Abstract: A gas-free system for separating a solution of substantially impurity-free daughter products from an associated parent load solution includes a pump, a plurality of multi-port valves, separation medium and a processor. An uncoiled conduit extends between a third port of a second multi-port valve and a first multi-port valve. A processor is operably coupled to a pump, and the plurality of multi-port valves. A method for separating a solution of substantially impurity-free daughter product from an associated parent load solution is also disclosed.

Abstract: A system for generating a timing signal is disclosed. A processor generates a selection command. A clock receives a signal selected in response to the selection command and converts the selected signal to a timing signal. A framing module inserts a phase of the timing signal into a framed signal. A method for generating a timing signal for a telecommunication system is disclosed. A selection command is generated using a processor. A signal is selected in response to the selection command. The selected signal is converted to a timing signal using a clock. A phase of the timing signal is inserted into a framed signal using a framing module.

Abstract: A separation medium, a method for using that separation medium and an apparatus for selectively extracting multivalent cations such as pseudo-lanthanide, prelanthanide, lanthanide, preactinide or actinide cations from an aqueous acidic sample solution is described. The separation medium is preferably free-flowing and comprises particles having a diglycolamide (DGA) extractant dispersed onto an inert, porous support.

Abstract: A multicolumn selectivity inversion generator separation method has been developed in which a desired daughter radionuclide is selectively extracted from a solution of the parent and daughter radionuclides by a primary separation column, stripped, and passed through a second guard column that retains any parent or other daughter impurities, while the desired daughter elutes. This separation method minimizes the effects of radiation damage to the separation material and permits the reliable production of radionuclides of high chemical and radionuclidic purity for use in diagnostic or therapeutic nuclear medicine.

Abstract: A technique for embedding a first clock phase within a second signal is described. In one embodiment, the invention comprises a method of embedding a phase of a first signal within a second signal comprising the steps of monitoring a first signal for a frame event, responsive to detection of a frame event in the first clock signal, determining a position of the frame event relative to a current segment of a second signal, and embedding in the current segment of the second signal a value representative of the relative position of the detected frame event.

Abstract: A multicolumn selectivity inversion generator separation method has been developed in which actinium ions, a desired daughter radionuclide, are selectively extracted from a solution of the thorium parent and daughter radionuclides by a primary separation column, stripped, and passed through a second guard column that retains any parent or other daughter interferents, while the desired daughter actinium ions and radium ions elute. This separation method minimizes the effects of radiation damage to the separation material and permits the reliable production of radionuclides of high chemical and radionuclidic purity for use in diagnostic or therapeutic nuclear medicine.

Abstract: A gas-free system for separating a solution of substantially impurity-free daughter products from an associated parent load solution includes a pump, a plurality of multi-port valves, separation medium and a processor. An uncoiled conduit extends between a third port of a second multi-port valve and a first multi-port valve. A processor is operably coupled to a pump, and the plurality of multi-port valves. A method for separating a solution of substantially impurity-free daughter product from an associated parent load solution is also disclosed.

Abstract: A purification method is disclosed for a predetermined water-insoluble extractant present in a liquid phase composition that additionally contains one or more additional extractants, synthesis reaction starting materials, and reaction byproducts dissolved as solutes in an organic diluent. An ion-containing compound is admixed with the composition to form an extractant/ion complex in the organic diluent phase that has an affinity for a new phase that is greater than the affinity for the first-named phase. The predetermined extractant/ion complex is separated from the diluent by using the new phase affinity, and the extractant/ion complex is preferably although not necessarily recovered. The extractant/ion complex is separated into extractant and ion. The extractant is recovered. Exemplary extractants include polyethers, crown ethers, crown thioethers, calixarenes, polyamines, cryptands, porphyrins and the like.

