Abstract: The disclosed method includes acquiring sample models and marking sample feature points; selecting target feature points and regional points on bones; transforming the target feature points and the regional points, and registering the target feature points with the sample feature points; formulating a strategy for assigning impact factors to the sample models, linearly combining all sample models to construct an initial model, and determining initial feature points corresponding to the target feature points in the initial model; adjusting the strategy according to the distance between initial feature points and the target feature points, selecting the strategy corresponding to the minimum distance as an optimal strategy, and determining an optimal initial model; determining a matching point corresponding to each regional point in the optimal initial model, and calculating a transformation relationship; and transmitting all points of the optimal initial model according to the transformation relationship to obt

Abstract: The disclosed method includes acquiring sample models and marking sample feature points; selecting target feature points and regional points on bones; transforming the target feature points and the regional points, and registering the target feature points with the sample feature points; formulating a strategy for assigning impact factors to the sample models, linearly combining all sample models to construct an initial model, and determining initial feature points corresponding to the target feature points in the initial model; adjusting the strategy according to the distance between initial feature points and the target feature points, selecting the strategy corresponding to the minimum distance as an optimal strategy, and determining an optimal initial model; determining a matching point corresponding to each regional point in the optimal initial model, and calculating a transformation relationship; and transmitting all points of the optimal initial model according to the transformation relationship to obt

Abstract: The present disclosure provides a semiconductor packaging method and a semiconductor package device. The method includes providing a chip, where the chip includes a chip substrate having a front surface and a back surface; soldering pads; a metal part formed on a side of each soldering pad facing away from the chip substrate; and a transparent protective layer formed on the front surface of the chip substrate. The transparent protective layer covers a photosensitive region of the chip substrate and the metal part, and the transparent protective layer contains an opening at a position corresponding to the metal part to expose a first end of the metal part away from the soldering pads. The method further includes electrically connecting the first end of the metal part to a circuit board using a conductive connection part to electrically connect the chip with the circuit board.

Abstract: A semiconductor packaging method and a semiconductor package device are provided. The packaging method includes providing a chip. The chip includes a chip substrate having a front surface and a back surface, where the front surface includes a photosensitive region; pads disposed at the front surface of the chip substrate and around the photosensitive region; and a transparent protection layer over the front surface of the chip substrate, where the transparent protection layer covers the photosensitive region and the pad. The packaging method also includes forming through-holes in the chip substrate at positions corresponding to the pads from the back surface of the chip substrate, where the pads one-to-one correspond to the through-holes and are exposed from the through-holes. Further, the packaging method includes electrically connecting each pad of the chip to a circuit board through a metal rewiring layer in a corresponding through-hole.

Abstract: The present disclosure provides a semiconductor packaging method and a semiconductor package device. The method includes providing a chip, where the chip includes a chip substrate having a front surface and a back surface; soldering pads disposed at the front surface of a chip substrate surrounding the photosensitive region; a metal part formed on a side of each soldering pad facing away from the chip substrate; and a transparent protective layer formed on the front surface of the chip substrate. A first end of the metal part away from a corresponding soldering pad is in coplanar with the transparent protective layer; and the first end of the metal part is not covered by the transparent protective layer. The method further includes electrically connecting the first end of the metal part to a circuit board using a conductive connection part to electrically connect the chip with the circuit board.

Abstract: A multi-chip packaging method includes: flip-mounting a first chip on a substrate on which first metal posts are arranged; mold packaging the first metal posts and the first chip to obtain a first package; forming a first redistribution layer on the surface of the first package; flip-mounting a second chip on a surface of the first redistribution layer and mold packaging the second chip to obtain a second package; removing the substrate and forming a second redistribution layer on a surface of the first package; forming second metal posts spaced apart from each other and flip-mounting a third chip on a surface of the second redistribution layer, and mold packaging the third chip and the second metal posts to obtain a third package; forming solder balls on a surface of the third package, where the solder balls are electrically connected to the second redistribution layer through the second metal posts.

Abstract: The present disclosure provides a semiconductor packaging method and a semiconductor package device. The semiconductor packaging method includes providing a chip, where the chip includes a chip substrate having a front surface and a back surface, where the front surface includes a photosensitive region; soldering pads disposed at the front surface of the chip substrate surrounding the photosensitive region; a metal part formed on a side of each soldering pad facing away from the chip substrate; and a transparent protective layer formed on the front surface of the chip substrate, where a first end of the metal part is exposed by protruding over a surface of the transparent protective layer. The method further includes electrically connecting the first end of the metal part to a circuit board using a conductive connection part, such that the chip is electrically connected to the circuit board.

