Patents by Inventor Ha-Jin Kim

Ha-Jin Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10438927
    Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: October 8, 2019
    Assignee: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: Ha Yong Jung, Jae Min Choi, Jae Kul Lee, Dong Jin Kim, Sung Taek Woo, Ji Hye Shim, Woon Ha Choi, Han Sang Cho
  • Patent number: 10411134
    Abstract: A display device includes a gate electrode on a substrate of a semiconductor device, a gate insulating film over the gate electrode, an active layer comprising an oxide including indium, zinc and gallium on the gate insulating film, and overlapping the gate electrode, and a source electrode and a drain electrode that are spaced apart from each other, wherein the active layer is formed from a zinc-rich target material, and an atomic % ratio of indium, zinc and gallium in the active layer is different from an atomic % ratio of the zinc-rich target material.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: September 10, 2019
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Min-Cheol Kim, Youn-Gyoung Chang, Kwon-Shik Park, So-Hyung Lee, Ho-Young Jung, Ha-Jin Yoo, Jeong-Suk Yang
  • Publication number: 20190237375
    Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.
    Type: Application
    Filed: September 17, 2018
    Publication date: August 1, 2019
    Inventors: Ha Yong JUNG, Jae Kul LEE, Ji Hye SHIM, Han Sang CHO, Woon Ha CHOI, Jae Min CHOI, Dong Jin KIM, Sung Taek WOO
  • Publication number: 20190189589
    Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.
    Type: Application
    Filed: May 22, 2018
    Publication date: June 20, 2019
    Inventors: Ha Yong JUNG, Jae Min CHOI, Jae Kul LEE, Dong Jin KIM, Sung Taek WOO, Ji Hye SHIM, Woon Ha CHOI, Han Sang CHO
  • Publication number: 20190189667
    Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.
    Type: Application
    Filed: May 17, 2018
    Publication date: June 20, 2019
    Inventors: Ha Yong JUNG, Jae Kul LEE, Sung Taek WOO, Ji Hye SHIM, Dong Jin KIM, Han Sang CHO, Woon Ha CHOI, Jae Min CHOI
  • Patent number: 10312341
    Abstract: An integrated circuit device includes a first gate stack formed on a first high dielectric layer and comprising a first work function adjustment metal containing structure and a second gate stack formed on a second high dielectric layer and comprising a second work function adjustment metal containing structure having an oxygen content that is greater than that of the first work function adjustment metal containing structure.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: June 4, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ha-jin Lim, Gi-gwan Park, Weon-hong Kim
  • Patent number: 10306004
    Abstract: An electronic device and a method for controlling the electronic device are provided. The electronic device includes a communication interface configured to receive a message, at least one processor configured to determine a notification scheme for outputting the message based on status information about the electronic device and obtain a summary message by converting the message according to the notification scheme, and an output module for outputting the summary message.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: May 28, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hae-Jun Lee, Deok-Ho Kim, Tae-Yeun Yang, Seung-Hak Yu, Ji-Hyun Rho, Ha-Yoon Jung, Ho-Jin Jung
  • Publication number: 20190148683
    Abstract: The present disclosure provides a cylinder type battery cell manufacturing apparatus which is an apparatus configured to form a crimping portion on a cap assembly coupling portion of a cylinder type battery cell, the manufacturing apparatus including: a primary crimping mold configured to apply a primary pressure so that an open upper end portion of a cylinder type metal can forms an inclination inclined to a central axis of the metal can on a vertical section in a state in which a cap assembly is coupled to the open upper portion of the cylinder type metal can; and a secondary crimping mold configured to apply a secondary pressure to the open upper end portion in which the inclination is formed so that a flat section parallel to a lower surface of the metal can is formed in the crimping portion.
    Type: Application
    Filed: November 28, 2017
    Publication date: May 16, 2019
    Applicant: LG Chem, Ltd.
