Abstract: The present invention relates to compounds of formula I: in which n, m, X, Y1, R1, R2, R3, R4 and R5 are defined in the Summary of the Invention; capable of being both potent antagonists and degraders of estrogen receptors. The invention further provides a process for the preparation of compounds of the invention, pharmaceutical preparations comprising such compounds and methods of using such compounds and compositions in the management of diseases or disorders associated with aberrant estrogen receptor activity.

Abstract: The present invention relates to compounds of formula I: in which n, m, X, Y1, R1, R2, R3, R4 and R5 are defined in the Summary of the Invention; capable of being both potent antagonists and degraders of estrogen receptors. The invention further provides a process for the preparation of compounds of the invention, pharmaceutical preparations comprising such compounds and methods of using such compounds and compositions in the management of diseases or disorders associated with aberrant estrogen receptor activity.

Abstract: The present invention relates to compounds of formula I: in which n, m, X, Y1, R1, R2, R3, R4 and R5 are defined in the Summary of the Invention; capable of being both potent antagonists and degraders of estrogen receptors. The invention further provides a process for the preparation of compounds of the invention, pharmaceutical preparations comprising such compounds and methods of using such compounds and compositions in the management of diseases or disorders associated with aberrant estrogen receptor activity.

Abstract: The present invention relates to compounds of formula I: in which n, m, X, Y1, R1, R2, R3, R4 and R5 are defined in the Summary of the Invention; capable of being both potent antagonists and degraders of estrogen receptors. The invention further provides a process for the preparation of compounds of the invention, pharmaceutical preparations comprising such compounds and methods of using such compounds and compositions in the management of diseases or disorders associated with aberrant estrogen receptor activity.

Abstract: The present invention relates to compounds of formula I: in which n, m, X, Y1, R1, R2, R3, R4 and R5 are defined in the Summary of the Invention; capable of being both potent antagonists and degraders of estrogen receptors. The invention further provides a process for the preparation of compounds of the invention, pharmaceutical preparations comprising such compounds and methods of using such compounds and compositions in the management of diseases or disorders associated with aberrant estrogen receptor activity.

Abstract: The disclosed compounds relate to treatments and therapies for protein kinase-associated disorders. There is also a need for compounds useful in the treatment or prevention or amelioration of one or more symptoms of cancer, transplant rejections, and autoimmune diseases. Furthermore, there is a need for methods for modulating the activity of protein kinases, such as CDK1, CDK2, CDK4, CDK5, CDK6, CDK7, CDK8 and CDK9, using the compounds provided herein.

Abstract: The disclosed compounds relate to treatments and therapies for protein kinase-associated disorders. There is also a need for compounds useful in the treatment or prevention or amelioration of one or more symptoms of cancer, transplant rejections, and autoimmune diseases. Furthermore, there is a need for methods for modulating the activity of protein kinases, such as CDK1, CDK2, CDK4, CDK5, CDK6, CDK7, CDK8 and CDK9, using the compounds provided herein.

Abstract: A heat dissipation system includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a baseboard with a motherboard and a mass storage device attached to the baseboard, a first cooling fan mounted on a top surface of the motherboard, and an air guiding panel attached on the baseboard surrounding the mass storage device. The air guiding panel guides cool air to the mass storage device along a first direction and out of the mainframe module by the first cooling fan in a second direction perpendicular to the first direction.

Abstract: A heat dissipating system includes an enclosure body, a plurality of heat generating elements, and a heat dissipating module. The enclosure body includes a mounting panel. The mounting panel defines a mounting opening. The plurality of heat generating elements is mounted to an inner side of the mounting panel and covers the mounting opening. The heat dissipating module includes a base and a plurality of fins extending from the base. The base is mounted to an outer side of the mounting panel to cover the mounting opening and to contact the plurality of heat generating elements.

Abstract: A machining apparatus includes a machine and robot. The machine includes a top plate, a ventilation portion, an exhaust pipe, a fan, a pipe and a jig secured to the top plate. The jig is configured for securing a workpiece to be processed. The robot is configured for polishing and cutting the workpiece. The jig defines a cutout between a top surface of the jig and the top plate. The pipe communicates with the cutout. The ventilation portion communicates with the exhaust pipe and is located between the pipe and the exhaust pipe. The fan secured to the ventilation portion. The fan guides air flows into the pipe through the cutout and discharges the air out of the machine via the ventilation portion and the exhaust pipe.

