WORKING MACHINE
A working machine includes a work piece, at least one signal generator and a detector. The signal generator is disposed beside the work piece for transmitting a signal. The detector is disposed beside the work piece so as to detect the signal transmitted by the signal generator and get a location information of the work piece.
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This application claims the priority benefits of Taiwan application serial no. 101148417, filed on Dec. 19, 2012, and Taiwan application serial no. 102110262, filed on Mar. 22, 2013. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of specification.
BACKGROUND OF THE INVENTION1. Field of the Invention
The invention relates to a working machine, and more particularly to a working machine having a signal generator and a detector.
2. Description of Related Art
During a polishing process of a wafer, the wafer is generally polished in a spinning manner by using a polishing machine. Since it cannot be previously determined whether the polishing machine is in a horizontal status, quality of the polished wafers constantly changes due to uneven polishing or fragmentation. Further, during a cutting process on the wafer, conventionally a plurality of intersected cutting lines is formed on the wafer by a laser beam emitted by a laser head of a laser cutting apparatus on a predetermined cutting path. Accumulated errors caused by tilt angles may occur after using many times (i.e., after the laser head shifts by an excessive distance with respect to an initial location). However, users cannot be informed on whether the laser head is tilted before the laser cutting process is performed. Therefore, a case where the cutting lines formed on the wafer in the subsequent process diverge from a predetermined cutting location may arise accordingly. Moreover, said case may also affect a splitting operation along the cutting lines in subsequent process, such that chips may have a size prone to inconsistency or an irregular edge profile. In some severe cases, devices or circuits on the chips may be damaged, leading to malfunctions of the chips. Accordingly, it is an important subject of how to get a status of the working machine (including polishing machine or laser cutting apparatus) instantly before working with it.
SUMMARY OF THE INVENTIONThe invention directs to a working machine with increased working yield rate.
The working machine of the invention includes a work piece, at least one signal generator and a detector. The signal generator is disposed beside the work piece for transmitting a signal. The detector is disposed beside the work piece so as to detect the signal transmitted by the signal generator and get a location information of the work piece.
In an embodiment of the invention, the work piece includes a laser head and a polishing platform.
In an embodiment of the invention, the signal generator and the detector are disposed at the same side of the work piece.
In an embodiment of the invention, the detector is directly disposed on the work piece.
In an embodiment of the invention, the working machine further includes at least one guide, in which the signal generator, the detector and the guide are disposed at the same side of the work piece, the guide is directly disposed on the work piece and the guide guides the signal transmitted by the signal generator to the detector.
In an embodiment of the invention, the signal generator and the detector are respectively located on two opposite sides of a normal direction of the guide.
In an embodiment of the invention, the guide includes a reflective mirror.
In an embodiment of the invention, the signal generator includes an acoustic wave generator or a light wave generator.
In an embodiment of the invention, the detector includes a matrix detector.
In an embodiment of the invention, the working machine further includes a controller and an adjuster. The controller is connected to the detector to receive the location information and generate an adjusting information. The adjuster is connected to the controller and the work piece, in which the adjuster receives the adjusting information and adjusts the location of the work piece based on the adjusting information.
In an embodiment of the invention, the controller includes a computer.
In an embodiment of the invention, the adjuster includes an actuator.
Based on above, since the working machine of the invention has the signal generator and the detector, the signal transmitted by the signal generator may be detected by the detector, so as to get a location information of the work piece. As a result, it can be instantly informed whether the location of the work piece is tilted before working with the work piece, so as to increase working yield rate of the working machine.
To make the above features and advantages of the invention more comprehensible, several embodiments accompanied with drawings are described in detail as follows.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
More specifically, in the present embodiment, the signal generator 130 is, for example, an acoustic wave generator or a light wave generator. In other words, in case when the signal generator 130 is the acoustic wave generator, the signal transmitted by the signal generator 130 is an acoustic wave signal. On the other hand, in case when the signal generator 130 is the light wave generator, the signal transmitted by the signal generator 130 is a light wave signal. In addition, the detector 140a herein is, for example, a matrix detector, once the detector 140a receives the signal transmitted by the signal generator 130, the location information gotten may be expressed in formation of a matrix. As shown in
Since the working machine 100a of the present embodiment includes the signal generator 130 and the detector 140a, the detector 140a may detect the signal transmitted by the signal generator 130 and get the location information of the work piece 110. Accordingly, it can be instantly informed whether the location of the work piece is tilted before cutting the wafer W, so as to increase working yield rate of the working machine 100a.
It should be noted that the reference numerals and a part of the contents in the previous embodiment are used in the following embodiments, in which identical reference numerals indicate identical or similar components, and repeated description of the same technical contents is omitted. For a detailed description of the omitted parts, reference can be found in the previous embodiment, and no repeated description is contained in the following embodiments.
