Abstract: A light-emitting module that includes a light source and an optical lens is provided. The light source emits an original beam along a direction of a light-emitting axis, and the optical lens is disposed on a transmission path of the original beam. The original beam passes the optical lens and becomes an illumination beam. A light shape of the illumination beam has a first full width at half maximum (FWHM) along a first direction and has a second FWHM along a second direction, and a ratio of the second FWHM to the first FWHM is large than 3. The first direction and the second direction are perpendicular to the direction of the light-emitting axis. A light-emitting device is also provided.

Abstract: An optical assembly that is adapted to be located at a light path of light emitted from at least one light source and spaced apart from the at least one light source by a distance is provided. The optical assembly includes a wavelength converting device, which is a spatial structure, and a reflector. The reflector covers a portion of the wavelength converting device and exposes at least a portion of a region of at least one surface of the wavelength converting device. The light emitted from the at least one light source enters or leaves the wavelength converting device from at least the portion of area which is not covered by the reflector. An optical module including the light source and the optical assembly is further provided.

Abstract: A light-emitting module that includes a light source and an optical lens is provided. The light source emits an original beam along a direction of a light-emitting axis, and the optical lens is disposed on a transmission path of the original beam. The original beam passes the optical lens and becomes an illumination beam. A light shape of the illumination beam has a first full width at half maximum (FWHM) along a first direction and has a second FWHM along a second direction, and a ratio of the second FWHM to the first FWHM is large than 3. The first direction and the second direction are perpendicular to the direction of the light-emitting axis. A light-emitting device is also provided.

Abstract: An optical module including a reflecting component, a plurality of first light sources and a wavelength conversion body is provided. The reflecting component has a main axis and a focal point located on the main axis. The first light sources are located at one side of the reflecting component and each of the first light sources emits a first light parallel to the main axis towards the reflecting component. The wavelength conversion body is disposed on the focal point, wherein the first lights are reflected to the focal point via the reflecting component and a part of the first lights are converted to a second light via the wavelength conversion body. The second light and another part of the first lights are projected to the reflecting component and form a light beam parallel to the main axis via reflection by the reflecting component.

Abstract: An optical module includes a first light source, a second light source and a wavelength conversion member. The first light source and the second light source emit light with different colors. The first light source and the second light source have a first light axis and a second light axis, respectively, and there is an intersection point of the first light axis and the second light axis. The wavelength conversion member is disposed at the intersection point of the first light axis and the second light axis.

Abstract: An optical module including a light source, an adjustable reflector and a wavelength conversion set is provided. The adjustable reflector is disposed in a light path of light emitted from the light source and adaptable to adjust between a first position and a second position. The wavelength conversion set includes a first wavelength conversion member and a second wavelength conversion member. When the adjustable reflector is at the first position, light emitted from the light source is reflected to the first wavelength conversion member by the adjustable reflector. When the adjustable reflector is at the second position, light emitted from the light source is reflected to the second wavelength conversion member by the adjustable reflector.

Abstract: A method of forming a layer of glue on a work piece includes: spraying the glue on the work piece; obtaining specification data of the glue by measuring a weight of the glue being sprayed on the work piece; and adjusting the spraying amount of the glue in real time according to the specification data of the glue.

Abstract: A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.

Abstract: A light-emitting module including a light emitting component, a heat dissipation element, and a light-converting component is provided. The light-emitting component is adapted to emit a light beam. The heat dissipation element is disposed at one side of the light-emitting component, wherein the heat dissipation element has a light through hole and the light through hole is located at a transmission path of the light beam. The light-converting component is connected to the heat dissipation element and covers the light through hole.

Abstract: An optical module including at least one light source, a wavelength conversion member and a concave reflector is provided. Light emitted from the at least one light source enters the wavelength conversion member and then is sent out toward all directions. The concave reflector is disposed at one side of the wavelength conversion member, and a part of the light sent from the wavelength conversion member is reflected by the concave reflector.

Abstract: An optical assembly that is adapted to be located at a light path of light emitted from at least one light source and spaced apart from the at least one light source by a distance is provided. The optical assembly includes a wavelength converting device, which is a spatial structure, and a reflector. The reflector covers a portion of the wavelength converting device and exposes at least a portion of a region of at least one surface of the wavelength converting device. The light emitted from the at least one light source enters or leaves the wavelength converting device from at least the portion of area which is not covered by the reflector. An optical module including the light source and the optical assembly is further provided.