Abstract: A semiconductor packaging method and a semiconductor package device are provided. The packaging method includes providing a chip. The chip includes a chip substrate having a front surface and a back surface, where the front surface includes a photosensitive region; a plurality of pads disposed at the front surface of the chip substrate and around the photosensitive region, where the chip substrate contains a through-hole formed from the back surface of the chip substrate, and the plurality of pads are exposed from the through-hole; and a transparent protection layer over the front surface of the chip substrate, where the transparent protection layer covers the photosensitive region and the plurality of pads. The packaging method also includes electrically connecting each pad of the plurality of pads to a circuit board through a corresponding metal rewiring layer in the through-hole.

Abstract: A method for recycling waste polyester, in particular to a method for recycling waste polyester by a modified alcoholysis method to recycle waste polyester to prepare dimethyl terephthalate (DMT), is provided and belongs to waste polyester recycling technology field. The waste polyester after dewatering and deoxygenation treatment is used as a raw material, in the step of feeding in melted state the alcoholysis agent is added in the melted waste polyester for preliminary alcoholysis, and the alcoholysis agent is ethylene glycol. On one hand, alcoholysis reaction occurs when the waste polyester raw material are melted, and at the same time, the viscosity of the melted material is reduced. Thus, the melted material remains melted at the alcoholysis temperature and is not easy to solidify again after entering the alcoholysis tank, ensuring that the alcoholysis is carried out under homogeneous conditions.

Abstract: The invention present invention belongs to waste polyester recycling technology field and relates to a method and a device for recycling waste polyester, in particular to a method and a device for recycling waste polyester by modified chemical method to recover waste polyester to prepare dimethyl terephthalate (DMT). The recycling method of the present invention uses a process of continuous feeding, continuous alcoholysis and continuous transesterification. It can make the material undergo homogeneous alcoholysis in the melted state, and the required alcoholysis time is short. Because more than two alcoholysis tanks are used in series for continuous alcoholysis, the product quality of alcoholysis product is stable. When the alcoholysis product is continuously transesterified, it avoids the occurrence of side reactions and the unstable quality of the transesterified product, and the purity and yield of recycling product of waste polyester are greatly improved.

Abstract: The present invention is in related to a method for recycling a waste polyester material, more particularly to a method for recycling the waste polyester material through a chemical way to produce DMT. It belongs to the technical field of recycling and utilization of waste polyester materials. The present invention adopts the technology of continuous feeding and continuous alcoholysis, so that the material undergoes homogeneous alcoholysis in a melting state, and the required alcoholysis time is short. Two or more alcoholysis tanks are used in series for continuous alcoholysis. The product quality is stable. At the same time, due to the optimization of the amount of EG in the alcoholysis process, distillation and concentration are not required after the alcoholysis step is completed. The alcoholysis product is directly entered into the transesterification tank for the transesterification reaction, and pure DMT products can then be generated.

Abstract: The present disclosure provides a semiconductor packaging method and a semiconductor package device. The method includes providing a chip, where the chip includes a chip substrate having a front surface and a back surface; soldering pads; a metal part formed on a side of each soldering pad facing away from the chip substrate; and a transparent protective layer formed on the front surface of the chip substrate. The transparent protective layer covers a photosensitive region of the chip substrate and the metal part, and the transparent protective layer contains an opening at a position corresponding to the metal part to expose a first end of the metal part away from the soldering pads. The method further includes electrically connecting the first end of the metal part to a circuit board using a conductive connection part to electrically connect the chip with the circuit board.

Abstract: A semiconductor packaging method and a semiconductor package device are provided. The packaging method includes providing a chip. The chip includes a chip substrate having a front surface and a back surface, where the front surface includes a photosensitive region; a plurality of pads disposed at the front surface of the chip substrate and around the photosensitive region, where the chip substrate contains a through-hole formed from the back surface of the chip substrate, and the plurality of pads are exposed from the through-hole; and a transparent protection layer over the front surface of the chip substrate, where the transparent protection layer covers the photosensitive region and the plurality of pads. The packaging method also includes electrically connecting each pad of the plurality of pads to a circuit board through a corresponding metal rewiring layer in the through-hole.