For instance, in case when the location information is identical to a predetermined location information, the location of work piece 110 is located on a normal direction n of the wafer W as shown in
Since the working machines 100a, 100b and 100c of the present embodiment include the signal generator 130 and the detectors 140a and 140b, the detectors 140a and 140b may detect the signal transmitted by the signal generator 130 and get the location information of the work piece 110. Of course, the signal transmitted by the signal generator 130 may also be guided by the guide 120 to the detectors 140a and 140b, so as to detect the location of the work piece 110. Accordingly, it can be instantly informed whether the location of the work piece 110 is tilted before cutting the wafer W, so as to increase working yield rates of the working machines 100a, 100b and 100c. In addition to the present embodiment, the controller 150 and the adjuster 160 may also be disposed so the controller 150 may receive the location information and generate the adjusting information, and the adjuster 160 may automatically adjust the location of the work piece 110 based on the adjusting information, so as to increase yield rates of the working machines 100a, 100b and 100c.
More specifically, in the present embodiment, the signal generator 230 is, for example, an acoustic wave generator or a light wave generator. In other words, in case when the signal generator 230 is the acoustic wave generator, the signal transmitted by the signal generator 230 is an acoustic wave signal. On the other hand, in case when the signal generator 230 is the light wave generator, the signal transmitted by the signal generator 230 is a light wave signal. In addition, the detector 240a herein is, for example, a matrix detector, once the detector 240a receives the signal transmitted by the signal generator 230, the location information gotten may be expressed in formation of a matrix. As shown in
Since the working machine 200a of the present embodiment includes the signal generator 230 and the detector 240a, the detector 240a may detect the signal transmitted by the signal generator 230 and get the location information of the work piece 210. Accordingly, it can be instantly informed whether the location of the work piece 210 is tilted before performing the polishing process, so as to increase working yield rate (i.e., polishing yield rate) of the working machine 200a.
The signals transmitted by the signal generators 230a and 230b may be guided to the detector 240b through the guide 220a and 220b before performing the polishing process, so as to detect the location of the work piece 210. That is to say, it is instantly informed by the detector 240b whether the work piece 210 is tilted before proceeding to subsequent cutting processes. As a result, working yield rate (i.e., polishing yield rate) of the working machine 200b may be effectively increased.
In view of above, since the working machine of the invention has the signal generator and the detector, the signal transmitted by the signal generator may be detected by the detector, so as to get a location information of the work piece. As a result, it can be instantly informed whether the location of the work piece is tilted before working with the work piece, so as to increase working yield rate of the working machine.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims
1. A working machine, comprising:
- a work piece;
- at least one signal generator disposed beside the work piece for transmitting a signal; and
- a detector disposed beside the work piece so as to detect the signal transmitted by the signal generator and get a location information of the work piece.
2. The working machine as recited in claim 1, wherein the work piece comprises a laser head or a polishing platform.
3. The working machine as recited in claim 2, wherein the signal generator and the detector are disposed at the same side of the work piece.
4. The working machine as recited in claim 3, wherein the detector is directly disposed on the work piece.
5. The working machine as recited in claim 1, further comprising:
- at least one guide, wherein the signal generator, the detector and the guide are disposed at the same side of the work piece, the guide is directly disposed on the work piece, and the guide guides the signal transmitted by the signal generator to the detector.
6. The working machine as recited in claim 5, wherein the signal generator and the detector are respectively located on two opposite sides of a normal direction of the guide.
7. The working machine as recited in claim 5, wherein guide comprises a reflective mirror.
8. The working machine as recited in claim 1, wherein the signal generator comprises an acoustic wave generator or a light wave generator.
9. The working machine as recited in claim 1, wherein the detector comprises a matrix detector.
10. The working machine as recited in claim 1, further comprising:
- a controller connected to the detector to receive the location information and generate an adjusting information; and
- an adjuster connected to the controller and the work piece, wherein the adjuster receives the adjusting information and adjusts a location of the work piece based on the adjusting information.
11. The working machine as recited in claim 10, wherein the controller comprises a computer.
12. The working machine as recited in claim 10, wherein the adjuster comprises an actuator.
Type: Application
Filed: Jun 13, 2013
Publication Date: Jun 19, 2014
Applicant: GENESIS PHOTONICS INC. (Tainan City)
Inventors: Tai-Cheng Tsai (Tainan City), Gwo-Jiun Sheu (Tainan City), Zhe-Long Wang (Tainan City)
Application Number: 13/917,630
International Classification: B24B 49/12 (20060101);