Patents by Inventor Guohao Zhang

Guohao Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10141901
    Abstract: Disclosed are devices and methods for improving power added efficiency and linearity of radio-frequency power amplifiers implemented in flip-chip configurations. In some embodiments, a harmonic termination circuit can be provided so as to be separate from an output matching network configured to provide impedance matching at a fundamental frequency. The harmonic termination circuit can be configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. Such a configuration of separate fundamental matching network and harmonic termination circuit allows each to be tuned separately to thereby improve performance parameters such as power added efficiency and linearity.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: November 27, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Guohao Zhang, Hardik Bhupendra Modi, Jaydutt Jagdish Joshi, Bhuvaneshwaran Vijayakumar, Dinhphuoc Vu Hoang
  • Patent number: 10090812
    Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier die, a first bonding pad on a conductive trace, and a second bonding pad on a conductive trace. The die includes an on-die passive device and a power amplifier. The first bonding pad is electrically connected to the on-die passive device by a first wire bond. The second bonding pad is in a conductive path between the first bonding pad and a radio frequency output of the power amplifier module. The second bonding pad includes a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer and bonded to a second wire bond that is electrically connected to an output of the power amplifier. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: October 2, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hardik Bhupendra Modi, Sandra Louise Petty-Weeks, Hongxiao Shao, Weimin Sun, Peter J. Zampardi, Jr., Guohao Zhang
  • Patent number: 10061885
    Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of a radio frequency (RF) isolation structure of a packaged module and forming the resulting RF isolation structures. Based on electromagnetic interference data for a module, an area of the module that is less sensitive to external radiation is identified. A racetrack layout can be determined based on identifying the area that is less sensitive to external radiation. The racetrack layout can include a narrowed section in the area that is less sensitive to external radiation or a break in the area that is less sensitive to external radiation.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: August 28, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
  • Patent number: 10041987
    Abstract: Disclosed are systems, devices and methods related to miniature probes that can be utilized for electrical and/or magnetic field strength measurements for areas that are smaller than an area of a radio-frequency (RF) module. In some embodiments, an electrical probe can be configured to include an unshielded inner conductor at an end of a coaxial assembly to allow an electrical field to induce differential-mode currents in the coaxial assembly. In some embodiments, a magnetic probe can be configured to include a loop connected to inner and outer conductors of a coaxial assembly to induce a common mode current by a change in magnetic field flux through the loop. In some implementations, such probes can be utilized to obtain near-field measurements to facilitate applications such as electromagnetic (EM) shielding designs.
    Type: Grant
    Filed: September 7, 2013
    Date of Patent: August 7, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Dinhphuoc Vu Hoang, Guohao Zhang
  • Publication number: 20180138574
    Abstract: A coupler is presented that has high-directivity and low coupling coefficient variation. The coupler includes a first trace with a first edge substantially parallel to a second edge and substantially equal in length to the second edge. The first trace includes a third edge substantially parallel to a fourth edge. The fourth edge is divided into three segments. The outer segments are a first distance from the third edge. The middle segment is a second distance from the third edge. Further, the coupler includes a second trace, which includes a first edge substantially parallel to a second edge and substantially equal in length to the second edge. The second trace includes a third edge substantially parallel to a fourth edge. The fourth edge is divided into three segments. The outer segments are a first distance from the third edge. The middle segment is a second distance from the third edge.
    Type: Application
    Filed: October 17, 2017
    Publication date: May 17, 2018
    Inventors: Yang Li, Xuanang Zhu, Dinhphuoc Vu Hoang, Guohao Zhang, Russ Alan Reisner, Dmitri Prikhodko, Jiunn-Sheng Guo, Bradley David Scoles, David Viveiros, JR.
