Patents by Inventor Guo Yang

Guo Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260069915
    Abstract: A system for strength and conditioning training includes an exercise rack and a load regulation assembly mounted on the rack, the load regulation assembly moveable relative to the rack, wherein the load regulation assembly is configured to receive and support a weight, and the load regulation assembly is configured to adjust the magnitude and/or direction of an applied load.
    Type: Application
    Filed: September 4, 2025
    Publication date: March 12, 2026
    Inventors: Ning Xi, Jiangcheng Chen, Guo Yang, Kehan Zou, Yuetian Chen, Weiqun Lou, King Wai Chiu Lai, Zijia Qu
  • Patent number: 12530356
    Abstract: A method of performing a data search in a data source by which an operator of a data search pipeline is just-in-time optimized and compiled, using an operator optimization module which optimizes and compiles an intermediate representation of the operator, considering runtime information, and optimization rules, to produce an operator that is optimized for the data search being performed. The method can be applied with one operator or with many operators applied in any sequence or tree structure according to a query plan, as determined by runtime information and optimization rules.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: January 20, 2026
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zanqing Zhang, Benoit Hudzia, Arven Ding, Guo Yang, Zheng Li, Jingfang Zhang, Songling Liu, Denghong Liao
  • Patent number: 12467830
    Abstract: A sampling device comprises a handle and a collector. The collector is connected to the handle. The collector has a capillary function and is able to automatically suction a liquid reagent or sample. The sampling device is able to suction a required amount of the reagent or sample quickly, conveniently and quantitatively. The sampling device can be product conveniently, and may achieve micro-quantitative sampling. The reagent is stored in the collector of the sampling device in the form of a dry powder, which may achieve the individual packaging of the detection reagent.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: November 11, 2025
    Assignee: LEADWAY (HK) LIMITED
    Inventors: Tao Shang, Jianliang Ni, Tenglong Bai, Fangfang Tian, Juan Cui, Guo Yang, Linyong Tang
  • Patent number: 11963336
    Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a cutting-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: April 16, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Huipeng Wu, Quanming Li, Guo Yang
  • Publication number: 20240054811
    Abstract: Embodiments of this disclosure provide a mouth shape correction model, and model training and application methods. The model includes a mouth feature extraction module, a key point extraction module, a first video module, a second video module, and a discriminator. The training method includes: based on a first original video and a second original video, extracting corresponding features by using various modules in the model to train the model; and when the model meets a convergence condition, completing the training to generate a target mouth shape correction model. The application method includes: inputting a video in which a mouth shape of a digital-human actor is to be corrected and corresponding audio into a mouth shape correction model, to obtain a video in which the mouth shape of the digital-human actor in the video is corrected, wherein the mouth shape correction model is a model trained by using the training method.
    Type: Application
    Filed: June 21, 2023
    Publication date: February 15, 2024
    Applicant: NANJING SILICON INTELLIGENCE TECHNOLOGY CO., LTD.
    Inventors: Huapeng SIMA, Guo YANG
  • Patent number: 11887403
    Abstract: Embodiments of this disclosure provide a mouth shape correction model, and model training and application methods. The model includes a mouth feature extraction module, a key point extraction module, a first video module, a second video module, and a discriminator. The training method includes: based on a first original video and a second original video, extracting corresponding features by using various modules in the model to train the model; and when the model meets a convergence condition, completing the training to generate a target mouth shape correction model. The application method includes: inputting a video in which a mouth shape of a digital-human actor is to be corrected and corresponding audio into a mouth shape correction model, to obtain a video in which the mouth shape of the digital-human actor in the video is corrected, wherein the mouth shape correction model is a model trained by using the training method.
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: January 30, 2024
    Assignee: NANJING SILICON INTELLIGENCE TECHNOLOGY CO., LTD.
