Patents by Inventor Guo Yang
Guo Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20200344915Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.Type: ApplicationFiled: July 10, 2020Publication date: October 29, 2020Inventors: Linfang Jin, Guo Yang, Shuainan Lin
-
Publication number: 20200333562Abstract: A lens assembly includes a lens body, a first lens, a second lens, a third lens and a fourth lens, wherein the lens body includes a lens barrel, and the first lens, the second lens, the third lens and the fourth lens are fixed in the lens body in order from an object side to an image side along an optical axis. The first lens is closest to the object side and includes an object side surface, the object side surface is protruded along the optical axis, the first lens further includes a first portion close to the object side and a second portion close to the image side, and a diameter of the first portion is smaller than a diameter of the second portion so that a step is formed between the first portion and the second portion.Type: ApplicationFiled: March 30, 2020Publication date: October 22, 2020Inventors: Guo-Quan Lin, Hsi-Ling Chang, Bo-Yan Chen, Ming-Huang Tseng, Guo-Yang Wu
-
Publication number: 20200245501Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.Type: ApplicationFiled: April 17, 2020Publication date: July 30, 2020Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Huipeng Wu, Quanming Li, Guo Yang
-
Patent number: 10729036Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.Type: GrantFiled: September 27, 2017Date of Patent: July 28, 2020Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Linfang Jin, Guo Yang, Shuainan Lin
-
Publication number: 20200205752Abstract: The present invention relates to a gantry of a CT scanning device comprising: a first housing having a first bore; a second housing having a second bore, disposed opposite to the first housing, wherein there is a gap between the first bore and the second bore, as a ray scanning bore; a scan window assembly comprising an annular window body having an inner surface and an outer surface, the scan window assembly being engaging-locked with the first housing and the second housing and sealing and covering the ray scanning bore. In this way, the engaging-lock can restrict deformation of the annular window body when an external force is applied on the scan window assembly, and the sealing can prevent liquid in the first and second housing from leaking out and prevent liquid inside the scan window assembly from leaking into the first and second housing.Type: ApplicationFiled: December 18, 2019Publication date: July 2, 2020Inventors: Xiaoyan Zhang, Chad A. Smith, Yan Guo Yang, Kiyomi Abeshima
-
Publication number: 20200183131Abstract: A lens assembly includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens. The first lens is with positive refractive power and includes a convex surface facing an object side and a concave surface facing an image side. The second lens is with positive refractive power. The third lens is with negative refractive power and includes a convex surface facing the object side. The fourth lens is with negative refractive power and includes a concave surface facing the object side. The fifth lens is with positive refractive power and includes a convex surface facing the image side.Type: ApplicationFiled: October 28, 2019Publication date: June 11, 2020Inventors: Hsi-Ling Chang, Guo-Yang Wu
-
Publication number: 20190394905Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.Type: ApplicationFiled: September 27, 2017Publication date: December 26, 2019Applicant: Huawei Technologies Co., Ltd.Inventors: Linfang JIN, Guo YANG, Shuainan LIN
-
Publication number: 20190379811Abstract: A camera module includes a base and at least one camera unit. The camera unit is mounted on the base, and the camera unit includes a circuit substrate, an image sensor, a lens assembly, a circuit board, a plurality of metal wires. The circuit substrate is rectangular, and has four edges and a plurality of first pads. The first pads are located along two adjacent edges of the circuit substrate. The image sensor and the lens assembly are mounted on the circuit substrate. The circuit board has two notched edges and a plurality of second pads. The second pads are located along the two notched edges of the circuit board. The second pads correspond to the first pads. Each second pad is connected to a corresponding first pad by one of the metal wires. The camera module uses wire bonding to connect the circuit substrate to the circuit board.Type: ApplicationFiled: June 3, 2019Publication date: December 12, 2019Inventors: LU-QING MENG, WEI-MING WU, CHEN-KUANG YEH, XU-GUO YANG
-