  • Patent number: 9895690
    Abstract: Provided is a microfluidic chip, which comprises a substrate and a cover sheet, wherein a microreactor array is arranged on the substrate and comprises at least one main channel (401) and at least two micro cells (402) connected to the main channel (401). The microfluidic chip also comprises at least one local temperature control device, which is used for heating the main channel (401) or cooling the micro cells (402). The use of the microfluidic chip ensures uniformity and independency of the micro cells (402). Also provided is an application of the microfluidic chip in biological detection or medical inspection.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: February 20, 2018
    Assignees: Capitalbio Corporation, Tsinghua University
    Inventors: Guohao Zhang, Guoliang Huang, Can Wang, Su Guo, Lei Wang, Wanli Xing, Jing Cheng
  • Patent number: 9887668
    Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier configured to amplify a radio frequency (RF) signal and an RF transmission line electrically coupled to an output of the power amplifier. The power amplifier includes a heterojunction bipolar transistor and a p-type field effect transistor, in which a semiconductor portion of the p-type field effect transistor corresponds to a channel includes the same type of semiconductor material as a collector layer of the heterojunction bipolar transistor. The RF transmission line includes a nickel layer with a thickness that is less than 0.5 um, a conductive layer under the nickel layer, a palladium layer over the nickel layer, and a gold layer over the palladium layer. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: February 6, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Peter J. Zampardi, Jr., Hsiang-Chih Sun, Sandra Louise Petty-Weeks, Guohao Zhang, Hardik Bhupendra Modi
  • Patent number: 9876471
    Abstract: Apparatus and methods for phase compensation in power amplifiers are disclosed herein. In certain implementations, a method of phase compensation in a power amplifier includes amplifying a radio frequency signal using a power amplifier that includes an input stage and an output stage, powering a bipolar transistor of the output stage using a power amplifier supply voltage, changing a voltage level of the power amplifier supply voltage, the bipolar transistor having an input reactance that changes in response to the change in the voltage level of the power amplifier supply voltage, and compensating for a variation in a phase delay of the power amplifier arising from the change in the input reactance of the bipolar transistor using a compensation circuit that is electrically connected to an output of the input stage.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: January 23, 2018
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Hardik Bhupendra Modi, Sabah Khesbak, Guohao Zhang
  • Patent number: 9871599
    Abstract: Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: January 16, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
  • Patent number: 9847755
    Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier configured to provide a radio frequency signal at an output, an output matching network coupled to the output of the power amplifier and configured to provide impedance matching at a fundamental frequency of the radio frequency signal, and a harmonic termination circuit coupled to the output of the power amplifier. The power amplifier is included on a power amplifier die. The output matching network can include a first circuit element electrically connected to an output of the power amplifier by way of a pad on a top surface of a conductive trace, in which the top surface has an unplated portion between the pad the power amplifier die. The harmonic termination circuit can include a second circuit element. The first and second circuit elements can have separate electrical connections to the power amplifier die. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: December 19, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Weimin Sun, Peter J. Zampardi, Jr., Hongxiao Shao, Guohao Zhang, Hardik Bhupendra Modi, Dinhphuoc Vu Hoang
  • Publication number: 20170337317
    Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.
    Type: Application
    Filed: June 6, 2017
    Publication date: November 23, 2017
    Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
  • Patent number: 9806395
    Abstract: A coupler is presented that has high-directivity and low coupling coefficient variation. The coupler includes a first trace with a first edge substantially parallel to a second edge and substantially equal in length to the second edge. The first trace includes a third edge substantially parallel to a fourth edge. The fourth edge is divided into three segments. The outer segments are a first distance from the third edge. The middle segment is a second distance from the third edge. Further, the coupler includes a second trace, which includes a first edge substantially parallel to a second edge and substantially equal in length to the second edge. The second trace includes a third edge substantially parallel to a fourth edge. The fourth edge is divided into three segments. The outer segments are a first distance from the third edge. The middle segment is a second distance from the third edge.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: October 31, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yang Li, Xuanang Zhu, Dinhphuoc Vu Hoang, Guohao Zhang, Russ Alan Reisner, Dmitri Prikhodko, Jiunn-Sheng Guo, Bradley David Scoles, David Viveiros, Jr.
  • Publication number: 20170301647
    Abstract: This disclosure relates to a radio frequency (RF) transmission line for high performance RF applications. The RF transmission line includes a conductive layer and finish plating on the conductive layer. The finish plating includes a gold layer, a palladium layer proximate the gold layer, and a nickel layer proximate the palladium layer. The nickel layer has a thickness that allows a radio frequency signal received at the gold layer to penetrate the nickel layer and propagate in the conductive layer.
    Type: Application
    Filed: May 11, 2017
    Publication date: October 19, 2017
    Inventors: Sandra Louise Petty-Weeks, Guohao Zhang, Hardik Bhupendra Modi
  • Publication number: 20170271301
    Abstract: This disclosure relates to a radio frequency (RF) transmission line for high performance RF applications. The RF transmission line includes a bonding layer having a bonding surface and configured to receive an RF signal, a barrier layer proximate the bonding layer, a diffusion barrier layer proximate the bonding layer and configured to prevent contaminant from entering the bonding layer, and a conductive layer proximate the diffusion barrier layer. The diffusion barrier layer has a thickness that allows the received RF signal to penetrate the diffusion barrier layer to the conductive layer. The diffusion barrier layer can be a nickel layer.