    Inventors: Huapeng Sima, Guo Yang
  • Patent number: 11847003
    Abstract: A folding device and a heat dissipation apparatus, where the folding device includes a heat collection element, including a heat collection plate and a first shaft sleeve, where a first end of the heat collection plate is in contact with a heat source in a first folding part, and a second end of the heat collection plate is coupled to an outer wall of the first shaft sleeve, the first shaft sleeve is sleeved on a rotating shaft, and a third end of the cooling element is in contact with the rotating shaft, and a fourth end of the cooling element is in contact with a heat dissipation device in a second folding part.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: December 19, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guo Yang, Tao Huang, Wenming Shi, Teng Long, Wei Li, Jianliang Wang, Zhiguo Zhang
  • Patent number: 11839055
    Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: December 5, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yongfu Sun, Guo Yang, Quanming Li
  • Patent number: 11778772
    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: October 3, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jiajia Sui, Quanming Li, Guo Yang, Shuainan Lin
  • Patent number: 11665816
    Abstract: In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: May 30, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhi Yuan, Guo Yang, Jian Shi, Linfang Jin, Zhen Xu
  • Publication number: 20230004563
    Abstract: A method of performing a data search in a data source by which an operator of a data search pipeline is just-in-time optimized and compiled, using an operator optimization module which optimizes and compiles an intermediate representation of the operator, considering runtime information, and optimization rules, to produce an operator that is optimized for the data search being performed. The method can be applied with one operator or with many operators applied in any sequence or tree structure according to a query plan, as determined by runtime information and optimization rules.
    Type: Application
    Filed: August 8, 2022
    Publication date: January 5, 2023
    Inventors: Zanqing ZHANG, Benoit HUDZIA, Arven DING, Guo YANG, Zheng LI, Jingfang ZHANG, Songling LIU, Denghong LIAO
  • Publication number: 20220338381
    Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a cutting-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.
    Type: Application
    Filed: July 7, 2022
    Publication date: October 20, 2022
    Inventors: Huipeng WU, Quanming LI, Guo YANG
  • Publication number: 20220338372
    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
    Type: Application
    Filed: July 7, 2022
    Publication date: October 20, 2022
    Inventors: Jiajia SUI, Quanming LI, Guo YANG, Shuainan LIN
  • Publication number: 20220276132
    Abstract: A sampling device comprises a handle and a collector. The collector is connected to the handle. The collector has a capillary function and is able to automatically suction a liquid reagent or sample. The sampling device is able to suction a required amount of the reagent or sample quickly, conveniently and quantitatively. The sampling device can be product conveniently, and may achieve micro-quantitative sampling. The reagent is stored in the collector of the sampling device in the form of a dry powder, which may achieve the individual packaging of the detection reagent.
    Type: Application
    Filed: July 31, 2020
    Publication date: September 1, 2022
    Applicant: LEADWAY (HK) LIMITED
    Inventors: Tao SHANG, Jianliang NI, Tenglong BAI, Fangfang TIAN, Juan CUI, Guo YANG, Linyong TANG
  • Patent number: 11419238
    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
    Type: Grant
    Filed: October 27, 2018
    Date of Patent: August 16, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jiajia Sui, Quanming Li, Guo Yang, Shuainan Lin
  • Publication number: 20220256739
    Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
    Type: Application
    Filed: March 1, 2022
    Publication date: August 11, 2022
    Inventors: Yongfu Sun, Guo Yang, Quanming Li
  • Patent number: 11406044
    Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: August 2, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Huipeng Wu, Quanming Li, Guo Yang
  • Publication number: 20220183146
    Abstract: In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.
    Type: Application
    Filed: March 27, 2020
    Publication date: June 9, 2022
    Inventors: Zhi Yuan, Guo Yang, Jian Shi, Linfang Jin, Zhen Xu
  • Patent number: 11284537
    Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: March 22, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yongfu Sun, Guo Yang, Quanming Li
  • Patent number: 11272639
    Abstract: A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: March 8, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Guo Yang, Quanming Li, Xiaohu Liu, Wei Li, Zhiguo Zhang