    Inventors: Tae Hyun Kwon, Hae Jin Lim, Hyeon Soo Sim, Ha Young Heo, Joo Hwan Sung, Hyoung Kwon Kim, Duk Hyun Ryu
  • Publication number: 20190124014
    Abstract: Disclosed is a variable-size sampling method under a data-streaming environment, including: calculating a maximum window size that satisfies a lower limitation of a predetermined uniformity confidence level at all times; inputting a data stream to be sampled; comparing a data stream length input until a current time point with the maximum window size; inspecting a sample size and a sampling fraction if the maximum window size is larger than the data stream length; performing sampling by generating a slot to increase the sample size if the current sample size is smaller than a predetermined percentage (P %) of the data stream; and directly performing sampling without generating a slot if the current sample size is equal to or larger than the predetermined percentage (P %) of the data stream. As a result, degradation of uniformity confidence during variable-size sampling under a real-time streaming environment can be prevented to improve sampling performance.
    Type: Application
    Filed: April 17, 2018
    Publication date: April 25, 2019
    Inventors: Ha Jin KIM, Myeong Seon GIL, Yang Sae MOON
  • Publication number: 20180024058
    Abstract: A functional material includes a porous metal-organic framework (MOF) including an organic ligand derived from benzenedicarboxylic acid and a metal ion cluster coordination-bonded with the organic ligand, and a luminescent molecule in pores of the MOF.
    Type: Application
    Filed: July 21, 2017
    Publication date: January 25, 2018
    Applicants: Samsung Electronics Co., Ltd., OXFORD UNIVERSITY INNOVATION LIMITED
    Inventors: Ha Jin KIM, In Taek HAN, Abhijeet K. CHAUDHARI, Jin-Chong TAN
  • Patent number: 9505934
    Abstract: A super-hydrorepellent coating composition including a nano structure, polyorganosiloxane, a cross-linker, and a catalyst; a super-hydrorepellent coating layer including a cured product of the super-hydrorepellent coating composition; and a heat exchanger including the super-hydrorepellent coating layer.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: November 29, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Chul Ko, Woo-Taek Hwang, Ha-Jin Kim, Sang Eui Lee, Nak-Hyun Kim
  • Patent number: 9501013
    Abstract: A heating member for a fusing apparatus includes a resistive heating layer including a base polymer and an electroconductive filler dispersed in the base polymer, where the resistive heating layer generates heat by receiving electric energy, and where a storage modulus of the resistive heating layer is about 1.0 megapascal or greater.
    Type: Grant
    Filed: May 8, 2013
    Date of Patent: November 22, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui Lee, Dong-earn Kim, Dong-ouk Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Yoon-chul Son, Kun-mo Chu, In-Taek Han
  • Patent number: 9348280
    Abstract: A heating composite, including a polymer matrix; and a carbon nanotube structure including a plurality of carbon nanotubes continuously connected to each other and integrated with the polymer matrix.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: May 24, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Eui Lee, In-Taek Han, Yoon-Chul Son, Ha Jin Kim, Dong-Ouk Kim, Dong-Earn Kim, Kun Mo Chu
  • Patent number: 9272902
    Abstract: A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: March 1, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-ouk Kim, Dong-earn Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Yoon-chul Son, Sang-eui Lee, Kun-mo Chu, In-taek Han
  • Patent number: 9165701
    Abstract: A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: October 20, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kun-mo Chu, Dong-earn Kim, Sang-eui Lee, Dong-ouk Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Yoon-chul Son
  • Patent number: 9052655
    Abstract: A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: June 9, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul Son, Dong-earn Kim, Dong-ouk Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Sang-eui Lee, Kun-mo Chu, In-taek Han
  • Patent number: 9037063
    Abstract: A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: May 19, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui Lee, Ha-jin Kim, Dong-earn Kim, Dong-ouk Kim, Sung-hoon Park, Min-jong Bae, Yoon-chul Son, Kun-mo Chu
  • Patent number: 9002253
    Abstract: A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: April 7, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul Son, Dong-earn Kim, Dong-ouk Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Sang-eui Lee, Kun-mo Chu
  • Publication number: 20140205336
    Abstract: A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.
    Type: Application
    Filed: December 2, 2013
    Publication date: July 24, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kun-mo CHU, Dong-earn KIM, Sang-eui LEE, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON
  • Publication number: 20140126940
    Abstract: A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.
    Type: Application
    Filed: May 29, 2013
    Publication date: May 8, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul SON, Dong-earn KIM, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Sang-eui LEE, Kun-mo CHU