Abstract: A unit cell inspecting device includes an inspection unit which captures an image of an edge of a unit cell using long-wave infrared rays and measures a position of an edge of an electrode provided in the unit cell. The inspection unit includes: a main heating part configured to heat the edge of the unit cell, thereby raising a temperature of the edge of the electrode provided in the unit cell; and an image capturing part configured to capture the image of the edge of the unit cell by using the long-wave infrared rays, thereby acquiring a thermal image of the edge of the electrode provided in the unit cell; and an inspection part configured to measure the edge of the electrode in the thermal image captured by the image capturing part, thereby measuring the position of the electrode by using the measured edge of the electrode.

Abstract: A lamination apparatus configured to manufacture an electrode cell assembly may include a lamination part configured to manufacture the electrode cell assembly through lamination, an inspection part configured to detect a defective electrode cell assembly by measuring a thickness of the manufactured electrode cell assembly, a discharge part configured to separate and discharge the defective electrode cell assembly from a normal electrode cell assembly, and a control part configured to perform control so as to calculate a time point at which the defective electrode cell assembly reaches the discharge part on the basis of distance data between a point at which the defective electrode cell assembly is detected and the discharge part and separate and discharge the defective electrode cell assembly when the defective electrode cell assembly reaches the discharge part. A method of discharging a defective electrode cell assembly by the lamination apparatus is also disclosed.

Abstract: A substrate-embedded electronic component includes a first core layer, a first through-portion penetrating the first core layer, a first electronic component disposed in the first through-portion, an encapsulant disposed in at least a portion of the first through-portion, and covering at least a portion of the first electronic component, a second core layer disposed on the encapsulant, and a first through-via penetrating the second core layer, wherein the first through-via is connected to the first electronic component.

Abstract: A capacitor component includes a body including dielectric layers and internal electrodes alternately arranged with the dielectric layers; and external electrodes including electrode layers disposed on the body and connected to the internal electrodes, first conductive resin layers disposed on the electrode layers, and second conductive resin layers disposed on the first conductive resin layers, wherein the first and second conductive resin layers include a metal powder and a base resin, the first conductive resin layers have a lower metal powder content than the second conductive resin layers, the metal powder includes one or more of flake-type powder particle and spherical-type powder particle, and a weight ratio of the flake-type powder particle in the metal powder contained in the first conductive resin layers is 60% or more, and a weight ratio of the spherical-type powder particle in the metal powder contained in the second conductive resin layers is 50% or more.

Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.

Abstract: A capacitor component includes a body including dielectric layers and internal electrodes alternately arranged with the dielectric layers; and external electrodes including electrode layers disposed on the body and connected to the internal electrodes, first conductive resin layers disposed on the electrode layers, and second conductive resin layers disposed on the first conductive resin layers, wherein the first and second conductive resin layers include a metal powder and a base resin, the first conductive resin layers have a lower metal powder content than the second conductive resin layers, the metal powder includes one or more of flake-type powder particle and spherical-type powder particle, and a weight ratio of the flake-type powder particle in the metal powder contained in the first conductive resin layers is 60% or more, and a weight ratio of the spherical-type powder particle in the metal powder contained in the second conductive resin layers is 50% or more.

Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.

Abstract: Disclosed is a lubricating oil composition which includes a diester-based base oil having an asymmetric structure in which the number of carbons of the alkyl chain bound to one ester group with respect to a central atom is two more than that of the alkyl group bound to the other ester group, and which has low viscosity and a comparatively small amount of evaporation at high temperature. When this composition is used for a motor of a small hard disk, power consumption can be reduced and stability at high temperature can be enhanced.

Abstract: There is provided a lubricating oil composition for a hydrodynamic bearing including: 95 to 99 wt % of an ester-based base oil; and 1.0 to 5.0 wt % of mixed oil containing at least two kinds of ester-based oils different from the ester-based base oil. According to the present invention, a hard disk drive (HDD) motor is manufactured using the lubricating oil composition for a hydrodynamic bearing having a low viscosity, a small evaporation loss, and improved oxidation stability at a room temperature, whereby the impact resistance and low-temperature operation stability of the hydrodynamic bearing motor may be improved.