Patent number: 10418829Abstract: A device includes a charger case. Charging electronics are supported within the case. An electrical connector is coupled to the charging electronics for coupling to a power source. A cooling element is coupled to the charger case and extendable to an extended position from the case such that a cooling surface area of the charger case is increased.Type: GrantFiled: January 18, 2017Date of Patent: September 17, 2019Assignee: Futurewei Technologies, Inc.Inventors: Vadim Gektin, Quanming Li, Guo Yang
-
Patent number: 10391690Abstract: The present disclosure provides an injection molding apparatus, including a fixed mold component, a movable mold component, a first positive electrode module, and a first negative electrode module. The fixed mold component has an injection port and a transmission runner, to receive injection-molding melt. The movable mold component has a molding groove communicated with the transmission runner. The first positive electrode module and the first negative electrode module are disposed on a first side and a second side of the molding groove respectively, where the first side and the second side are opposite to each other. The first positive electrode module cooperates with the first negative electrode module to form an electric field between the first side and the second side of the molding groove, to perform electric field excitation on the injection-molding melt flowing into the molding groove.Type: GrantFiled: April 30, 2015Date of Patent: August 27, 2019Assignee: Huawei Technologies Co., Ltd.Inventor: Guo Yang
-
Publication number: 20180201388Abstract: A heat management structure able to disperse heat but also able to retain a proper working heat includes a heat dissipation layer, a receiving member, and a heat pipe. The receiving member is configured to receive a heating member. Ends of the heat pipe are coupled to the heat dissipation layer and the receiving member. A related unmanned aerial vehicle is also provided.Type: ApplicationFiled: April 19, 2017Publication date: July 19, 2018Inventors: HONG-DA DU, WEI CHEN, JING-GUO YANG, LIN GAN, JIA LI, CHENG-JUN XU, XIAO-DONG CHU, YOU-WEI YAO, BAO-HUA LI, QUAN-HONG YANG, YAN-BING HE, FEI-YU KANG
-
Publication number: 20180205245Abstract: A device includes a charger case. Charging electronics are supported within the case. An electrical connector is coupled to the charging electronics for coupling to a power source. A cooling element is coupled to the charger case and extendable to an extended position from the case such that a cooling surface area of the charger case is increased.Type: ApplicationFiled: January 18, 2017Publication date: July 19, 2018Inventors: Vadim Gektin, Quanming Li, Guo Yang
-
Publication number: 20180141250Abstract: The present disclosure provides an injection molding apparatus, including a fixed mold component, a movable mold component, a first positive electrode module, and a first negative electrode module. The fixed mold component has an injection port and a transmission runner, to receive injection-molding melt. The movable mold component has a molding groove communicated with the transmission runner. The first positive electrode module and the first negative electrode module are disposed on a first side and a second side of the molding groove respectively, where the first side and the second side are opposite to each other. The first positive electrode module cooperates with the first negative electrode module to form an electric field between the first side and the second side of the molding groove, to perform electric field excitation on the injection-molding melt flowing into the molding groove.Type: ApplicationFiled: April 30, 2015Publication date: May 24, 2018Inventor: Guo YANG
-
Patent number: 9563024Abstract: Disclosed are a high-density fiber connector and an assembly method thereof. The connector, adapted for use with a fiber adapter, comprises a connector casing, a ferrule, a spring and a boot, wherein the connector casing has a cross width of 2.5 mm to 4.5 mm. The connector casing comprises a front casing and a rear casing, which lock up one another to form a cavity. The tail of the connector casing is connected with a boot. On the connector casing are sequentially arranged a guide block and an elastic arm from the front toward the back. A fixed end of the elastic arm is oriented toward the tail of the connector, while a free end faces an insert end of the connector and includes a retaining bump. The ferrule 2 is fastened with the ferrule tailstock 3 and penetrates through a through hole at the front of the connector casing. The spring is compressed between the ferrule tailstock and a thrust block formed by inner walls of the connector casing.Type: GrantFiled: June 24, 2014Date of Patent: February 7, 2017Assignee: Sunsea Telecommunications Co., Ltd.Inventors: ZhiYun Zhong, Guo Yang, QiYue Wang
