Headphones

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Description

FIG. 1 is a front perspective view of a first embodiment of a headphone showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a right view thereof;

FIG. 7 is a left view thereof;

FIG. 8 is a rear perspective view thereof;

FIG. 9 is a front perspective view of a second embodiment of a headphone showing our new design;

FIG. 10 is a front view thereof;

FIG. 11 is a back view thereof;

FIG. 12 is a top view thereof;

FIG. 13 is a bottom view thereof;

FIG. 14 is a right view thereof;

FIG. 15 is a left view thereof; and,

FIG. 16 is a rear perspective view thereof.

The broken lines in drawings show portions of the headphone that form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Other references
  • U.S. Appl. No. 29/802,617, filed Aug. 6, 2021, Headphones.
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Patent History
Patent number: D1004575
Type: Grant
Filed: Aug 6, 2021
Date of Patent: Nov 14, 2023
Assignee: HUAWEI TECHNOLOGIES CO., LTD. (Shenzhen)
Inventors: Yongping Jin (Shanghai), Guofei Diao (Shanghai), Jie Huang (Shanghai)
Primary Examiner: Paula Allen Greene
Application Number: 29/802,618
Classifications
Current U.S. Class: Headphone (D14/223)