    Type: Application
    Filed: May 11, 2017
    Publication date: September 21, 2017
    Inventors: Sandra Louise Petty-Weeks, Guohao Zhang, Hardik Bhupendra Modi
  • Publication number: 20170271303
    Abstract: This disclosure relates to a diffusion barrier layer for a radio frequency (RF) transmission line. The diffusion barrier layer includes a material and has a thickness. The thickness of the diffusion barrier layer is sufficiently small such that an RF signal is allowed to penetrate the diffusion barrier layer. Related RF modules and mobile devices that include an RF transmission line with such a diffusion barrier layer are disclosed.
    Type: Application
    Filed: May 11, 2017
    Publication date: September 21, 2017
    Inventors: Sandra Louise Petty-Weeks, Guohao Zhang, Hardik Bhupendra Modi
  • Publication number: 20170271302
    Abstract: This disclosure relates to a mobile device with a transmission line for a radio frequency (RF) signal. The transmission line includes a bonding layer having a bonding surface, a barrier layer proximate the bonding layer, a diffusion barrier layer proximate the barrier layer, and a conductive layer proximate the diffusion barrier layer. The barrier layer and the diffusion barrier layer are configured to prevent conductive material from the conductive layer from entering the bonding layer. The diffusion barrier layer has a thickness sufficiently small such that a radio frequency signal is allowed to penetrate the diffusion barrier layer and propagate in the conductive layer.
    Type: Application
    Filed: May 11, 2017
    Publication date: September 21, 2017
    Inventors: Sandra Louise Petty-Weeks, Guohao Zhang, Hardik Bhupendra Modi
  • Publication number: 20170257070
    Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier die, a first bonding pad on a conductive trace, and a second bonding pad on a conductive trace. The die includes an on-die passive device and a power amplifier. The first bonding pad is electrically connected to the on-die passive device by a first wire bond. The second bonding pad is in a conductive path between the first bonding pad and a radio frequency output of the power amplifier module. The second bonding pad includes a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer and bonded to a second wire bond that is electrically connected to an output of the power amplifier. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Application
    Filed: April 7, 2017
    Publication date: September 7, 2017
    Inventors: Hardik Bhupendra Modi, Sandra Louise Petty-Weeks, Hongxiao Shao, Weimin Sun, Peter J. Zampardi, JR., Guohao Zhang
  • Patent number: 9703913
    Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. The racetrack layout can be determined based on identifying low radiating areas of a module and/or areas of a module that are less sensitive to external radiation. The racetrack can be disposed below a surface of a module on which a radio frequency component is disposed. The racetrack and a conductive layer over the radio frequency component can form part of a radio frequency isolation structure around the RF component.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: July 11, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
  • Patent number: 9692357
    Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier die including a power amplifier configured to amplify a radio frequency (RF) signal, the power amplifier including a heterojunction bipolar transistor (HBT) and a p-type field effect transistor (PFET), the PFET including a semiconductor segment that includes substantially the same material as a layer of a collector of the HBT, the semiconductor segment corresponding to a channel of the PFET; a load line electrically connected to an output of the power amplifier and configured to provide impedance matching at a fundamental frequency of the RF signal; and a harmonic termination circuit electrically connected to the output of the power amplifier and configured to terminate at a phase corresponding to a harmonic frequency of the RF signal. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: June 27, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Dinhphuoc Vu Hoang, Hardik Bhupendra Modi, Hsiang-Chih Sun, Peter J. Zampardi, Jr., Guohao Zhang
  • Patent number: 9679869
    Abstract: This disclosure relates to a transmission line for high performance radio frequency (RF) applications. One such transmission line can include a bonding layer configured to receive an RF signal, a barrier layer, a diffusion barrier layer, and a conductive layer proximate to the diffusion barrier layer. The diffusion barrier layer can have a thickness that allows a received RF signal to penetrate the diffusion barrier layer to the conductive layer. In certain implementations, the diffusion barrier layer can be nickel. In some of these implementations, the transmission line can include a gold bonding layer, a palladium barrier layer, and a nickel diffusion barrier layer.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: June 13, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Sandra Louise Petty-Weeks, Guohao Zhang, Hardik Bhupendra Modi