-
Patent number: 9513442Abstract: A high density optical fiber switch module comprises a box body whose front end is provided with several optical fiber adapters, the top surface or bottom surface of the optical fiber adapter is provided with a first positioning groove which extending along the direction perpendicular to a direction in which the optical fiber plug is inserted into the optical fiber adapter, and a first positioning protrusion matching with the first positioning groove is arranged on the inner surface of the box body so that when the first positioning protrusion is latched within the first positioning groove, the optical fiber adapter is fixed to the front end of the box body.Type: GrantFiled: July 22, 2011Date of Patent: December 6, 2016Assignee: Sunsea Telecommunications Co., LTDInventors: Qiyue Wang, Guo Yang
-
Patent number: 9170379Abstract: Disclosed are an optical fiber connector an assembly method therefor. The connector is used for matching with an optical fiber adapter, and comprises a connector casing, a ceramic ferrule (2), a spring (4) and a boot (8), wherein the connector casing has a lateral width of 2.5 mm to 4.5 mm, is formed by inserting and locking a front casing (1) and a rear casing (5) and forms a cavity; the tail of the connector casing is connected to the boot (8), the external front end of the connector casing contains a guiding block (101) and a combined elastic arm successively in the rearward direction, and a retaining convex block (104) is arranged on the combined elastic arm; the tail end of the ceramic ferrule (2) is fixed to a tailstock (3) of the ceramic ferrule and penetrates through a through hole at the front end of the connector casing; and the spring is compressed between the tailstock (3) of the ceramic ferrule and a stop block (501) formed by the inner walls of the connector casing.Type: GrantFiled: February 17, 2012Date of Patent: October 27, 2015Assignee: SUNSEA TELECOMMUNICATIONS CO., LTD.Inventors: Guo Yang, Qiyue Wang
-
Publication number: 20140308011Abstract: Disclosed are a high-density fiber connector and an assembly method thereof. The connector, adapted for use with a fiber adapter, comprises a connector casing, a ferrule, a spring and a boot, wherein the connector casing has a cross width of 2.5 mm to 4.5 mm. The connector casing comprises a front casing and a rear casing, which lock up one another to form a cavity. The tail of the connector casing is connected with a boot. On the connector casing are sequentially arranged a guide block and an elastic arm from the front toward the back. A fixed end of the elastic arm is oriented toward the tail of the connector, while a free end faces an insert end of the connector and includes a retaining bump. The ferrule 2 is fastened with the ferrule tailstock 3 and penetrates through a through hole at the front of the connector casing. The spring is compressed between the ferrule tailstock and a thrust block formed by inner walls of the connector casing.Type: ApplicationFiled: June 24, 2014Publication date: October 16, 2014Applicant: SUNSEA TELECOMMUNICATIONS CO.,LTD.Inventors: ZhiYun ZHONG, Guo YANG, QiYue WANG
-
Patent number: 8807935Abstract: A wire arrangement mechanism including a guiding slot and an arranging slot is formed on a fan frame. The guiding slot includes a bottom wall and two holding walls extending therefrom. The arranging slot is defined by an outer frame and a confining portion connected thereto. The arranging slot is staggered from and communicated with the guiding slot.Type: GrantFiled: April 25, 2006Date of Patent: August 19, 2014Assignee: Delta Electronics, Inc.Inventors: Xue-Wei Chu, Heng-Guo Yang, Yung-Ping Lin
-
Publication number: 20140169732Abstract: A high density optical fiber switch module comprises a box body whose front end is provided with several optical fiber adapters, the top surface or bottom surface of the optical fiber adapter is provided with a first positioning groove which extending along the direction perpendicular to a direction in which the optical fiber plug is inserted into the optical fiber adapter, and a first positioning protrusion matching with the first positioning groove is arranged on the inner surface of the box body so that when the first positioning protrusion is latched within the first positioning groove, the optical fiber adapter is fixed to the front end of the box body.Type: ApplicationFiled: July 22, 2011Publication date: June 19, 2014Applicant: SUNSEA TELECOMMUNICATIONS CO., LTD.Inventors: Qiyue Wang, Guo Yang
-
Patent number: D711320Type: GrantFiled: March 12, 2013Date of Patent: August 19, 2014Assignee: Sunsea Telecommunications Co., Ltd.Inventors: Guo Yang, Lin Chen, Qiyue Wang