Patents by Inventor Guoqiang (David) Zhang

Guoqiang (David) Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6179950
    Abstract: A process for joining together a first polishing pad with a second polishing pad to form a larger pad for a machine that performs chemical-mechanical polishing of silicon wafers. The process includes laying a first polishing pad on a surface and laying a second pad on the surface so that a portion of the second pad overlies a portion of the first pad, creating an overlap region. The first and second pads in the overlap region are cut through to form a first cut edge on the first pad and a second cut edge on the second pad, the first and second cut edges having shapes which are complementary. The first and second cut edges are brought into engagement, and the first pad is joined to the second pad at the first and second cut edges.
    Type: Grant
    Filed: February 18, 1999
    Date of Patent: January 30, 2001
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Guoqiang (David) Zhang, Ralph V. Vogelgesang, Gregory Potts, Henry F. Erk