Abstract: There are provided a lubricating oil composition for a fluid dynamic bearing and a motor for a hard disk drive (HDD), the lubricating oil composition including, as a base oil, an aliphatic monocarboxylic acid ester having a total of between 16 to 46 carbon atoms, obtained by an esterification reaction of carboxylic acid represented by Chemical Formula 1 below and a primary or a secondary alcohol having between 8 to 38 carbon atoms, and thus, the motor for an HDD is fabricated using the lubricating oil composition for a fluid dynamic bearing having low viscosity, low evaporation loss, and improved oxidation stability at a practicable temperature, thereby preventing a deterioration in product reliability due to long-time use of the motor.

Abstract: There are provided a lubricating oil composition for a fluid dynamic bearing, and a HDD motor fabricated using the same. The lubricating oil composition includes an ester base oil and 0.01 to 3.00 parts by weight of an additive relative to 100 parts by weight of the base oil and has a density of 0.900 g/cm3 or less at 15° C. and a kinetic viscosity of 9.50 cSt or less at 40° C. According to the present invention, the HDD motor is fabricated by using a lubricating oil composition for a fluid dynamic bearing, the lubricating oil composition having advantages such as low viscosity at practical temperature, reduced evaporation loss and enhanced oxidation stability, thereby improving impact resistance and low temperature operational stability of a fluid dynamic motor.

Abstract: There are provided a lubricating oil composition for a fluid dynamic bearing and a hard disk drive (HDD) motor fabricated using the same. The lubricating oil composition for a fluid dynamic bearing includes: an aliphatic mono carboxylic acid ester, as a base oil, obtained by esterification between alcohol represented by the following Chemical Formula 1; and 2-ethylbutanoic acid: where n indicates an integer of 6 to 20. Therefore, the HDD motor is fabricated by using the lubricating oil composition for a fluid dynamic bearing having low viscosity, low evaporation loss, and improved oxidation stability at room temperature, whereby quality reliability according to the use of the motor for a long period of time may be improved.

Abstract: There are provided a lubricating oil composition for a fluid dynamic bearing and and a hard disk drive (HDD) motor fabricated by using the same. The lubricating oil composition for a fluid dynamic bearing includes: an aliphatic mono carboxylic acid ester, as a base oil, obtained by esterification between carboxylic acid represented by the following Chemical Formula 1; and isopropyl alcohol: where n indicates an integer of 6 to 20. Therefore, the HDD motor is fabricated by using the lubricating oil composition for a fluid dynamic bearing having low viscosity, low evaporation loss, and improved oxidation stability at room temperature, whereby quality reliability according to the use of the motor for a long period of time may be improved.

Abstract: There are provided a lubricating oil composition for a fluid dynamic bearing and a hard disk drive (HDD) motor fabricated by using the same. The lubricating oil composition for a fluid dynamic bearing, includes: aliphatic mono carboxylic acid ester having a total of carbon numbers of 26 to 40, as a base oil, obtained by esterification between alcohol represented by the following Chemical Formula 1; and a straight or branched saturated aliphatic mono carboxylic acid having carbon numbers of 2 to 16: where R1 and R2 indicate straight or branched alkyl groups that are the same or different and have carbon numbers of 1 to 10.

Abstract: There is provided a fluid dynamic bearing oil composition for a hard disk drive motor. The fluid dynamic bearing oil composition includes 0.5 to 1.0 parts by weight of a defoaming agent based on 100 parts by weight of the total composition. The bubbles in the fluid dynamic bearing oil may be removed by adding a small amount of defoaming agent to the fluid dynamic bearing oil composition for a hard disk drive motor.

Abstract: There are provided a hydrodynamic bearing assembly and a method of manufacturing the same. The hydrodynamic bearing assembly includes: a lubricating oil filled so as to form a liquid-vapor interface between stationary members and rotating members; and a lipophilic coating formed on the liquid-vapor interface of the lubricating oil so as to prevent lubricating oil leakage. Therefore, the lipophilic coating is formed on the interface of the lubricating oil and an oil repellent material is formed on a surface of at least one of the stationary members and the rotating members, whereby the scattering and the leakage of the lubricating oil may be effectively prevented.