Patents by Inventor Guofei Diao

Guofei Diao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250193604
    Abstract: This application provides a wireless headset, and relates to the field of TWS wireless headsets. The wireless headset includes a headset housing and a headset assembly accommodated in the headset housing. The headset assembly includes a microphone. The headset housing includes a bottom housing, the bottom housing includes a first bottom housing part and a second bottom housing part that are separated by using an insulating material, the first bottom housing part is a positive charging electrode, and the second bottom housing part is a negative charging electrode.
    Type: Application
    Filed: December 16, 2024
    Publication date: June 12, 2025
    Inventors: Fang-Ching LEE, Shijia PI, Lin LU, Guofei DIAO, Zhonghua WANG
  • Patent number: 12212943
    Abstract: This application provides a wireless headset, and relates to the field of TWS wireless headsets. The wireless headset includes a headset housing and a headset assembly accommodated in the headset housing. The headset assembly includes a microphone. The headset housing includes a bottom housing, the bottom housing includes a first bottom housing part and a second bottom housing part that are separated by using an insulating material, the first bottom housing part is a positive charging electrode, and the second bottom housing part is a negative charging electrode. A plurality of sound inlet holes are disposed on the bottom housing, and form microphone sound inlet channels communicating with each other. In the foregoing technical solutions, wind noise can be reduced, and call experience can be improved.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: January 28, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Fang-Ching Lee, Shijia Pi, Lin Lu, Guofei Diao, Zhonghua Wang
  • Patent number: 12041406
    Abstract: A wireless headset includes a housing and a power system disposed in a cavity enclosed by the housing and configured to supply power to the wireless headset. The wireless headset further includes a first electrical connector and a second electrical connector disposed on the housing of the wireless headset and are respectively electrically connected to two electrodes of the power system. The housing includes a rod body and an earbud connected to a top of the rod body, wherein the first electrical connector is located at a bottom end of the rod body, and the second electrical connector is located on an outer side wall of the earbud.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: July 16, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Qingqiu Liu, Baoxia Li, Lin Lu, Guofei Diao
  • Publication number: 20220295187
    Abstract: This application provides a wireless headset, and relates to the field of TWS wireless headsets. The wireless headset includes a headset housing and a headset assembly accommodated in the headset housing. The headset assembly includes a microphone. The headset housing includes a bottom housing, the bottom housing includes a first bottom housing part and a second bottom housing part that are separated by using an insulating material, the first bottom housing part is a positive charging electrode, and the second bottom housing part is a negative charging electrode. A plurality of sound inlet holes are disposed on the bottom housing, and form microphone sound inlet channels communicating with each other. In the foregoing technical solutions, wind noise can be reduced, and call experience can be improved.
    Type: Application
    Filed: July 16, 2020
    Publication date: September 15, 2022
    Inventors: Fang-Ching LEE, Shijia PI, Lin LU, Guofei DIAO, Zhonghua WANG
  • Publication number: 20220210535
    Abstract: A wireless headset includes a housing and a power system disposed in a cavity enclosed by the housing and configured to supply power to the wireless headset. The wireless headset further includes a first electrical connector and a second electrical connector disposed on the housing of the wireless headset and are respectively electrically connected to two electrodes of the power system. The housing includes a rod body and an earbud connected to a top of the rod body, wherein the first electrical connector is located at a bottom end of the rod body, and the second electrical connector is located on an outer side wall of the earbud.
    Type: Application
    Filed: April 17, 2020
    Publication date: June 30, 2022
    Inventors: Qingqiu Liu, Baoxia Li, Lin Lu, Guofei Diao
  • Patent number: D967803
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: October 25, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ying Zhao, Guofei Diao
  • Patent number: D979539
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: February 28, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Donghyeok Park, Ying Zhao, Jie Huang, Guofei Diao
  • Patent number: D980824
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: March 14, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ying Zhao, Guofei Diao, Donghyeok Park
  • Patent number: D990454
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: June 27, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ying Zhao, Guofei Diao
  • Patent number: D1003276
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: October 31, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yongping Jin, Guofei Diao, Jie Huang
  • Patent number: D1004575
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: November 14, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yongping Jin, Guofei Diao, Jie Huang
  • Patent number: D1033874
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: July 9, 2024
    Assignee: HUAWEI DEVICE CO., LTD.
    Inventors: Guofei Diao, Jie Huang
  • Patent number: D1056836
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: January 7, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guofei Diao, Jie Huang
  • Patent number: D1076438
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: May 27, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guofei Diao, Jie Huang
  • Patent number: D1139249
    Type: Grant
    Filed: November 22, 2024
    Date of Patent: August 4, 2026
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Guofei Diao
  • Patent number: D1144284
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: August 25, 2026
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guofei Diao, Jie Huang
  • Patent number: D1144285
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: August 25, 2026
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guofei Diao, Jie Huang