (CPU). The clip is disposed on the housing to press the CPU upon the contacts. The pick up cap provides a smooth flat portion facilitating to be sucked by a vacuum suction device, thereby manipulating the electrical connector assembly on a desire location of a substrate circuit such as a printed circuit board (PCB). The pick up cap attaches to the stiffener, and the pick up cap covers at least a portion of the clip. Thus, user must take away the pick up cap before mounted the CPU to the connector.

Abstract: A heat dissipation device (100) includes a base plate (10), a fin assembly (30), at least one heat pipe (40), and a pair of foot members (20) attached to the base plate. The base plate defines a top surface (12). At least one first channel (18) is defined in the top surface. The fin assembly has a first bottom surface (32). At least one second channel (38) is defined in the first bottom surface corresponding to the at least one first channel. At least one indented portion (324) is defined in the first bottom surface. The at least one heat pipe is received in the first channel and the second channel, and attached through the fin assembly. At least one foot member is attached to the at least one indented portion of the fin assembly.

Abstract: An electrical connector assembly includes an electrical connector and a pick up cap. The connector includes an insulative housing, a plurality of contacts received in the housing, a stiffener being able to support and secure the housing, and a metal clip. The housing defines a conduction region for supporting a central processing unit (CPU). The clip is disposed on the housing to press the CPU upon the contacts. The pick up cap provides a smooth flat portion facilitating to be sucked by a vacuum suction device, thereby manipulating the electrical connector assembly on a desire location of a substrate circuit such as a printed circuit board (PCB). The pick up cap attaches to the stiffener, and the pick up cap covers at least a portion of the clip. Thus, user must take away the pick up cap before mounted the CPU to the connector.

Abstract: The object of the invention is to create high-tensile molded bodies that are made of titanium alloys and are malleable at room temperature and that, compared with the metallic glasses, have macroscopic plasticity and work hardening, without other properties, such as breaking resistance, elastic elongation or corrosion behavior being thus greatly impaired.

Abstract: A feedback array sorter comprising a multi-string sort array having m inputs and outputs and a first buffer memory having m inputs connected to the associated m outputs of said multi-string sort array and q outputs. The buffer includes m.times.q memory units, each of said units adapted to hold one data item. The feedback array sorter further includes a merge tree array having q leave nodes connected to the output of said first buffer memory, and an output from the root node; p-1 buffer memory modules in feedback loops each module having an input connected with output of said merge tree array and q outputs connected to said q leave nodes of said merge tree array; and a multiplexor for controlling the filling from said first buffer and p-1 memory buffers electrically connected to the inputs to said merge tree.