Abstract: A multicolumn selectivity inversion generator has been developed in which bismuth-213 is selectively extracted from an HCl solution of the actinium-225 parent (and its radiogenic descendents) by a primary separation column containing a separation medium containing a neutral oxygenated organophosphorus extractant. After rinsing with dilute HCl, the bismuth-213 is stripped with a buffered NaCl solution. The stripped solution is passed through a cation-exchange resin guard column that retains the actinium-225 and radium-225 contaminants while the bismuth-213 elutes. This generator method minimizes the unpredictable effects of radiation damage to the support material and permits the reliable production of bismuth-213 of high chemical and radionuclidic purity.

Abstract: A modular integrated circuit package is mounted on a surface of a printed circuit board. The integrated circuit package includes a rigid interposer releasably coupling a component module to a substrate member designed to be affixed to the printed circuit board. The substrate member has a first side with plural first electrical connectors for connection to the circuit board and a second side with second electrical connectors coupled to the first electrical connectors. The interposer includes a plurality of electrical connectors that couple electrical connectors of the component module to the second electrical connectors of the substrate member. The component module also includes plural clip members that engage a lower surface of the interposer to releasably couple the component module to the interposer.

Abstract: An integrated circuit package with a path of high thermal conductivity is disclosed. A thermally conductive slug, formed of a material such as copper, is attached to an underside portion of a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed. An integrated circuit chip is mounted to one side of the slug exposed in the opening. An opposing surface of the slug lies below the plane of the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to a portion of the underside of the substrate not covered by the slug in a ball-grid-array manner, for mounting to a circuit board. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls.

Abstract: A solid/liquid process for the separation and recovery of chaotropic anions from an aqueous solution is disclosed. The solid support comprises separation particles having surface-bonded poly(ethylene glycol) groups, whereas the aqueous solution from which the chaotropic anions are separated contains a poly(ethylene glycol) liquid/liquid biphase-forming amount of a dissolved salt (lyotrope). A solid/liquid phase admixture of separation particles containing bound chaotropic anions in such an aqueous solution is also contemplated, as is a chromatography apparatus containing that solid/liquid phase admixture.

Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.

Abstract: A solid/liquid phase process for the separation and recovery of an anionic dye from an aqueous solution is disclosed. The solid phase comprises separation particles having surface-bonded poly(ethylene glycol) groups, whereas the aqueous solution from which the anionic dye molecules are separated contains a poly(ethylene glycol) liquid/liquid biphase-forming amount of a dissolved lyotropic salt. After contact between the aqueous solution and separation particles, the anionic dye is bound to the particles. The bound anionic dye molecules are freed from the separation particles by contacting the anionic dye-bound particles with an aqueous solution that does not contain a poly(ethylene glycol) liquid/liquid biphase-forming amount of a dissolved lyotropic salt to form an aqueous anionic dye solution whose anionic dye concentration is preferably higher than that of the initial dye-containing solution.

Abstract: An integrated circuit package with a path of high thermal conductivity is disclosed. A thermally conductive slug, formed of a material such as copper, is attached to an underside portion of a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed. An integrated circuit chip is mounted to one side of the slug exposed in the opening. An opposing surface of the slug lies below the plane of the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to a portion of the underside of the substrate not covered by the slug in a ball-grid-array manner, for mounting to a circuit board. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls.

Abstract: An integrated circuit package with a path of high thermal conductivity is disclosed. The package is formed into a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed to receive a thermally conductive slug, formed of a material such as copper. An integrated circuit chip is mounted to one side of the slug, and the opposing surface of the slug is exposed at the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to the underside of the substrate and of the slug in ball-grid-array fashion, for mounting to a circuit board. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls.

Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.

Abstract: A solid/liquid process for the separation and recovery of TcO.sub.4.sup.-1 ions from an aqueous solution is disclosed. The solid support comprises separation particles having surface-bonded poly(ethylene glycol) groups; whereas the aqueous solution from which the TcO.sub.4.sup.-1 ions are separated contains a poly(ethylene glycol) liquid/liquid biphase-forming amount of a dissolved salt. A solid/liquid phase admixture of separation particles containing bound TcO.sub.4.sup.-1 ions in such an aqueous solution that is free from MoO.sub.4.sup.-2 ions is also contemplated, as is a chromatography apparatus containing that solid/liquid phase admixture.