Abstract: A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.

Abstract: A package material for packaging a photoelectric device includes a first molding portion and a second molding portion. The first molding portion is disposed on the photoelectric device. The first molding portion includes a first molding compound and a plurality of nano-scale metal oxide particles, wherein the nano-scale metal oxide particles are doped in the first molding compound. The second molding portion is disposed on the first molding portion and away from the photoelectric device. The second molding portion includes a second molding compound and a plurality of submicron-scale metal oxide particles, wherein the submicron-scale metal oxide particles are doped in the second molding compound. A whole refractive index of the first molding portion is larger than a whole refractive index of the second molding portion.

Abstract: An inspection apparatus is capable of inspecting a light-emitting diode (LED). The inspection apparatus includes a reflecting cover, a base plate, a light-collecting unit and at least one inspection light source. An enclosed space is defined by the base plate and the reflecting cover having an opening. The LED is disposed on the base plate and located in the enclosed space. The light-collecting unit is disposed above the LED and in the enclosed space. A vertical distance from the light-collecting unit to the LED is H, a width of the opening of the reflecting cover is W, and H/W=0.05 to 10. The inspection light source is in the enclosed space. An inspection light emitted from the inspection light source is reflected by the reflecting cover and then emitted into the LED. A dominant wavelength of the inspection light source is smaller than that of the LED.

Abstract: An electronic device including an insulating substrate, a chip and a patterned conductive layer is provided. The insulating substrate has an upper surface and a lower surface opposite to each other. The chip is disposed above the upper surface of the insulating substrate. The patterned conductive layer is disposed between the upper surface of the insulating substrate and the chip. The chip is electrically connected to an external circuit via the patterned conductive layer. Heat generated by the chip is transferred to external surroundings via the patterned conductive layer and the insulating substrate.

Abstract: A wavelength converting structure suitable for covering a carrier carrying at least one light-emitting diode (LED) chip is provided. The wavelength converting structure includes a base film and a fluorescent layer. The base film has a first bending portion and a first flat portion connected to the first bending portion. The first flat portion is disposed on the carrier, and an accommodating space is defined by the first bending portion and the carrier. The LED chip is disposed in the accommodating space. The fluorescent layer is disposed on the base film and has a second bending portion and a second flat portion connected to the second bending portion. The second bending portion is conformal to the first bending portion, and the second flat portion is conformal to the first flat portion.

Abstract: A spray coating apparatus including a containing tank, a spray nozzle, and a detection unit is provided. The containing tank contains a glue. The spray nozzle is connected to the containing tank to spray and coat the glue on a work piece. The detection unit detects specification data of the glue on the work piece.

Abstract: A detection apparatus comprising a chuck, a probe device, a light-sensing device and a light-concentrating unit is disclosed. The chuck bears light-emitting diode chips. The probe device includes two probes and a power supply. The end point of the probes respectively electrically connects with one of the light-emitting diode chips and the power supply to make the light-emitting diode chip emits a plurality of light beams. The light-sensing device is disposed on one side of a light-emitting surface of the light-emitting diode chip so as to receive the light beams emitted by the light-emitting diode chip. The light-concentrating unit is disposed between the light-emitting diode chip and the light-sensing device to concentrate the light beams emitted by the light-emitting diode chip.

Abstract: A splitting apparatus suitable to split a work piece along at least one cutting line formed on the work piece is provided. The splitting apparatus includes a chopper, a detector, a controller and an adjustor. The chopper is disposed above the work piece. The detector is disposed above the work piece for transmitting a signal to the work piece so as to get a specification data of the work piece. The controller connects the detector and receives the specification data and generates an adjustment data. The adjustor connects the controller and the chopper. The adjustor receives the adjustment data and adjusts a parameter data of the chopper according to the adjustment data so that the chopper splits the work piece for once along the cutting line formed on the work piece.

Abstract: A working machine includes a work piece, at least one signal generator and a detector. The signal generator is disposed beside the work piece for transmitting a signal. The detector is disposed beside the work piece so as to detect the signal transmitted by the signal generator and get a location information of the work piece.