Abstract: A heat dissipation device includes a base, at least one heat pipe, and a fin assembly. The base is substantially planar. The base includes a first interface and a second interface opposite to the first interface. The first interface is adapted to contact a heat element. The base defines a slot at the second interface. The at least one heat pipe is received in the slot. The fin assembly contacts the second interface and the at least one heat pipe simultaneously.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate perpendicularly to the base plate, a heat sink, a first fan and an air duct. The heat sink is positioned in the computer case in contact with a first heat source. The first heat source and the back plate define a first air channel therebetween. The first fan is positioned in the computer case adjacent to a first side of the heat sink. The first fan is configured to generate airflow through the heat sink in such a manner that airflow flows from the computer case outside is sucked into the computer case via the first air inlet and the first air channel. The air duct is positioned in the computer case adjacent to a second side of the heat sink. The heat sink heats the airflow from the first fan. The warm airflow heated by the heat sink is then blown out of the computer case by the first fan via the air duct.

Abstract: A heat dissipation system includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a baseboard with a motherboard and a mass storage device attached to the baseboard, a first cooling fan mounted on a top surface of the motherboard, and an air guiding panel attached on the baseboard surrounding the mass storage device. The air guiding panel guides cool air to the mass storage device along a first direction and out of the mainframe module by the first cooling fan in a second direction perpendicular to the first direction.

Abstract: An electronic device includes a mainframe module and a heat dissipation module. The mainframe module includes a base panel and a motherboard attached on the base panel. The motherboard has a first heat generating component and a second heat generating component mounted thereon. The heat dissipation module includes a first heat sink, a second heat sink attached to a first open side of the first heat sink, a first heat pipe, and a second heat pipe. The first heat pipe is connected between the first heat sink and the first heat generating component. The second heat pipe is connected between the second heat sink and the second heat generating component. The motherboard and the heat dissipation module are mounted on the base panel side by side.

Abstract: A heat dissipation apparatus includes a computer case having a base plate, a motherboard positioned on the base plate, and a heat sink. The motherboard includes a first heat source positioned thereon. The heat sink is positioned on the first heat source and thermally contacts with the first heat source. The motherboard includes a second heat source located on a first side of the heat sink. An angle between the second heat source and a motherboard plane is greater than 0 degrees and less than 90 degrees. Airflow from outside of the computer case is able to flow through a top surface and a bottom surface of the second heat source to dissipate heat for the first and second heat sources.

Abstract: The disclosed compounds relate to treatments and therapies for protein kinase-associated disorders. There is also a need for compounds useful in the treatment or prevention or amelioration of one or more symptoms of cancer, transplant rejections, and autoimmune diseases. Furthermore, there is a need for methods for modulating the activity of protein kinases, such as CDK1, CDK2, CDK4, CDK5, CDK6, CDK7, CDK8 and CDK9, using the compounds provided herein.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate perpendicularly to the base plate, a heat sink, a first fan and an air duct. The heat sink is positioned in the computer case in contact with a first heat source. The first heat source and the back plate define a first air channel therebetween. The first fan is positioned in the computer case adjacent to a first side of the heat sink. The first fan is configured to generate airflow through the heat sink in such a manner that airflow flows from the computer case outside is sucked into the computer case via the first air inlet and the first air channel. The air duct is positioned in the computer case adjacent to a second side of the heat sink. The heat sink heats the airflow from the first fan. The warm airflow heated by the heat sink is then blown out of the computer case by the first fan via the air duct.

Abstract: An air conducting device includes a body, a baffle and a plurality of tongues. The body defines an airflow passageway therein. The baffle extends from the body to divide the airflow passageway into a first passageway and a second passageway. The first passageway is capable of receiving at least one first heat generating component therein. The second passageway is capable of receiving at least one second heat generating component therein. The first heat generating component is located in one of a plurality a slots. A plurality of tongues are located in the first passageway. Each tongue corresponds to the location of the plurality of slots. A guide channel is defined between every two adjacent tongues.

Abstract: The disclosed compounds relate to treatments and therapies for protein kinase-associated disorders. There is also a need for compounds useful in the treatment or prevention or amelioration of one or more symptoms of cancer, transplant rejections, and autoimmune diseases. Furthermore, there is a need for methods for modulating the activity of protein kinases, such as CDK1, CDK2, CDK4, CDK5, CDK6, CDK7, CDK8 and CDK9, using the compounds provided herein.

Abstract: A heat dissipation device (100) includes a base plate (10), a fin assembly (30), at least one heat pipe (40), and a pair of foot members (20) attached to the base plate. The base plate defines a top surface (12). At least one first channel (18) is defined in the top surface. The fin assembly has a first bottom surface (32). At least one second channel (38) is defined in the first bottom surface corresponding to the at least one first channel. At least one indented portion (324) is defined in the first bottom surface. The at least one heat pipe is received in the first channel and the second channel, and attached through the fin assembly. At least one foot member is attached to the at least one indented portion of the fin assembly.