Patents by Inventor Guoqing Yu

Guoqing Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer Level Chip Size Packaged Chip Device With An N-Shape Junction Inside And Method Of Fabricating The Same
    Publication number: 20080111228
    Abstract: The present invention provide a wafer level chip size packaged chip device with a N-shape junction at which external leads electrically connect to peripheral arrayed compatible pads and a method of fabricating the same. In the wafer level chip size package, with such an n-shape junction instead of a conventional T-shape junction observed in Shellcase type wafer level chip size package technology, electrical connections between compatible pads and external leads are more reliable due to larger connection area than the counterpart in the T-shape junction.
    Type: Application
    Filed: November 13, 2006
    Publication date: May 15, 2008
    Applicant: China Wafer Level CSP Ltd.
    Inventors: Guoqing Yu, Youjun Wang, Qinqin Xu, Qingwei Wang, Wei Wang