Abstract: The present disclosure provides a semiconductor packaging method and a semiconductor package device. The method includes providing a chip, where the chip includes a chip substrate having a front surface and a back surface; soldering pads disposed at the front surface of a chip substrate surrounding the photosensitive region; a metal part formed on a side of each soldering pad facing away from the chip substrate; and a transparent protective layer formed on the front surface of the chip substrate. A first end of the metal part away from a corresponding soldering pad is in coplanar with the transparent protective layer; and the first end of the metal part is not covered by the transparent protective layer. The method further includes electrically connecting the first end of the metal part to a circuit board using a conductive connection part to electrically connect the chip with the circuit board.

Abstract: A semiconductor packaging method and a semiconductor package device are provided. The packaging method includes providing a chip. The chip includes a chip substrate having a front surface and a back surface, where the front surface includes a photosensitive region; pads disposed at the front surface of the chip substrate and around the photosensitive region; and a transparent protection layer over the front surface of the chip substrate, where the transparent protection layer covers the photosensitive region and the pad. The packaging method also includes forming through-holes in the chip substrate at positions corresponding to the pads from the back surface of the chip substrate, where the pads one-to-one correspond to the through-holes and are exposed from the through-holes. Further, the packaging method includes electrically connecting each pad of the chip to a circuit board through a metal rewiring layer in a corresponding through-hole.

Abstract: The present disclosure provides a semiconductor packaging method and a semiconductor package device. The semiconductor packaging method includes providing a chip, where the chip includes a chip substrate having a front surface and a back surface, where the front surface includes a photosensitive region; soldering pads disposed at the front surface of the chip substrate surrounding the photosensitive region; a metal part formed on a side of each soldering pad facing away from the chip substrate; and a transparent protective layer formed on the front surface of the chip substrate, where a first end of the metal part is exposed by protruding over a surface of the transparent protective layer. The method further includes electrically connecting the first end of the metal part to a circuit board using a conductive connection part, such that the chip is electrically connected to the circuit board.

Abstract: The present invention is in related to a method for recycling a waste polyester material, more particularly to a method for recycling the waste polyester material through a chemical way to produce DMT. It belongs to the technical field of recycling and utilization of waste polyester materials. The present invention adopts the technology of continuous feeding and continuous alcoholysis, so that the material undergoes homogeneous alcoholysis in a melting state, and the required alcoholysis time is short. Two or more alcoholysis tanks are used in series for continuous alcoholysis. The product quality is stable. At the same time, due to the optimization of the amount of EG in the alcoholysis process, distillation and concentration are not required after the alcoholysis step is completed. The alcoholysis product is directly entered into the transesterification tank for the transesterification reaction, and pure DMT products can then be generated.

Abstract: A method for recycling waste polyester, in particular to a method for recycling waste polyester by a modified alcoholysis method to recycle waste polyester to prepare dimethyl terephthalate (DMT), is provided and belongs to waste polyester recycling technology field. The waste polyester after dewatering and deoxygenation treatment is used as a raw material, in the step of feeding in melted state the alcoholysis agent is added in the melted waste polyester for preliminary alcoholysis, and the alcoholysis agent is ethylene glycol. On one hand, alcoholysis reaction occurs when the waste polyester raw material are melted, and at the same time, the viscosity of the melted material is reduced. Thus, the melted material remains melted at the alcoholysis temperature and is not easy to solidify again after entering the alcoholysis tank, ensuring that the alcoholysis is carried out under homogeneous conditions.

Abstract: The invention present invention belongs to waste polyester recycling technology field and relates to a method and a device for recycling waste polyester, in particular to a method and a device for recycling waste polyester by modified chemical method to recover waste polyester to prepare dimethyl terephthalate (DMT). The recycling method of the present invention uses a process of continuous feeding, continuous alcoholysis and continuous transesterification. It can make the material undergo homogeneous alcoholysis in the melted state, and the required alcoholysis time is short. Because more than two alcoholysis tanks are used in series for continuous alcoholysis, the product quality of alcoholysis product is stable. When the alcoholysis product is continuously transesterified, it avoids the occurrence of side reactions and the unstable quality of the transesterified product, and the purity and yield of recycling product of waste polyester are greatly improved.

Abstract: Methods and compositions are described for stimulating therapeutic points of a mammal subject by applying therapeutically effective amount of one or more TRP channel agonists.