Abstract: A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.

Abstract: A cross-flow heat exchanger comprising according to a preferred embodiment a shell formed of two concentric cylinders providing an annular space. A number of tubes and baffles are arranged in the annular space such that one fluid flows through the tubes in a helical fashion in the annular space and the second heat exchange fluid flows in a counter helical path in such annular space across the tubes, constrained by the baffles in such annular space. In another embodiment cross-flow is also achieved using spirally shaped tubes and spirally shaped baffles.

Abstract: A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.

Abstract: In a heat exchanger system wherein a primary conditioning fluid is reactive with a fluid to be conditioned, a leak safe arrangement of concentric tubes disposed across the conditioned fluid flow path having the reactive primary fluid in a central duct surrounded by inert fluid in an outer duct so that single failure leak of primary conditioning fluid or inert fluid presents no risk of harmful reaction with conditioned fluid. The heat exchanger system is used in an air collection and enrichment system in a hypersmic vehicle propulsion system.

Abstract: A multipass heat exchanger comprising an arrangement of a plurality of heat exchanger modules, each module having a plurality of passes for passage of a first heat exchange fluid and a plurality of tubes across such passes for passage of a second heat exchange fluid. The heat exchanger modules are disposed in side-by-side relation, with each successive module adjoining the previous module in a stepped relation, the second exchanger module being positioned relative to the first module so that the first heat exchanger fluid leaving the first pass of the first heat exchanger module enters directly the second pass of the second module, and so on, in a straight through fashion, for as many passes as desired. The result is a highly efficient multipass heat exchanger of minimum weight and pressure loss in the flow path on the shell side of the exchanger, comprised of multiple heat exchanger units, with no reversal of flow in each pass in each exchanger unit.

Abstract: A universal nest (1)) for accommodating a separate one of a pair of ribbon connectors (12 and 12') of heights h.sub.1 and h.sub.2, respectively, comprises an elongated beam (26) along which a first block (28) of a height h.sub.1 is slidably mounted. A slide (42) is slidably mounted on the upper surface (34) of the first block (28) for movement between a first position at which it overhangs a portion of the block to expose part of its upper surface, and a second position at which it overlies the upper surface (34). When the slide (42) is at its first position, the upper surface (34) will support an end of the first connector (12). The slide, when displaced to its second position, itself supports an end of the second connector (12'). A second block (60), having a pair of opposed shelves (66 and 68) of a height h.sub.1 and h.sub.2, respectively, is rotatably mounted to the beam (26) distant from the first block (28).

Abstract: An apparatus for inverting and handling integrated circuit dice employs rotating apparatus for rotating a chip carrier by 180 degrees to invert and transfer dice from one set of receptacles to another; together with an apparatus for precisely aligning dice resting at random positions within a set of oversized receptacles.

Abstract: A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.

Abstract: An apparatus for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and then knocks a die down from the array of dice into a receptacle for transport to further processing stages.

Abstract: A method of forming leadframes for use in manufacturing semiconductor chips starts with fabricating a plurality of leadframes by metal stamping or etching leadframe patterns into a flat ribbon of conductive material. The leadframe patterns include a plurality of outwardly radiating leads, inner radiating leads, and a central perimeter for interconnecting the outwardly and inner radiating leads. The outwardly radiating leads are arranged in groups, each of which are directed along planar perpedicular coordinates. The inner radiating leads have 180 degrees turns in the plane of the leadframe. The inner radiating leads are then successively bent at an acute angle and parallel to the plane of said leadframe so that the inner radiating leads are offset from the plane of the leadframe. The bending is performed in such a manner that each of the leads are formed with a stable spring force for effective bonding to corresponding semiconductor chip pads.

Abstract: A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.

Abstract: According to the invention, a sand distribution structure is interposed between a sand supply hopper and a flask having an associated pattern. The sand distribution structure comprises juxtaposed, apertured plates, which are adjustable relative to each other to variably register the apertures in the separate plates. It is possible with variations in the dimensions and locations of the apertures in the plates to choose a desired flow rate and/or selectively disperse the sand over the pattern.

Abstract: An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.

Abstract: A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.

Abstract: A method for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and the knocks a die down from the array of dice into a receptacle for transport to further processing stages.

Abstract: A method for inverting and handling integrated circuit dice employs rotating apparatus for rotating a chip carrier by 180 degrees to invert and transfer dice from one set of receptacles to another; together with an apparatus for precisely aligning dice resting at random positions within a set of oversized receptacles.

Abstract: For transmission of data from the computer to the peripheral, the computer initially clears a flipflop which provides a select signal to a multiplexer. When the computer is ready to provide data to the peripheral, it produces a data available signal or data strobe signal while the data is being provided to the interface. Setting of the flipflop causes a gate connected thereto to provide to the peripheral a signal indicating that the interface has data available for transmission thereto. In response thereto, the peripheral provides an acknowledge or strobe signal to transfer the data to the peripheral. This acknowledge signal is also provided to the gate to shut off the signal being provided to the peripheral. Setting of the flipflop also causes the multiplexer to change state so that it now can multiplex the acknowledge signal to the pulse generator. The pulse generator then resets the flipflop, so that it is now ready for transmission of more data from the computer to the peripheral.

Abstract: A gas mixer and reactor is provided which is especially suitable as a burner which includes an elongated gas flow chamber with a nozzle arrangement at its inlet end for passing a first gaseous reactant into the interior of the chamber toward the outlet from points uniformly about the inner periphery of the chamber, and an annular nozzle arrangement near the outlet of the gas flow chamber for directing another gaseous reactant or reactants through the outlet of the gas flow chamber and into a thermal reaction chamber which communicates with the outlet of the gas flow chamber.

Abstract: A new and distinct variety of Almond Tree which is somewhat remotely similar to the Nonpareil Almond Tree (unpatented) but from which it is distinguished therefrom by producing a crop which is mature for commercial harvesting and shipment approximately Sept. 1 under the ecological conditions prevailing in Hickman, Calif.

Abstract: A new and distinct variety of almond tree denominated varietally as "Cruz" and which is characterized as to novelty by a date of maturity for commercial harvesting and shipment of approximately September 5 under the ecological conditions prevailing at Hickman, Calif., in the Central part of the San Joaquin Valley of Central California.